公开(公告)号：US20240258272A1

公开(公告)日：2024-08-01

申请号：US18421366

申请日：2024-01-24

申请人： Marvell Asia Pte Ltd

发明人： Aatreya Chakravarti ,  Mark William Kuemerle ,  Wolfgang Sauter ,  Carlos Macian Ruiz ,  John Edward Gregory, JR. ,  Eva Shah Holmes ,  Samer Michael Akiki

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L23/48 ,  H01L25/00

CPC分类号： H01L25/0652 ,  H01L23/481 ,  H01L25/50 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204

摘要： An integrated circuit device includes a main integrated circuit die having functional circuitry configured to communicate over a network through one or more high-speed communications interfaces, and at least one secondary integrated circuit die including serial interface circuitry. Each integrated circuit die among the at least one secondary integrated circuit die is mounted on a first surface of the main integrated circuit die, and first metallization connections extend along one or more first through-silicon vias between the functional circuitry and the serial interface circuitry of the at least one secondary integrated circuit die. The first metallization connections may be configured to provide data from the main die to the secondary die, and the secondary die may be configured to communicate data between the integrated circuit device and a remote integrated circuit device. Second metallization connections extend between the serial interface circuitry of and terminals of the main integrated circuit die.