公开(公告)号：USRE37690E1

公开(公告)日：2002-05-07

申请号：US08448881

申请日：1995-05-24

申请人： Makoto Kitano ,  Sueo Kawai ,  Asao Nishimura ,  Hideo Miura ,  Akihiro Yaguchi ,  Chikako van Koten nee Kitabayashi ,  Ichio Shimizu ,  Toshio Hatsuda ,  Toshinori Ozaki ,  Toshio Hattori ,  Souji Sakata

发明人： Makoto Kitano ,  Sueo Kawai ,  Asao Nishimura ,  Hideo Miura ,  Akihiro Yaguchi ,  Chikako van Koten nee Kitabayashi ,  Ichio Shimizu ,  Toshio Hatsuda ,  Toshinori Ozaki ,  Toshio Hattori ,  Souji Sakata

IPC分类号： H01L23495

CPC分类号： H01L23/49503 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/3512

摘要： A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.

摘要翻译： 引线框架和半导体器件，其中在引线框架的中心处的芯片焊盘的半导体芯片安装表面的中心处形成有通孔，该通孔是锥形的，或者是对应于表面积的表面积 在芯片安装面的芯片安装面的表面上比在与芯片安装面相反的一侧的表面上更大。 这防止了在将引线框架回流焊接到基板的步骤中密封塑料部分中出现裂纹。