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公开(公告)号：US07291226B2
公开(公告)日：2007-11-06
申请号：US10956938
申请日：2004-09-30
CPC分类号： B41J2/1601 , B41J2/1623 , B41M1/12 , B41M3/006 , Y10T29/49401 , Y10T156/1798
摘要： A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the stencil during production.
摘要翻译： 描述了将密封剂施加到喷墨打印头主体上的渐进式模板印刷系统和方法。 该系统涉及一种可在不同类型的喷墨打印头主体上印刷密封剂并在生产期间清洁模板的连续模版印刷设备。
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公开(公告)号：US07121647B2
公开(公告)日：2006-10-17
申请号：US10679070
申请日：2003-10-02
IPC分类号： B41J2/16
CPC分类号： B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2/1753 , B41J2/1754
摘要： A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includes providing a stencil having at least one aperture, providing an ink jet cartridge and stencil printing an encapsulant material onto a portion of the ink jet print cartridge thereby forming a layer of encapsulant material to protect electrical components or other printhead components.
摘要翻译： 提供了一种模板印刷的密封剂材料，用于保护热喷墨打印头墨盒中的电气部件。 还提供了通过模板印刷将密封材料施加到喷墨打印盒的方法。 该方法包括提供具有至少一个孔的模板，提供喷墨墨盒和将密封材料模版印刷到喷墨打印墨盒的一部分上，从而形成密封材料层以保护电气部件或其它打印头部件。
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公开(公告)号：US07690115B2
公开(公告)日：2010-04-06
申请号：US11386174
申请日：2006-03-22
CPC分类号： B41J2/17559 , B41J2/17513 , B41J2/1752 , B41J2/17526 , B41J2/17553 , C07D235/18 , C07D401/12 , C07D403/12 , Y10S29/001 , Y10T29/4913 , Y10T29/49155 , Y10T29/49401 , Y10T29/49798 , Y10T156/1062
摘要： A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.
摘要翻译： 提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。 盒体包含与容纳部位流体连通的流体供给路径。 在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。 每个喷射头基板具有流体供应侧和两个或更多个流体流动路径，用于将流体从供给侧提供到其装置侧。 喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。 切割晶片以提供多个微流体喷射装置结构。 电路装置连接到每个基板的装置侧。 在微流体喷射装置结构或盒体上，用粘合线印刷粘合线密度为至少约1.2mm-1的粘合剂。 微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上，用于将流体从容纳区域流动到其装置侧。
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公开(公告)号：US07043838B2
公开(公告)日：2006-05-16
申请号：US10880899
申请日：2004-06-30
CPC分类号： B41J2/17559 , B41J2/17513 , B41J2/1752 , B41J2/17526 , B41J2/17553 , C07D235/18 , C07D401/12 , C07D403/12 , Y10S29/001 , Y10T29/4913 , Y10T29/49155 , Y10T29/49401 , Y10T29/49798 , Y10T156/1062
摘要： A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.
摘要翻译： 提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。 盒体包含与容纳部位流体连通的流体供给路径。 在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。 每个喷射头基板具有流体供应侧和两个或更多个流体流动路径，用于将流体从供给侧提供到其装置侧。 喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。 切割晶片以提供多个微流体喷射装置结构。 电路装置连接到每个基板的装置侧。 在微流体喷射装置结构上或筒体上的粘合线密度为至少约1.2mm -1的粘合线密度的粘合剂。 微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上，用于将流体从容纳区域流动到其装置侧。
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