Flexible I/O connection system and method
    1.
    发明申请
    Flexible I/O connection system and method 有权
    灵活的I / O连接系统和方法

    公开(公告)号:US20080254684A1

    公开(公告)日:2008-10-16

    申请号:US11786098

    申请日:2007-04-11

    IPC分类号: H01R13/66

    摘要: A flexible input/output (I/O) connection system comprises an electronic device having a housing with at least one I/O window for receiving a connection to an external device, and a hub disposed in the housing and having a plurality of I/O connectors, the hub movable within the housing to position a select one of the plurality of I/O connectors in the I/O window.

    摘要翻译: 灵活的输入/输出(I / O)连接系统包括具有外壳的电子设备,所述外壳具有至少一个用于接收与外部设备的连接的I / O窗口,以及设置在外壳中并具有多个I / O连接器,毂可在壳体内移动以将I / O窗口中的多个I / O连接器中的一个选择一个定位。

    Flexible I/O connection system and method
    2.
    发明授权
    Flexible I/O connection system and method 有权
    灵活的I / O连接系统和方法

    公开(公告)号:US07540748B2

    公开(公告)日:2009-06-02

    申请号:US11786098

    申请日:2007-04-11

    IPC分类号: H01R13/44

    摘要: A flexible input/output (I/O) connection system comprises an electronic device having a housing with at least one I/O window for receiving a connection to an external device, and a hub disposed in the housing and having a plurality of I/O connectors, the hub movable within the housing to position a select one of the plurality of I/O connectors in the I/O window.

    摘要翻译: 灵活的输入/输出(I / O)连接系统包括具有外壳的电子设备,所述外壳具有至少一个用于接收与外部设备的连接的I / O窗口,以及设置在外壳中并具有多个I / O连接器,毂可在壳体内移动以将I / O窗口中的多个I / O连接器中的一个选择一个定位。

    Computer thermal dissipation system and method
    3.
    发明授权
    Computer thermal dissipation system and method 有权
    计算机散热系统及方法

    公开(公告)号:US07871319B2

    公开(公告)日:2011-01-18

    申请号:US10980029

    申请日:2004-11-03

    IPC分类号: G06F1/20

    CPC分类号: G06F1/203 G06F1/206

    摘要: A computer thermal dissipation system comprises a computer device having a base member and a display member where the computer device has at least one airflow door disposed on the base member adapted to be opened to facilitate thermal energy dissipation from the base member.

    摘要翻译: 计算机散热系统包括具有基座构件和显示构件的计算机设备,其中计算机设备具有设置在基座构件上的适于被打开的至少一个气流门,以便于从基座构件散热热能。

    Computer with integrated light
    5.
    发明授权
    Computer with integrated light 有权
    集成光计算机

    公开(公告)号:US09022592B2

    公开(公告)日:2015-05-05

    申请号:US13056853

    申请日:2008-08-21

    IPC分类号: F21V8/00 G06F1/16

    摘要: A computer system is described herein. An embodiment of the computer system comprises a first portion comprising a keyboard and a second portion comprising a display. A light source is affixed to the computer, wherein the light source is maintainable in at least a first position and a second position. When the light source is in the first position, light emitted by the light source illuminates the keyboard, and when the light source is in the second position, light emitted by the light source illuminates a spatial region occupied by a user of the computer.

    摘要翻译: 这里描述了计算机系统。 计算机系统的实施例包括包括键盘的第一部分和包括显示器的第二部分。 光源被固定到计算机,其中光源可在至少第一位置和第二位置维持。 当光源处于第一位置时,由光源发出的光照亮键盘,并且当光源处于第二位置时,由光源发出的光照亮计算机的用户所占据的空间区域。

    External device charging while notebook is off
    6.
    发明授权
    External device charging while notebook is off 有权
    笔记本电脑关机时外接设备充电

    公开(公告)号:US08583946B2

    公开(公告)日:2013-11-12

    申请号:US12866613

    申请日:2008-02-22

    IPC分类号: G06F1/26 H02J7/00

    CPC分类号: G06F1/266

    摘要: A computer comprises a power supply that provides operating power for the computer and a connector on the computer through which an external device can be coupled to the computer. The power supply powers an auxiliary power rail even when the computer is otherwise off. The auxiliary power rail is provided to the connector to thereby provide power to the external device even when the computer is off.

    摘要翻译: 计算机包括为计算机提供操作电力的电源和计算机上的连接器,外部设备可通过该连接器耦合到计算机。 即使计算机关闭,电源为辅助电源轨供电。 辅助电源轨被提供给连接器,从而即使当计算机关闭时也向外部设备供电。

    SYSTEM AND METHOD FOR COOLING AN ELECTRONIC DEVICE
    9.
    发明申请
    SYSTEM AND METHOD FOR COOLING AN ELECTRONIC DEVICE 审中-公开
    用于冷却电子设备的系统和方法

    公开(公告)号:US20110317364A1

    公开(公告)日:2011-12-29

    申请号:US13255629

    申请日:2009-04-14

    IPC分类号: H05K7/20

    CPC分类号: G06F1/203 G06F2200/201

    摘要: An exemplary embodiment of the present invention provides a system for cooling an electronic device. The system includes a plenum disposed adjacent to an interior surface of a housing for the electronic device, wherein the plenum is placed between a heat generating component and the interior surface of the housing, and wherein the plenum reduces heat transfer from the heat generating component to an exterior surface of the housing. The system also includes a fan configured to create an airflow in the plenum.

    摘要翻译: 本发明的示例性实施例提供了一种用于冷却电子设备的系统。 该系统包括邻近于用于电子设备的壳体的内表面设置的增压室,其中所述增压室被放置在发电部件和壳体的内表面之间,并且其中所述增压室减少从所述发热部件到 外壳的外表面。 该系统还包括风扇,其构造成在气室中产生气流。

    Systems and Method of a Carrier Device for Placement of Thermal Interface Materials
    10.
    发明申请
    Systems and Method of a Carrier Device for Placement of Thermal Interface Materials 有权
    用于放置热界面材料的载体装置的系统和方法

    公开(公告)号:US20110247785A1

    公开(公告)日:2011-10-13

    申请号:US13140832

    申请日:2008-12-29

    IPC分类号: F28F9/00 B23P19/00

    CPC分类号: G06F1/20

    摘要: Carrier device for placement of thermal interface materials. At least some embodiments are systems including a first electrical component that defines a first surface at a first elevation relative to an underlying structure, a second electrical component that defines a second surface at a second elevation relative to the underlying structure, a metallic member configured to conduct heat from the electrical components, and a carrier between the electrical components and the metallic member. The carrier includes a third and fourth surface configured to mate with the first and second surfaces, respectively, a first aperture through the third surface, and a second aperture through the fourth surface. The system further includes a first thermal interface material coupled between the first electrical component and the metallic member through the first aperture, and a second thermal interface material coupled between the second electrical component and the metallic member through the second aperture.

    摘要翻译: 用于放置热界面材料的载体装置。 至少一些实施例是包括第一电气部件的系统,所述第一电气部件相对于下面的结构在第一高度处限定第一表面;第二电气部件,其在相对于下方结构的第二高度处限定第二表面;金属部件, 从电气部件传导热量,以及电气部件和金属部件之间的载体。 载体包括第三和第四表面,其被配置为分别与第一和第二表面配合穿过第三表面的第一孔和穿过第四表面的第二孔。 该系统还包括通过第一孔耦合在第一电气部件和金属部件之间的第一热界面材料,以及通过第二孔连接在第二电气部件和金属部件之间的第二热界面材料。