Abstract:
A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips.
Abstract:
A coaxial probe card device includes a substrate, a plurality of probe holders, and a plurality of probes. The substrate has a through hole. The plurality of probe holders is disposed on the substrate and is configured in a radial manner surrounding the through hole by using the through hole of the substrate as a center. Each probe holder has a probe slot, and the probe slot is inclined with respect to a surface of the substrate and extends towards the through hole of the substrate. The probes are individually disposed in the probe slots of the probe holders.
Abstract:
The present invention provides a probe card comprising a probe base, at least one impedance-matching probes, and a plurality of first probes. The probe base has a probing side and a tester side opposite to the probing side. Each impedance-matching probe has a probing part and a signal transmitting part electrically coupled to the probing part, wherein one end of the signal transmitting part is arranged at tester side, and the signal transmitting part has a central probing axis. Each first probe has a probing tip and a cantilever part coupled to the probing tip, wherein the cantilever part is coupled to the probe base and has a first central axis such that an included angle is formed between the central probing axis and the first central axis.
Abstract:
A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes a signal probe and a first conductor corresponding to the signal probe and being electrically connected with the ground probe. An insulation layer is disposed between the first conductor and the signal probe.
Abstract:
The present invention provides a probe card comprising a probe base, at least one impedance-matching probes, and a plurality of first probes. The probe base has a probing side and a tester side opposite to the probing side. Each impedance-matching probe has a probing part and a signal transmitting part electrically coupled to the probing part, wherein one end of the signal transmitting part is arranged at tester side, and the signal transmitting part has a central probing axis. Each first probe has a probing tip and a cantilever part coupled to the probing tip, wherein the cantilever part is coupled to the probe base and has a first central axis such that an included angle is formed between the central probing axis and the first central axis.