公开(公告)号：US20210249710A1

公开(公告)日：2021-08-12

申请号：US17265321

申请日：2019-08-01

Applicant: MITSUI CHEMICALS, INC.

Inventor： Kazuki KIMURA ,  Shinya NAITOU ,  Mizue KURIYAGAWA ,  Tomoki TORII ,  Kyohei NOMOTO

IPC: H01M10/6554 ,  H01M10/613 ,  H01M50/244 ,  H01M10/6556

Abstract: A cooling plate (1) including: a resin plate (2) in which a plurality of groove portions are formed; and a metal plate (3) provided over a surface of the resin plate (2) where the groove portions are formed, in which the resin plate (2) and the metal plate (3) are bonded to each other through an adhesive layer 4, and the groove portion of the resin plate (2) forms a flow path (8) for cooling water.