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公开(公告)号：US20150377926A1
公开(公告)日：2015-12-31
申请号：US14558735
申请日：2014-12-03
Applicant: MPI Corporation
Inventor： Tzu-Yang Chen , Shang-Jung Hsieh , Chung-Tse Lee , Tsung-Yi Chen , Tien-Chia Li , Chia-Yuan Kuo , Che-Wei Lin
CPC classification number: G01R1/07364 , G01R1/07357 , G01R31/2891
Abstract: A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.
Abstract translation: 提供探针卡的定位器和探针头。 定位器具有主开口，第一子开口，第二子开口，第三子开口，第四子开口，第一定位部分，第二定位部分，第一弹性部分和第二弹性部分 。 第一子开口，第二子开口，第三子开口和第四子开口依次布置在主开口的周边并且连通到主开口。 第一定位部的刚度和第二定位部的刚度高于第一弹性部的刚度和第二弹性部的刚度。
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公开(公告)号：US12050235B2
公开(公告)日：2024-07-30
申请号：US17569080
申请日：2022-01-05
Applicant: MPI CORPORATION
Inventor： Chin-Yi Lin , Keng-Min Su , Che-Wei Lin , Ko-Chun Wu
CPC classification number: G01R1/44 , G01R1/07342
Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.
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3.发明授权公开(公告)号：US11619656B2
公开(公告)日：2023-04-04
申请号：US17565075
申请日：2021-12-29
Applicant: MPI CORPORATION
Inventor： Chin-Yi Lin , Keng-Min Su , Che-Wei Lin , Hsin-Cheng Hung
IPC: G01R1/073
Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.
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公开(公告)号：US20200309819A1
公开(公告)日：2020-10-01
申请号：US16822896
申请日：2020-03-18
Applicant: MPI Corporation
Inventor： Che-Wei Lin , Ting-Ju Wu , Keng-Min Su , Chin-Yi Lin
Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
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公开(公告)号：USD1031738S1
公开(公告)日：2024-06-18
申请号：US29796877
申请日：2021-06-28
Applicant: MPI CORPORATION
Designer： Chin-Yi Lin , Keng-Min Su , Che-Wei Lin , Hsin-Cheng Hung
Abstract: FIG. 1 is a perspective view of a die plate assembly for probe head, showing the upper die plate and lower die plate in an assembled position according to our design;
FIG. 2 is a front view thereof, showing the upper die plate and lower die plate in an assembled position, the rear side, the left side and the right side being an identical image;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is an enlarged sectional view taken along line 5-5 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;
FIG. 6 is an enlarged sectional view taken along line 6-6 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;
FIG. 7 is a top perspective view of the upper die plate of the die plate assembly for probe head;
FIG. 8 is a front view of the upper die plate of the die plate assembly for probe head, the rear side being an identical image;
FIG. 9 is a left side elevational view of the upper die plate of the die plate assembly for probe head, the right side being an identical image;
FIG. 10 is a top plan view of the upper die plate of the die plate assembly for probe head;
FIG. 11 is a bottom plan view of the upper die plate of the die plate assembly for probe head;
FIG. 12 is a bottom perspective view of the upper die plate of the die plate assembly for probe head;
FIG. 13 is a top perspective view of the lower die plate of the die plate assembly for probe head;
FIG. 14 is a front view of the lower die plate of the die plate assembly for probe head, the rear side, the left side and the right side being an identical image;
FIG. 15 is a top plan view of the lower die plate of the die plate assembly for probe head;
FIG. 16 is a bottom plan view of the lower die plate of the die plate assembly for probe head; and,
FIG. 17 is a bottom perspective view of the lower die plate of the die plate assembly for probe head.
The broken lines depict portions of the die assembly and form no part of the claimed design.-
Patent Agency Ranking
公开(公告)号：US11733267B2
公开(公告)日：2023-08-22
申请号：US16822896
申请日：2020-03-18
Applicant: MPI Corporation
Inventor： Che-Wei Lin , Ting-Ju Wu , Keng-Min Su , Chin-Yi Lin
CPC classification number: G01R1/07314 , G01R1/06733
Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
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公开(公告)号：US20240118316A1
公开(公告)日：2024-04-11
申请号：US18544756
申请日：2023-12-19
Applicant: MPI Corporation
Inventor： Chin-Yi Lin , Che-Wei Lin , Ting-Ju Wu , Chien-Kai Hung
CPC classification number: G01R3/00 , G01R1/07342
Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.
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公开(公告)号：US11874313B2
公开(公告)日：2024-01-16
申请号：US17518311
申请日：2021-11-03
Applicant: MPI Corporation
Inventor： Chin-Yi Lin , Che-Wei Lin , Ting-Ju Wu , Chien-Kai Hung
CPC classification number: G01R3/00 , G01R1/07342
Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
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公开(公告)号：USD983681S1
公开(公告)日：2023-04-18
申请号：US29786073
申请日：2021-05-28
Applicant: MPI Corporation
Designer： Tzu-Yang Chen , Che-Wei Lin , Chen-Rui Wu
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公开(公告)号：US20220170961A1
公开(公告)日：2022-06-02
申请号：US17518311
申请日：2021-11-03
Applicant: MPI Corporation
Inventor： Chin-Yi Lin , Che-Wei Lin , Ting-Ju Wu , Chien-Kai Hung
Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
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