摘要:
Screening methods for determining pro-apoptotic compounds or anti-apoptotic compounds comprise measuring the interaction between p53 and NEDL1 in the presence and in the absence of a test compound, and comparing the strength of interaction between p53 and NEDL1 in the presence and in the absence of the test compound.
摘要:
A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.
摘要:
Screening methods for determining pro-apoptotic compounds or anti-apoptotic compounds comprise measuring the interaction between p53 and NEDL1 in the presence and in the absence of a test compound, and comparing the strength of interaction between p53 and NEDL1 in the presence and in the absence of the test compound.
摘要:
The present invention provides a novel drug/agent for the prevention and/or treatment of Alzheimer's disease based on a different Alzheimer's disease onset mechanism from the amyloid hypothesis, and a method of screening for it.
摘要:
A method for screening a pro-apoptotic compound comprising a determination step of determining a compound enhancing interaction between p73 and IKK-α as a pro-apoptotic compound.
摘要:
A method for screening a pro-apoptotic compound comprising a determination step of determining a compound enhancing interaction between p73 and IKK-α as a pro-apoptotic compound.
摘要:
The present invention provides a novel drug/agent for the prevention and/or treatment of Alzheimer's disease based on a different Alzheimer's disease onset mechanism from the amyloid hypothesis, and a method of screening for it.
摘要:
One or a plurality of layers of a metallic raw material in plate form and one or a plurality of layers of wire netting are placed one over another in vertically stacked relation and then subjected to rolling to produce vibration absorbing metallic material. The metallic material produced in this way exhibits an excellent vibration damping performance.
摘要:
A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.
摘要:
A method of producing a vibration attenuating material having the steps of forming a multiplicity of grooves in the surface of a ductile raw material and subjecting the raw material to a drawing or rolling work to form a multiplicity of minute friction interfaces in the surface region of the vibration attenuating material. An improved vibration attenuating performance is ensured by a suitable selection of numerical values of factors such as relationship between the maximum depth of the friction interface and the thickness of the vibration attenuating material, pitch of the friction interfaces and so forth.