摘要:
In order to allow to easily specify inspection recipe with which defects desired to be detected can be detected efficiently, a defect inspection apparatus performs defect inspection of a substrate in accordance with a plurality of inspection recipes and produces defect information associated with position of defect in the substrate and attribute data of the defect for each of the inspection recipes and a defect review apparatus produces review result information specifying a kind of defect selected from defects contained in the defect information. An analyzing apparatus obtains defect information and review result information and totalizes the number of defects having attribute data similar to attribute data possessed in defects corresponding to kind of defects to be analyzed for each inspection recipe.
摘要:
In order to allow to easily specify inspection recipe with which defects desired to be detected can be detected efficiently, a defect inspection apparatus performs defect inspection of a substrate in accordance with a plurality of inspection recipes and produces defect information associated with position of defect in the substrate and attribute data of the defect for each of the inspection recipes and a defect review apparatus produces review result information specifying a kind of defect selected from defects contained in the defect information. An analyzing apparatus obtains defect information and review result information and totalizes the number of defects having attribute data similar to attribute data possessed in defects corresponding to kind of defects to be analyzed for each inspection recipe.
摘要:
Provided is an observation condition determination support device which can improve the defect classification accuracy. The observation condition determination support device includes: a means (26) for acquiring a plurality of defects images which have captured the same defect under a plurality of observation conditions set in advance in an observation device (5) in accordance with check data relating to defects of a semiconductor device detected by an inspection device (4); a means (12) for classifying the plurality of the same defects according to the respective defect images and determining a first category to which the same defects belong for each of the observation conditions as a result of the classification; and a means (13) for determining an observation condition to be used when fabricating the semiconductor device among the plurality of the observation conditions according to the ratio at which the first category is matched with a second category determined by a user of the observation device who has classified the same defects.
摘要:
Provided is an observation condition determination support device which can improve the defect classification accuracy. The observation condition determination support device includes: a means (26) for acquiring a plurality of defects images which have captured the same defect under a plurality of observation conditions set in advance in an observation device (5) in accordance with check data relating to defects of a semiconductor device detected by an inspection device (4); a means (12) for classifying the plurality of the same defects according to the respective defect images and determining a first category to which the same defects belong for each of the observation conditions as a result of the classification; and a means (13) for determining an observation condition to be used when fabricating the semiconductor device among the plurality of the observation conditions according to the ratio at which the first category is matched with a second category determined by a user of the observation device who has classified the same defects
摘要:
The objective is to improve a classification standard. Classification standard data, in which is registered image data information that is the standard when image data is classified, and classification data, in which is registered image data information that is the result when newly input image data is classified using the classification standard data, are stored in a storage unit. An image classification device is characterized in that when any image data information of the image data that is registered in the classification data is selected by means of an input unit, and an instruction to additionally register the selected image data information in the classification standard data is input by means of the input unit, the selected image data information is additionally registered in the classification standard data.
摘要:
The objective is to improve a classification standard. Classification standard data, in which is registered image data information that is the standard when image data is classified, and classification data, in which is registered image data information that is the result when newly input image data is classified using the classification standard data, are stored in a storage unit. An image classification device is characterized in that when any image data information of the image data that is registered in the classification data is selected by means of an input unit, and an instruction to additionally register the selected image data information in the classification standard data is input by means of the input unit, the selected image data information is additionally registered in the classification standard data.
摘要:
A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.
摘要:
A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.
摘要:
Disclosed is a test data analyzing method and system for use in estimation of a defect cause of a product, such as, an integrated circuit, a liquid crystal display, an optical transceiver, a thin film magnetic head, etc., which is fabricated through plural processes. The estimation of a defect cause is achieved by selecting a wafer number to be analyzed, reading test data, reading fabrication line data, counting frequency of machine codes by wafers, grouping test data by machine codes or frequencies, comparing test data distributions between groups by machine codes, and comparing results between machine codes.
摘要:
Disclosed is a technique wherein an object that requires adjustment in order to increase the reliability of automatic classification can be easily identified. A device (140) for adjusting classification classifies defects into a first class group according to the feature amount of the defects that are obtained from image data obtained from an electron microscope (110), and classifies the defects into a second class group according to the feature amount of the defects classified into the first class group. And, the device (140) for adjusting the classification calculates classification performance by comparing the defects that have been classified into the second class group, and outputs the calculated classification performance in a predetermined display format to an output unit (180).