LOW PROFILE INTERCONNECT FOR LIGHT EMITTER
    6.
    发明申请

    公开(公告)号:US20170244013A1

    公开(公告)日:2017-08-24

    申请号:US15441074

    申请日:2017-02-23

    Inventor: Kevin Curtis

    Abstract: In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.

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