COOLING DEVICE AND STRUCTURE
    4.
    发明申请

    公开(公告)号:US20220247003A1

    公开(公告)日:2022-08-04

    申请号:US17621034

    申请日:2020-06-12

    Abstract: A cooling device including: a resin flow path which is provided with a space portion serving as a flow path in at least one surface; a metal cooling panel for cooling a heating element, which covers the space portion and of which at least a part is in contact with the resin flow path; and a resin bonding member for bonding the resin flow path and the metal cooling panel, in which the metal cooling panel has a fine uneven structure at least on a surface of a bonding portion with the resin bonding member, and the metal cooling panel and the resin bonding member are bonded by allowing a part of the resin bonding member to enter into the fine uneven structure.

    COOLING UNIT, COOLING APPARATUS, BATTERY STRUCTURE, AND ELECTRIC VEHICLE

    公开(公告)号:US20220200081A1

    公开(公告)日:2022-06-23

    申请号:US17598811

    申请日:2020-03-27

    Abstract: A cooling unit includes a structure in which a box body made of resin and a plate lid made of metal are bonded together, in which at least one of an upper surface and a lower surface of the box body has an opening and the plate lid is bonded with the box body so as to block the opening, a wall surface of the box body is provided with a refrigerant inlet and a refrigerant outlet for allowing a refrigerant to flow in the box body, a flow path-forming rib is provided in the box body, and a part or an entirety of the box body is formed of a fiber-reinforced resin and/or a resin containing an inorganic particle filler.

Patent Agency Ranking