公开(公告)号：US12055809B2

公开(公告)日：2024-08-06

申请号：US18243136

申请日：2023-09-07

申请人： Manufacturing Resources International, Inc.

发明人： William Dunn ,  Marcos Diaz ,  Tim Hubbard ,  Matt Dosch

IPC分类号： G02F1/1333 ,  H05K7/20

CPC分类号： G02F1/133385 ,  G02F1/133308 ,  H05K7/202 ,  G02F2202/28

摘要： A method of increasing thermal conduction in an electronic display assembly includes securing a panel forming part of a thermal management substructure for the electronic display assembly, depositing a structural adhesive to at least one of an electronic component for operating the electronic display assembly and the panel, securing said electronic component directly to a first side of the panel by way of the adhesive, and securing the thermal management substructure within a housing of the electronic display assembly such that a second side of said panel defines, at least in part, at least a portion of an airflow pathway of the electronic display assembly of which the thermal management substructure forms a part.

公开(公告)号：US20230422431A1

公开(公告)日：2023-12-28

申请号：US18243407

申请日：2023-09-07

申请人： Manufacturing Resources International, Inc.

发明人： William Dunn ,  Tim Hubbard

IPC分类号： H05K7/20 ,  G02F1/1333

CPC分类号： H05K7/202 ,  G02F1/133385 ,  H05K7/20972 ,  H05K7/20136 ,  H05K7/20163 ,  F28D9/00

摘要： An electronic display assembly includes an electronic display located within a housing. A first airflow pathway fluidly connected to an ambient environment extends through at least a portion of the housing. A second airflow pathway, separated from the first airflow pathway, forms a closed loop within the housing. Some or all electronic components for operating the electronic display assembly are located within the second airflow pathway, such as to at least partially isolate such electronics from dust or other containments in ambient air.

公开(公告)号：US11596081B2

公开(公告)日：2023-02-28

申请号：US17234237

申请日：2021-04-19

申请人： Manufacturing Resources International, Inc.

发明人： William Dunn ,  Tim Hubbard

IPC分类号： H05K7/20 ,  G02F1/1333 ,  F28D9/00 ,  F28F3/02

摘要： A display assembly includes a housing which at least partially encloses an image assembly. A cover positioned forward of, and spaced apart from, the image assembly forms at least a portion of a forward surface of the housing and permits viewing of images displayed at the image assembly therethrough. A fan assembly moves air through an airflow pathway within the housing which includes a front channel between the cover and the image assembly and a rear chamber behind the image assembly. One or more solar energy reduction layers are associated with the cover and prevent at least some ambient sunlight striking the cover from traveling therebeyond.

公开(公告)号：US10827656B2

公开(公告)日：2020-11-03

申请号：US16430195

申请日：2019-06-03

申请人： Manufacturing Resources International, Inc.

发明人： Tim Hubbard

IPC分类号： H05K7/20 ,  G02F1/1333 ,  G02F1/13357

摘要： An apparatus for cooling an electronic image assembly with ambient gas and circulating gas is disclosed. A first fan may be positioned to force the circulating gas around the electronic image assembly in a closed loop while a second fan may be positioned to cause a flow of ambient gas. A structure is preferably positioned to allow the circulating gas to cross the flow of the ambient gas while substantially prohibiting the circulating gas from mixing with the ambient gas. A pair of manifolds may be placed along the sides of the electronic image assembly and may be in gaseous communication with a plurality of channels placed behind the electronic image assembly. A heat exchanger may be used in some exemplary embodiments.

公开(公告)号：US10524397B2

公开(公告)日：2019-12-31

申请号：US15589932

申请日：2017-05-08

申请人： Manufacturing Resources International, Inc.

发明人： William Dunn ,  Tim Hubbard ,  Kevin O'Connor

IPC分类号： H05K7/20 ,  G11B33/06

摘要： The exemplary embodiments disclosed herein are directed to a heat exchanger assembly for cooling power module bricks, the heat exchanger assembly having a plurality of spaced apart heat exchanger layers between which external air and a closed loop gas are separately circulated. A series of metallic plates may be located within the spaces between some or all of the heat exchanger layers to conduct heat from the power modules. Circulating fans may be employed to circulate external air and circulating gas through the heat exchanger. Pass through junctions may be positioned near edges of the heat exchanger to permit the circulating gas to cross paths with the external air without allowing the two gas flows to mix with one another.

公开(公告)号：US09801305B2

公开(公告)日：2017-10-24

申请号：US14834034

申请日：2015-08-24

申请人： Manufacturing Resources International, Inc.

发明人： William Dunn ,  Tim Hubbard

IPC分类号： G02F1/1333 ,  H05K7/20 ,  F28D9/00 ,  F28F3/02

CPC分类号： H05K7/202 ,  F28D9/00 ,  F28F3/02 ,  G02F1/133385 ,  H05K7/20136 ,  H05K7/20163 ,  H05K7/20972

摘要： A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

公开(公告)号：US09119325B2

公开(公告)日：2015-08-25

申请号：US14050464

申请日：2013-10-10

申请人： Manufacturing Resources International, Inc.

发明人： William Dunn ,  Tim Hubbard

IPC分类号： G02F1/1333 ,  H05K7/20 ,  F28D9/00 ,  F28F3/02

CPC分类号： H05K7/202 ,  F28D9/00 ,  F28F3/02 ,  G02F1/133385 ,  H05K7/20136 ,  H05K7/20163 ,  H05K7/20972

摘要： A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

摘要翻译： 一种用于具有开放和闭合的气体回路的电子图像组件的冷却组件。 封闭的气体回路允许循环气体穿过图像组件的前表面并通过热交换器。 开环允许环境气体通过热交换器并从循环气体中提取热量。 可以使用可选的附加开环来冷却图像组件的后部（可选地是背光）。 肋可以放置在可选的附加开环中，以便于传递到环境气体的热量。 冷却组件可以与用于产生图像的任何类型的电子组件一起使用。

公开(公告)号：US20140113540A1

公开(公告)日：2014-04-24

申请号：US14055499

申请日：2013-10-16

申请人： Manufacturing Resources International, Inc.

发明人： William Dunn ,  Mike Brown ,  Tim Hubbard

IPC分类号： H05K7/20

摘要： Exemplary embodiments disclosed herein provide a back pan cooling assembly for an electronic display having a rear pan. A cooling back pan is preferably positioned behind the rear pan, the space between the cooling back pan and the rear pan defining a gap. A fan is positioned to cause a flow of ambient air through the gap. An electronic component for driving the electronic display may be placed in conductive thermal communication with the cooling back pan. A rear cover can be placed against the cooling back pan to define a sealed compartment which does not permit ambient air to enter. A port can be provided within the rear cover which allows ambient air to travel between the surroundings, the fan, and the gap.

摘要翻译： 本文公开的示例性实施例提供了具有后盘的电子显示器的后平板冷却组件。 冷却后盘优选地定位在后盘后面，冷却后盘和后盘之间的空间限定间隙。 风扇被定位成使环境空气流过间隙。 用于驱动电子显示器的电子部件可以放置成与冷却后盘的导电热连通。 后盖可以抵靠冷却后盘放置，以限定不允许环境空气进入的密封隔间。 可以在后盖中提供端口，其允许环境空气在周围环境，风扇和间隙之间行进。

公开(公告)号：US20140111758A1

公开(公告)日：2014-04-24

申请号：US14050464

申请日：2013-10-10

申请人： Manufacturing Resources International, Inc.

发明人： William Dunn ,  Tim Hubbard

IPC分类号： H05K7/20 ,  G02F1/1333

CPC分类号： H05K7/202 ,  F28D9/00 ,  F28F3/02 ,  G02F1/133385 ,  H05K7/20136 ,  H05K7/20163 ,  H05K7/20972

摘要： A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

摘要翻译： 一种用于具有开放和闭合的气体回路的电子图像组件的冷却组件。 封闭的气体回路允许循环气体穿过图像组件的前表面并通过热交换器。 开环允许环境气体通过热交换器并从循环气体中提取热量。 可以使用可选的附加开环来冷却图像组件的后部（可选地是背光）。 肋可以放置在可选的附加开环中，以便于传递到环境气体的热量。 冷却组件可用于任何类型的用于产生图像的电子组件。

公开(公告)号：US20130170139A1

公开(公告)日：2013-07-04

申请号：US13759744

申请日：2013-02-05

申请人： Manufacturing Resources International, Inc.

发明人： William Dunn ,  Tim Hubbard ,  Ware Bedell

IPC分类号： G02F1/13

CPC分类号： G02F1/13 ,  F28F3/12 ,  G02F1/133385 ,  G02F1/133603 ,  G02F2001/133628 ,  G02F2201/36 ,  G05D23/1934 ,  H05K7/20972

摘要： A system and method for cooling an electronic image assembly having a plurality of cooling gas pathways place behind the electronic image assembly. A first fan may be used to force cooling gas through a first grouping of cooling gas pathways while a second fan may be used to force cooling gas through a second grouping of cooling gas pathways. Temperature sensing devices may be positioned so as to measure the temperature of the first and second groupings of cooling gas pathways. The speeds of the first and second fans may be adjusted based on the temperature measurements of the cooling gas pathway groupings. Additional fans with additional temperature sensing devices may be used for further accuracy and control over the temperature gradients of the electronic image assembly. Manifolds may be used to distribute/collect cooling gas to/from the cooling gas pathways.

摘要翻译： 用于冷却具有多个冷却气体通道的电子图像组件的系统和方法放置在电子图像组件的后面。 可以使用第一风扇来迫使冷却气体通过第一组冷却气体通道，而第二风扇可用于迫使冷却气体通过第二组冷却气体通道。 温度感测装置可以被定位成测量第一和第二组冷却气体通路的温度。 可以基于冷却气体通路组的温度测量来调节第一和第二风扇的速度。 可以使用具有附加温度感测装置的附加风扇来进一步精确地控制电子图像组件的温度梯度。 歧管可用于向/从冷却气体通道分配/收集冷却气体。