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    Electroless plating processes
    1.
    发明授权
    Electroless plating processes 有权
    无电镀工艺

    公开(公告)号：US06861097B1

    公开(公告)日：2005-03-01

    申请号：US09172533

    申请日：1998-10-14

    申请人： Martin T. Goosey ,  John E. Graves ,  Joachim Buch ,  Mark A. Poole ,  Deborah Hirst ,  Rebecca Holland

    发明人： Martin T. Goosey ,  John E. Graves ,  Joachim Buch ,  Mark A. Poole ,  Deborah Hirst ,  Rebecca Holland

    IPC分类号： C23C18/34 ,  C23C18/16 ,  C23C18/30 ,  C23C18/44 ,  H05K3/18 ,  B05D3/00 ,  B31D3/00

    CPC分类号： C23C18/22 ,  C23C18/1653 ,  C23C18/1658 ,  H05K3/181

    摘要： The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. The activator can be suitably oxidized to a higher oxidation state electrochemically. Exposing a part to be plated (such as an organic resin, e.g. a printed circuit board substrate) to the solution enables reactive hydroxyl species (e.g. hydroxyl radicals) to be generated and to texture the polymer surface. Such texturing facilitates good plated metal adhesion. As part of this contacting process sufficient time is allowed for both surface texturing to take place and for the oxidized metal activator to adsorb onto said part. The part is then contacted with a reducing agent capable of reducing the metal activator to a lower ionic form, or a lower oxidation state. That reduction can result in the formation of metallic catalytic material over the surface of the part. The reduced metal activator can then function to catalyze the electroless deposition of metal such as copper from solution by contacting the part with the plating solution.

    摘要翻译： 本发明包括用于组合聚合物表面处理和金属沉积的方法。 本发明的方法包括形成含有金属活化剂的水溶液，例如银，钴，钌，铈，铁，锰，镍，铑或钒的氧化物质。 活化剂可以电化学适当地氧化成更高的氧化态。 将待镀的部件（例如有机树脂，例如印刷电路板基板）暴露于溶液使得能够产生反应性羟基（例如羟基自由基）并且使聚合物表面纹理化。 这种纹理有利于良好的电镀金属附着力。 作为该接触过程的一部分，允许足够的时间发生两种表面纹理，并且使氧化的金属活化剂吸附到所述部分上。 然后将该部分与能够将金属活化剂还原成较低离子形式或较低氧化态的还原剂接触。 这种减少可导致在部件的表面上形成金属催化材料。 然后还原的金属活化剂可以通过使该部分与电镀溶液接触而起作用来催化从溶液中金属如铜的无电沉积。

    Combined adhesion promotion and direct metallization process
    2.
    发明授权
    Combined adhesion promotion and direct metallization process 失效
    组合粘合促进和直接金属化过程

    公开(公告)号：US06790334B2

    公开(公告)日：2004-09-14

    申请号：US10210535

    申请日：2002-08-02

    申请人： Zatoon Begum ,  Martin T. Goosey ,  John E. Graves ,  Mark A. Poole ,  Amrik Singh

    发明人： Zatoon Begum ,  Martin T. Goosey ,  John E. Graves ,  Mark A. Poole ,  Amrik Singh

    IPC分类号： C25D554

    CPC分类号： H05K3/188 ,  C25D5/56

    摘要： A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the textured non-conductive substrate to provide an electrically conductive surface on the non-conductive substrate. After the surface of the non-conductive substrate has been made electrically conductive, the surface of the non-conductive substrate can be directly metallized. The method reduces the number of process steps for direct metallization of a non-conductive substrate. Thus, the method is more efficient in contrast to conventional methods of metallizing a non-conductive substrate.

    摘要翻译： 金属与非导电性基板的组合粘合促进方法，并用非金属化直接金属化非导电性基板。 该方法包括用钴蚀刻对非导电衬底进行纹理化，然后将硫化物施加到纹理非导电衬底上，以在非导电衬底上提供导电表面。 在非导电衬底的表面已经制成导电之后，非导电衬底的表面可以直接金属化。 该方法减少了用于非导电衬底的直接金属化的工艺步骤的数量。 因此，与传统的非导电衬底的金属化方法相比，该方法更有效。