Chucking system for modulating shapes of substrates
    1.
    发明申请
    Chucking system for modulating shapes of substrates 有权
    用于调制基板形状的卡盘系统

    公开(公告)号:US20040090611A1

    公开(公告)日:2004-05-13

    申请号:US10293224

    申请日:2002-11-13

    Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.

    Abstract translation: 本发明涉及一种夹持系统,用于调制基板,以便相对于其上将与基底形成图案的晶片适当地成形和定位基板。 夹持系统包括具有第一和第二相对侧的卡盘体。 侧面在其间延伸。 第一侧包括限定第一和第二间隔开的支撑区域的第一和第二间隔开的凹部。 第一支撑区域使第二支撑区域和第一和第二凹槽成像。 第二支撑区域使第二凹部成像,其中身体的与第二凹部重叠的部分对于具有预定波长的辐射是透明的。 第二面和侧面限定外表面。 主体包括使第一和第二凹槽与外表面之一流体连通的通道。

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