COMPONENT ARRANGEMENT, PACKAGE AND PACKAGE ARRANGEMENT, AS WELL AS PRODUCTION METHOD

    公开(公告)号:US20220310890A1

    公开(公告)日:2022-09-29

    申请号:US16967759

    申请日:2019-02-11

    Abstract: Provided is a component arrangement, including a carrier substrates; a spacer which is arranged on the carrier substrate so as to surround an installation space and has an outlet opening on a side facing away from the carrier substrate; an optical component arranged in the installation space; a contact connection which electrically conductively connects the optical component to external contacts arranged outside the installation space; a cover substrate which is arranged on the spacer and with which the outlet opening is covered in a light-permeable manner; and a light-reflecting surface which is formed on an anisotropically etched silicon component and is arranged in the installation space as an inclined surface at an angle of approx. 45° relative to the surface of the carrier substrate facing the installation space, in such a way that light radiated in a horizontal direction onto the light-reflecting surface can be radiated out in the vertical direction through the opening and the cover substrate, and vice versa.

Patent Agency Ranking