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公开(公告)号：US5415762A
公开(公告)日：1995-05-16
申请号：US108976
申请日：1993-08-18
摘要： A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.
摘要翻译： 一种用于电镀非导电衬底的方法，包括在非导电衬底的表面上形成导电聚合物膜并在其上电解金属沉积。 导电膜通过从所述聚合物的水性悬浮液沉积到所述表面上而形成。
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公开(公告)号：US5528000A
公开(公告)日：1996-06-18
申请号：US395685
申请日：1995-02-28
摘要： A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.
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公开(公告)号：US20080035489A1
公开(公告)日：2008-02-14
申请号：US11588520
申请日：2006-10-27
申请人： George R. Allardyce , Kevin Bass , Joachim Rasch
发明人： George R. Allardyce , Kevin Bass , Joachim Rasch
CPC分类号： H01L31/022425 , C23C18/1605 , C23C18/1608 , C23C18/1614 , C23C18/1642 , C23C18/165 , C23C18/1667 , C23C18/38 , C23C18/42 , C25D3/46 , C25D5/006 , C25D7/126 , Y02E10/50
摘要： Methods of plating electrical contacts on a photosensitive device are provided. Also provided are methods of plating electrical contacts on solar cells.
摘要翻译： 提供了在感光装置上电镀电触点的方法。 还提供了在太阳能电池上电镀电触点的方法。
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公开(公告)号：US07955978B2
公开(公告)日：2011-06-07
申请号：US12868535
申请日：2010-08-25
IPC分类号： H01L21/44
CPC分类号： C25D5/12 , C23C18/1605 , C23C18/1642 , C23C18/1653 , C23C18/1667 , C23C18/1692 , C23C18/32 , C25D5/50 , C25D7/126 , H01L21/28518 , H01L21/288 , H01L21/76889 , H01L31/022425
摘要： Silicon containing substrates are coated with nickel. The nickel is coated with a protective layer and the combination is heated to a sufficient temperature to form nickel silicide. The nickel silicide formation may be performed in oxygen containing environments.
摘要翻译： 含硅衬底涂覆有镍。 镍被涂覆有保护层，并将组合物加热到足够的温度以形成硅化镍。 硅化镍形成可以在含氧环境中进行。
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公开(公告)号：US20130240368A1
公开(公告)日：2013-09-19
申请号：US13607737
申请日：2012-09-09
申请人： George R. Allardyce , Gary Hamm , Narsmoul Karaya
发明人： George R. Allardyce , Gary Hamm , Narsmoul Karaya
IPC分类号： C25D5/54
摘要： Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit.
摘要翻译： 铜电镀方法提供低内应力铜沉积。 铜电镀浴中的促进剂浓度随电镀电流密度的变化而变化，低内应力铜沉积物被观察为无光铜沉积物。
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公开(公告)号：US20120184098A1
公开(公告)日：2012-07-19
申请号：US13324332
申请日：2011-12-13
申请人： Gary Hamm , Jason A. Reese , George R. Allardyce
发明人： Gary Hamm , Jason A. Reese , George R. Allardyce
IPC分类号： H01L21/768 , H01L21/28
CPC分类号： H01L24/03 , C25D3/12 , C25D5/00 , C25D5/12 , C25D7/123 , C25D11/32 , C25F3/12 , H01L31/022425 , H01L31/1804 , H01L2924/12036 , H01L2924/12042 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.
摘要翻译： 半导体在含有二氟化物和镍离子源的溶液中进行电化学蚀刻。 电化学蚀刻可以在纳米范围内在半导体的表面中形成孔。 然后将蚀刻的半导体镀镍。
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公开(公告)号：US09493886B2
公开(公告)日：2016-11-15
申请号：US13607737
申请日：2012-09-09
申请人： George R. Allardyce , Gary Hamm , Narsmoul Karaya
发明人： George R. Allardyce , Gary Hamm , Narsmoul Karaya
摘要： Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit.
摘要翻译： 铜电镀方法提供低内应力铜沉积。 铜电镀浴中的促进剂浓度随电镀电流密度的变化而变化，低内应力铜沉积物被观察为无光铜沉积物。
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8.发明申请TEXTURING OF MONOCRYSTALLINE SEMICONDUCTOR SUBSTRATES TO REDUCE INCIDENT LIGHT REFLECTANCE 审中-公开单晶半导体衬底的纹理化以减少偶发的光反射公开(公告)号：US20140004701A1
公开(公告)日：2014-01-02
申请号：US13535224
申请日：2012-06-27
IPC分类号： C09K13/02 , H01L21/302
CPC分类号： H01L31/02168 , H01L31/02363 , Y02E10/50
摘要： Monocrystalline semiconductor substrates are textured with alkaline solutions to form pyramid structures on their surfaces to reduce incident light reflectance and improve light absorption of the wafers. The alkaline baths include compounds which inhibit the formation of flat areas between pyramid structures to improve the light adsorption.
摘要翻译： 单晶半导体衬底用碱性溶液织构，以在其表面上形成金字塔结构，以减少入射光反射率并改善晶片的光吸收。 碱性浴包括抑制在金字塔结构之间形成平坦区域以改善光吸附的化合物。
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公开(公告)号：US08603314B2
公开(公告)日：2013-12-10
申请号：US13324332
申请日：2011-12-13
申请人： Gary Hamm , Jason A. Reese , George R. Allardyce
发明人： Gary Hamm , Jason A. Reese , George R. Allardyce
CPC分类号： H01L24/03 , C25D3/12 , C25D5/00 , C25D5/12 , C25D7/123 , C25D11/32 , C25F3/12 , H01L31/022425 , H01L31/1804 , H01L2924/12036 , H01L2924/12042 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.
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公开(公告)号：US06265020B1
公开(公告)日：2001-07-24
申请号：US09387472
申请日：1999-09-01
IPC分类号： B05D136
CPC分类号： C25D5/08 , C23C18/1619 , H05K3/0088
摘要： The present invention relates to new methods for delivering solutions during electronic device manufacture. Methods of the invention include delivering metallization solutions to the device at an angle of less than 90 degrees with the surface of the device. The method may further comprise partially treating the device by delivering the metallization solutions from above the device, turning the device over, and then completing treatment by delivering the metallization solutions from below the article. The method is particularly useful in the formation of printed circuit boards and other electronic packaging devices having through-holes and blind vias.
摘要翻译： 本发明涉及在电子设备制造期间传送解决方案的新方法。 本发明的方法包括以与装置的表面成小于90度的角度将金属化溶液递送到装置。 该方法还可以包括通过从装置上方递送金属化溶液来部分地处理装置，使装置翻转，然后通过从制品下方递送金属化溶液来完成处理。 该方法在形成具有通孔和盲孔的印刷电路板和其它电子封装装置中特别有用。
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