公开(公告)号：US20230418101A1

公开(公告)日：2023-12-28

申请号：US18243136

申请日：2023-09-07

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Marcos Diaz ,  Tim Hubbard ,  Matt Dosch

IPC: G02F1/1333 ,  H05K7/20

CPC classification number: G02F1/133385 ,  H05K7/202 ,  G02F1/133308

Abstract: A method of increasing thermal conduction in an electronic display assembly includes securing a panel forming part of a thermal management substructure for the electronic display assembly, depositing a structural adhesive to at least one of an electronic component for operating the electronic display assembly and the panel, securing said electronic component directly to a first side of the panel by way of the adhesive, and securing the thermal management substructure within a housing of the electronic display assembly such that a second side of said panel defines, at least in part, at least a portion of an airflow pathway of the electronic display assembly of which the thermal management substructure forms a part.

公开(公告)号：US12055809B2

公开(公告)日：2024-08-06

申请号：US18243136

申请日：2023-09-07

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Marcos Diaz ,  Tim Hubbard ,  Matt Dosch

IPC: G02F1/1333 ,  H05K7/20

CPC classification number: G02F1/133385 ,  G02F1/133308 ,  H05K7/202 ,  G02F2202/28

Abstract: A method of increasing thermal conduction in an electronic display assembly includes securing a panel forming part of a thermal management substructure for the electronic display assembly, depositing a structural adhesive to at least one of an electronic component for operating the electronic display assembly and the panel, securing said electronic component directly to a first side of the panel by way of the adhesive, and securing the thermal management substructure within a housing of the electronic display assembly such that a second side of said panel defines, at least in part, at least a portion of an airflow pathway of the electronic display assembly of which the thermal management substructure forms a part.

公开(公告)号：US20220260872A1

公开(公告)日：2022-08-18

申请号：US17669439

申请日：2022-02-11

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Marcos Diaz ,  Tim Hubbard ,  Matt Dosch

IPC: G02F1/1333 ,  H05K7/20

Abstract: A display assembly is provided which includes a housing for an electronic display and a thermal management substructure. The thermal management substructure is located rearward of the electronic display and includes multiple components, which are secured to one another by a plurality of deposits of structural adhesive. Methods of manufacturing the thermal management substructure are also provided where structural adhesive is deposited between components of the thermal management substructure.

公开(公告)号：US20250108552A1

公开(公告)日：2025-04-03

申请号：US18898796

申请日：2024-09-27

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Tim Hubbard ,  Fletcher Bean ,  Matt Dosch

IPC: B29C53/08 ,  B29C53/40 ,  B29C53/84 ,  B29L31/34

Abstract: Methods of manufacturing a door frame subassembly for an electronic display assembly and related systems and apparatuses are disclosed. A material is extruded to form a frame. The material is bent into a rectangular shape with rounded corners to define an opening. Notches may be formed in the frame to facilitate the bending. A remaining gap in the material is joined, such as by a bracket at a lower portion of the opening to secure the frame to itself.

公开(公告)号：US20250093696A1

公开(公告)日：2025-03-20

申请号：US18970066

申请日：2024-12-05

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Marcos Diaz ,  Tim Hubbard ,  Matt Dosch

IPC: G02F1/1333 ,  H05K7/20

Abstract: A display assembly is provided which includes a housing for an electronic display and a thermal management substructure. The thermal management substructure is located rearward of the electronic display and includes multiple components, which are secured to one another by a plurality of deposits of structural adhesive. Methods of manufacturing the thermal management substructure are also provided where structural adhesive is deposited between components of the thermal management substructure.

公开(公告)号：US12197060B2

公开(公告)日：2025-01-14

申请号：US17669439

申请日：2022-02-11

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Marcos Diaz ,  Tim Hubbard ,  Matt Dosch

IPC: G02F1/1333 ,  H05K7/20

Abstract: A display assembly is provided which includes a housing for an electronic display and a thermal management substructure. The thermal management substructure is located rearward of the electronic display and includes multiple components, which are secured to one another by a plurality of deposits of structural adhesive. Methods of manufacturing the thermal management substructure are also provided where structural adhesive is deposited between components of the thermal management substructure.