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公开(公告)号:US20220282933A1
公开(公告)日:2022-09-08
申请号:US17626438
申请日:2020-09-30
Applicant: MITSUI CHEMICALS, INC.
Inventor: Kazuki KIMURA , Mizue KURIYAGSWA , Tomoki TORII , Yasuyuki OKUMURA , Norihide TOBA , Takashi NAKATA
IPC: F28D15/00 , F28F21/06 , H01M10/613 , H01M10/6567 , H01M10/6563 , H01M10/6556
Abstract: A heating element accommodation case, comprising a casing to accommodate a heating element, the casing having a flow channel configured for a liquid to flow through, a portion of the flow channel being formed of a resin; and a heating element accommodation case, comprising a casing to accommodate a heating element and an airflow channel configured for air to flow through.
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公开(公告)号:US20230145824A1
公开(公告)日:2023-05-11
申请号:US17795743
申请日:2021-01-29
Applicant: MITSUI CHEMICALS, INC.
Inventor: Kazuki KIMURA , Tomoki TORII , Takahiro TOMINAGA , Kai MORIMOTO , Shinji NAKAJIMA , Isao WASHIO , Nobuyoshi SHIMBORI , Junya SHIMAZAKI , Jingjun ZHANG , Akinori AMANO , Haruka DOI
IPC: H01B3/30 , H01M50/522 , H01M50/524 , H01B3/44 , H01B1/02 , H01B13/00 , H01B13/06 , H02K3/50 , C08L77/06
CPC classification number: H01B3/306 , H01M50/522 , H01M50/524 , H01B3/441 , H01B1/02 , H01B13/0036 , H01B13/06 , H02K3/50 , C08L77/06 , H02K2203/09 , B29C45/14311
Abstract: A member for electric conduction, comprising a metal member and a resin member that is joined to at least a part of a surface of the metal member, the metal member having a roughness index, which is obtained by dividing a true surface area (m2) measured by a krypton adsorption method by a geometric surface area (m2), of 4.0 or more.
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公开(公告)号:US20230417493A1
公开(公告)日:2023-12-28
申请号:US18038957
申请日:2021-12-02
Applicant: MITSUI CHEMICALS, INC.
Inventor: Mizue KURIYAGAWA , Kazuki KIMURA , Tomoki TORII
CPC classification number: F28D20/0034 , B29C45/14008 , B29C45/14311 , B29K2705/00
Abstract: A temperature control unit, comprising a first metal member, a second metal member, a first resin member that is disposed between the first metal member and the second metal member, and a second resin member,
the first resin member having a shape corresponding to a space for a fluid to flow between the first metal member and the second metal member, and
the second resin member being joined with at least a portion of a surface of at least one of the first metal member or the second metal member.-
公开(公告)号:US20220247003A1
公开(公告)日:2022-08-04
申请号:US17621034
申请日:2020-06-12
Applicant: MITSUI CHEMICALS, INC.
Inventor: Kazuki KIMURA , Takahiro TOMINAGA , Mizue KURIYAGAWA , Tomoki TORII , Kyohei NOMOTO
IPC: H01M10/613 , H01M10/6554 , H01M10/6568
Abstract: A cooling device including: a resin flow path which is provided with a space portion serving as a flow path in at least one surface; a metal cooling panel for cooling a heating element, which covers the space portion and of which at least a part is in contact with the resin flow path; and a resin bonding member for bonding the resin flow path and the metal cooling panel, in which the metal cooling panel has a fine uneven structure at least on a surface of a bonding portion with the resin bonding member, and the metal cooling panel and the resin bonding member are bonded by allowing a part of the resin bonding member to enter into the fine uneven structure.
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公开(公告)号:US20220200081A1
公开(公告)日:2022-06-23
申请号:US17598811
申请日:2020-03-27
Applicant: MITSUI CHEMICALS, INC.
Inventor: Tomoki TORII , Kyohei NOMOTO
IPC: H01M10/6556 , H05K7/20 , H01M10/613 , H01M10/625 , B60L58/26 , B60L3/00
Abstract: A cooling unit includes a structure in which a box body made of resin and a plate lid made of metal are bonded together, in which at least one of an upper surface and a lower surface of the box body has an opening and the plate lid is bonded with the box body so as to block the opening, a wall surface of the box body is provided with a refrigerant inlet and a refrigerant outlet for allowing a refrigerant to flow in the box body, a flow path-forming rib is provided in the box body, and a part or an entirety of the box body is formed of a fiber-reinforced resin and/or a resin containing an inorganic particle filler.
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公开(公告)号:US20210249710A1
公开(公告)日:2021-08-12
申请号:US17265321
申请日:2019-08-01
Applicant: MITSUI CHEMICALS, INC.
Inventor: Kazuki KIMURA , Shinya NAITOU , Mizue KURIYAGAWA , Tomoki TORII , Kyohei NOMOTO
IPC: H01M10/6554 , H01M10/613 , H01M50/244 , H01M10/6556
Abstract: A cooling plate (1) including: a resin plate (2) in which a plurality of groove portions are formed; and a metal plate (3) provided over a surface of the resin plate (2) where the groove portions are formed, in which the resin plate (2) and the metal plate (3) are bonded to each other through an adhesive layer 4, and the groove portion of the resin plate (2) forms a flow path (8) for cooling water.
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