公开(公告)号：US20220247003A1

公开(公告)日：2022-08-04

申请号：US17621034

申请日：2020-06-12

Applicant: MITSUI CHEMICALS, INC.

Inventor： Kazuki KIMURA ,  Takahiro TOMINAGA ,  Mizue KURIYAGAWA ,  Tomoki TORII ,  Kyohei NOMOTO

IPC: H01M10/613 ,  H01M10/6554 ,  H01M10/6568

Abstract: A cooling device including: a resin flow path which is provided with a space portion serving as a flow path in at least one surface; a metal cooling panel for cooling a heating element, which covers the space portion and of which at least a part is in contact with the resin flow path; and a resin bonding member for bonding the resin flow path and the metal cooling panel, in which the metal cooling panel has a fine uneven structure at least on a surface of a bonding portion with the resin bonding member, and the metal cooling panel and the resin bonding member are bonded by allowing a part of the resin bonding member to enter into the fine uneven structure.

公开(公告)号：US20220200081A1

公开(公告)日：2022-06-23

申请号：US17598811

申请日：2020-03-27

Applicant: MITSUI CHEMICALS, INC.

Inventor： Tomoki TORII ,  Kyohei NOMOTO

IPC: H01M10/6556 ,  H05K7/20 ,  H01M10/613 ,  H01M10/625 ,  B60L58/26 ,  B60L3/00

Abstract: A cooling unit includes a structure in which a box body made of resin and a plate lid made of metal are bonded together, in which at least one of an upper surface and a lower surface of the box body has an opening and the plate lid is bonded with the box body so as to block the opening, a wall surface of the box body is provided with a refrigerant inlet and a refrigerant outlet for allowing a refrigerant to flow in the box body, a flow path-forming rib is provided in the box body, and a part or an entirety of the box body is formed of a fiber-reinforced resin and/or a resin containing an inorganic particle filler.

公开(公告)号：US20210249710A1

公开(公告)日：2021-08-12

申请号：US17265321

申请日：2019-08-01

Applicant: MITSUI CHEMICALS, INC.

Inventor： Kazuki KIMURA ,  Shinya NAITOU ,  Mizue KURIYAGAWA ,  Tomoki TORII ,  Kyohei NOMOTO

IPC: H01M10/6554 ,  H01M10/613 ,  H01M50/244 ,  H01M10/6556

Abstract: A cooling plate (1) including: a resin plate (2) in which a plurality of groove portions are formed; and a metal plate (3) provided over a surface of the resin plate (2) where the groove portions are formed, in which the resin plate (2) and the metal plate (3) are bonded to each other through an adhesive layer 4, and the groove portion of the resin plate (2) forms a flow path (8) for cooling water.