公开(公告)号：US09244018B2

公开(公告)日：2016-01-26

申请号：US13940870

申请日：2013-07-12

Applicant: MPI Corporation

Inventor： Chia-Tai Chang ,  Chin-Yi Tsai ,  Chiu-Kuei Chen ,  Chen-Chih Yu ,  Chien-Chang Lai ,  Chin-Tien Yang ,  Hui-Pin Yang ,  Keng-Shieng Chang ,  Yun-Ru Huang

IPC: G01N21/88 ,  G01R1/04 ,  G01R1/06 ,  H01L21/68 ,  G01R1/073 ,  G01R1/067

CPC classification number: G01N21/88 ,  G01R1/04 ,  G01R1/06711 ,  G01R1/073 ,  G01R1/07342 ,  H01L21/68

Abstract: A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips.

Abstract translation: 探针保持结构包括基板和多个保持模块。 基板具有围绕开口的周边布置的开口和多个槽。 保持模块分别与凹槽连接。 每个保持模块包括固定构件和多个探针。 固定构件与相应的凹槽连接。 探针与固定部件连接并通过相应的凹槽。 探头保持结构与具有透镜的透镜调节机构组合，以形成用于测试芯片的电特性的光学检查装置。

公开(公告)号：US09201098B2

公开(公告)日：2015-12-01

申请号：US13941210

申请日：2013-07-12

Applicant: MPI CORPORATION

Inventor： Chia-Tai Chang ,  Chin-Yi Tsai ,  Chiu-Kuei Chen ,  Chen-Chih Yu ,  Chien-Chang Lai ,  Chin-Tien Yang ,  Hui-Pin Yang ,  Keng-Shieng Chang ,  Yun-Ru Huang

IPC: G01R31/00 ,  G01R1/073 ,  G01R1/067

CPC classification number: G01R1/07342 ,  G01R1/06772

Abstract: A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes a signal probe and a first conductor corresponding to the signal probe and being electrically connected with the ground probe. An insulation layer is disposed between the first conductor and the signal probe.

Abstract translation: 高频探针卡包括具有至少一个第一开口的至少一个基板，设置在所述至少一个基板上的插入板，并且具有至少一个对应于所述至少一个第一开口的第二开口，布置在插入件上的电路板 并且具有对应于所述至少一个第一和第二开口的第三开口，以及至少一个探针模块，包括至少一个接地探针和至少一个穿过相应基板的高频信号探针，所述插入板和所述第三开口 并与电路板电连接。 每个高频信号探头包括信号探针和对应于信号探针的第一导体并与接地探头电连接。 绝缘层设置在第一导体和信号探头之间。