公开(公告)号：US20120241970A1

公开(公告)日：2012-09-27

申请号：US13489215

申请日：2012-06-05

申请人： Manabu OHNISHI ,  Koji Takemura ,  Noriyuki Nagai ,  Hoyeun Huh ,  Tomoyuki Nakayama ,  Atsushi Doi

发明人： Manabu OHNISHI ,  Koji Takemura ,  Noriyuki Nagai ,  Hoyeun Huh ,  Tomoyuki Nakayama ,  Atsushi Doi

IPC分类号： H01L23/48

CPC分类号： H01L24/06 ,  H01L23/3114 ,  H01L23/50 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06153 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00012

摘要： Input/output cells are formed so as to be peripherally arranged adjacent to a corner cell on a surface of a semiconductor chip, and electrode pads are formed on the respective input/output cells. The electrode pads are configured in a zigzag pad arrangement so as to form inner and outer pad arrays. However, of the electrode pads forming the inner pad array, those electrode pads in predetermined areas adjacent to the two sides of the corner cell are not disposed, such that an interconnect pattern of a carrier which is bump-bonded to the semiconductor chip and vias are prevented from becoming complex.

摘要翻译： 形成输入/输出单元以便在半导体芯片的表面上与角单元相邻地周边布置，并且在相应的输入/输出单元上形成电极焊盘。 电极焊盘被配置成Z字形排列，以形成内部和外部焊盘阵列。 然而，在形成内焊盘阵列的电极焊盘中，与角电池两侧相邻的预定区域中的那些电极焊盘没有布置，使得凸起接合到半导体芯片的载体的互连图案和通孔 被阻止变得复杂。

公开(公告)号：US20110037173A1

公开(公告)日：2011-02-17

申请号：US12913308

申请日：2010-10-27

申请人： Manabu OHNISHI ,  Koji TAKEMURA ,  Noriyuki NAGAI ,  Hoyeun HUH ,  Tomoyuki NAKAYAMA ,  Atsushi DOI

发明人： Manabu OHNISHI ,  Koji TAKEMURA ,  Noriyuki NAGAI ,  Hoyeun HUH ,  Tomoyuki NAKAYAMA ,  Atsushi DOI

IPC分类号： H01L23/48

CPC分类号： H01L24/06 ,  H01L23/3114 ,  H01L23/50 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06153 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00012

摘要： Input/output cells are formed so as to be peripherally arranged adjacent to a corner cell on a surface of a semiconductor chip, and electrode pads are formed on the respective input/output cells. The electrode pads are configured in a zigzag pad arrangement so as to form inner and outer pad arrays. However, of the electrode pads forming the inner pad array, those electrode pads in predetermined areas adjacent to the two sides of the corner cell are not disposed, such that an interconnect pattern of a carrier which is bump-bonded to the semiconductor chip and vias are prevented from becoming complex.

摘要翻译： 形成输入/输出单元以便在半导体芯片的表面上与角单元相邻地周边布置，并且在相应的输入/输出单元上形成电极焊盘。 电极焊盘被配置成Z字形排列，以形成内部和外部焊盘阵列。 然而，在形成内焊盘阵列的电极焊盘中，与角电池两侧相邻的预定区域中的那些电极焊盘没有布置，使得凸起接合到半导体芯片的载体的互连图案和通孔 被阻止变得复杂。

公开(公告)号：US20100117083A1

公开(公告)日：2010-05-13

申请号：US12688506

申请日：2010-01-15

申请人： Manabu OHNISHI ,  Koji Takemura ,  Noriyuki Nagai ,  Hoyeun Huh ,  Tomoyuki Nakayama ,  Atsushi Doi

发明人： Manabu OHNISHI ,  Koji Takemura ,  Noriyuki Nagai ,  Hoyeun Huh ,  Tomoyuki Nakayama ,  Atsushi Doi

IPC分类号： H01L23/48 ,  H01L23/488

CPC分类号： H01L24/06 ,  H01L23/3114 ,  H01L23/50 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06153 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00012

摘要： Input/output cells are formed so as to be peripherally arranged adjacent to a corner cell on a surface of a semiconductor chip, and electrode pads are formed on the respective input/output cells. The electrode pads are configured in a zigzag pad arrangement so as to form inner and outer pad arrays. However, of the electrode pads forming the inner pad array, those electrode pads in predetermined areas adjacent to the two sides of the corner cell are not disposed, such that an interconnect pattern of a carrier which is bump-bonded to the semiconductor chip and vias are prevented from becoming complex.

摘要翻译： 形成输入/输出单元以便在半导体芯片的表面上与角单元相邻地周边布置，并且在相应的输入/输出单元上形成电极焊盘。 电极焊盘被配置成Z字形排列，以形成内部和外部焊盘阵列。 然而，在形成内焊盘阵列的电极焊盘中，与角电池两侧相邻的预定区域中的那些电极焊盘没有布置，使得凸起接合到半导体芯片的载体的互连图案和通孔 被阻止变得复杂。