Abstract:
A method for fabricating a microlens array includes: step S1, providing a first substrate, and forming a patterned mask layer on the first substrate; step S2, etching the first substrate to form spaced grooves; step S3, removing the patterned mask layer; step S4, attaching a photoresist layer to the upper surface of the first substrate; step S5, softening the photoresist layer so that it adheres to the inner wall of the groove to form a concave smooth surface; step S6, solidifying the photoresist layer to form a working mold; applying an adhesive material and the working mold through the second substrate. The microlens array is produced by pressing the mold together or injecting PDMS material into the surface of the working mold.
Abstract:
A method of fabricating a refractive optical element on a substrate may provide less expensive and more compact optics for an X-ray system. The method includes coating the substrate with a resin and providing radiation to a portion of the resin to cause two photon polymerization of the resin. The method further includes forming, by two photon polymerization, a first surface of a polymer refractive optical element from the resin. The first surface is disposed along an optical axis of the refractive optical element and the first surface has a roughness of less than 100 nanometers. Further, the method includes forming, by two photon polymerization, a second surface of the polymer refractive optical element. The second surface is disposed along the optical axis of the refractive optical element and the second surface has a roughness of less than 100 nanometers.
Abstract:
A method for manufacturing an optical element such as a micro-optic lens may include providing a substrate having a surface profile, the substrate surface profile defining one or more flow stop features. The method may include providing a mold tool having a mold surface profile and dispensing viscous material. When the mold surface profile and the substrate surface profile are disposed towards one another and aligned relative to one another, the mold surface profile and the substrate surface profile define therebetween an optical element cavity, a peripheral cavity disposed around a periphery of the optical element cavity where the peripheral cavity includes one or more flow stop features, and an air flow path for air to flow in and out of the peripheral cavity from and to an external environment. The optical element cavity and the peripheral cavity define a peripheral constriction therebetween.
Abstract:
A method of making a security device including: (a) forming an array of focussing elements on at least a first region of a focussing element support layer, by: (a)(i) applying a first transparent curable material either to the focussing element support layer or to a casting tool carrying a surface relief corresponding to the focussing elements, over an first sub-region of the first region and applying a second transparent curable material to a second sub-region of the first region laterally offset from the first sub-region, the first and second transparent curable materials having different optical detection characteristics from one another; (a)(ii) forming the first and second transparent curable materials with the casting tool; and (a)(iii) curing the first and second transparent curable materials in the first region, so as to retain the surface relief.
Abstract:
A method of making a security device, comprising: forming an array of primary focusing elements on a first region of a focusing element support layer, by applying at least one transparent curable material either to the focusing element support layer or to a casting tool carrying a surface relief over an area which includes at least the first region, the surface relief comprising portions corresponding to the primary focusing elements; forming the transparent curable material(s) with the casting tool; and curing the transparent curable material(s) so as to retain the surface relief in the first region; wherein the surface relief further includes a plurality of structures of greater depth than the height of the primary focusing elements such that the cured transparent material(s) include a plurality of features protruding above the height of the primary focusing elements between primary focusing elements of the array.
Abstract:
An optical film has a plurality of aligned convex microlenses, each of which has a region α and a region β, region β forming the outer part of the convex shape of the microlens and positioned so as to cover region α. Both region α and region β contain a resin, and the refractive index of the resin in region α is higher than the refractive index of the resin in region β; region β contains fine particles, and region α contains fine particles, and the content of the fine particles contained in region α is lower than the content of the fine particles contained in region β; or region α contains fine particles, and region β contains fine particles, and the content of the fine particles contained in region α is higher than the content of the fine particles contained in region β.
Abstract:
A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.
Abstract:
An optical film production method for suppressing air bubbles in microlenses, comprising rotating a roll die having a plurality of concave-shaped microlens transfer portions on the surface and running a substrate in the rotation direction; supplying an active energy ray-curable composition β onto a coating roll adjacent to the roll die surface, flattening the composition β, coating the flattened composition β on the roll die surface; supplying an active energy ray-curable composition α on the substrate and coating the composition α on a surface of the substrate; associating the compositions α and β between the roll die and the substrate to form a liquid pool; and irradiating a region between the roll die surface and the substrate surface with an active energy ray so the compositions α and β are sandwiched between the roll die surface and the substrate surface to cure the compositions α and β.
Abstract:
A lithography-free, mold-free, single-step method of fabricating high quality optical lenses by curing polydimethylsiloxane (PDMS) droplets on a pre-heated smooth surface allows lenses with different focal lengths to be made by varying the droplet volume and surface temperature.
Abstract:
The invention provides a lenticular lens type three-dimensional image display device and a method of fabricating the device without a need for a clear plastic substrate transposed between the image and lenticular lenses. The device can be obtained by directly printing curable coatings onto the image, making them particularly well suited for volume production. The combination the image printing and application of curable coatings process can be joined together to conduct the single pass-process. The single pass-process allows for flexibility of the printing only selective areas of the substrate. Moreover, this process allows the device to be recyclable.