公开(公告)号：US08188805B2

公开(公告)日：2012-05-29

申请号：US12532551

申请日：2008-02-26

申请人： Taketo Nomura ,  Masahiko Oota ,  Hisayoshi Mizugaki ,  Yuichi Shimayama ,  Takashi Saitou ,  Masaya Kirihara ,  Keisuke Iijima

发明人： Taketo Nomura ,  Masahiko Oota ,  Hisayoshi Mizugaki ,  Yuichi Shimayama ,  Takashi Saitou ,  Masaya Kirihara ,  Keisuke Iijima

IPC分类号： H01P5/107

CPC分类号： H01P5/107

摘要： A ground conductor (1) has a through hole provided through an area thereof for connection with a waveguide (6), with dimensions substantially equal to cavity dimensions of the waveguide (6), and a metallic spacer (7a) is provided as a holding element for a film substrate (4), with an even thickness to a dielectric substrate (2a), the metallic spacer (7a) having dimensions E1 and E2 of cavity walls thereof changed in accordance with a desirable frequency, and cooperating with another metallic spacer (7b) having substantially equal dimensions to the metallic spacer (7a), to sandwich the film substrate (4) in between, and in addition, an upper ground conductor (5) is arranged on the other metallic spacer (7b), and a quadrate resonant patch pattern (8) is formed at an end of the strip line conductor (3) formed to the film subs ate (4), on an area corresponding to a transducer end of the waveguide (6), while a combination of the quadrate resonant patch pattern (8) and the waveguide (6) is arranged such that the quadrate resonant patch pattern (8) has a center position thereof coincident with a center position of the cavity dimensions of the waveguide (6).

摘要翻译： 接地导体（1）具有通过其面积设置的通孔，用于与波导（6）连接，其尺寸基本上等于波导（6）的腔体尺寸，并且金属间隔件（7a）被设置为保持 用于薄膜基板（4）的元件，其厚度均匀到电介质基板（2a），其空腔壁尺寸为E1和E2的金属间隔件（7a）根据期望的频率而变化，并与另一金属间隔件 （7b）具有与金属间隔件（7a）基本上相等的尺寸，以将薄膜基板（4）夹在中间，此外，在另一个金属间隔件（7b）上设置上接地导体（5），并且 在与波导管（6）的换能器端相对应的区域上，在形成于薄膜电极（4）的带状导体（3）的端部形成有方形谐振贴片图案（8） 方形谐振贴片图案（8）和波导（6）是a 使得方形谐振贴片图案（8）的中心位置与波导（6）的腔体尺寸的中心位置重合。

公开(公告)号：US07411553B2

公开(公告)日：2008-08-12

申请号：US11575099

申请日：2005-10-25

申请人： Masahiko Oota ,  Hisayoshi Mizugaki ,  Keisuke Iijima ,  Takashi Saitou ,  Masaya Kirihara

发明人： Masahiko Oota ,  Hisayoshi Mizugaki ,  Keisuke Iijima ,  Takashi Saitou ,  Masaya Kirihara

IPC分类号： H01Q1/38

CPC分类号： H01Q21/0025 ,  H01P5/107 ,  H01Q21/061 ,  H01Q21/065

摘要： The present invention provides inexpensively a planar antenna module that is able to realize a loss reduction, a reduction in characteristic variation caused by an assembling error, and an improved stability in frequency characteristics.A planar antenna module according to one preferred embodiment of the present invention comprises an antenna portion (101), a feeder portion (102), and a connection plate (18). The antenna portion (101) includes a first ground plate (11) having a first slot (21), a second ground plate (12) having dielectrics, an antenna substrate having a radiation element (41), a third ground plate (13) having dielectrics, a fourth ground plate (14). The feeder portion (102) includes the fourth ground plate (14), a fifth ground plate (15), a feed substrate (50), a sixth ground plate (16), a seventh ground plate (17). The connection plate (18) has a second waveguide opening portion (64). The connection plate (18) to be connected with a high frequency circuit, the seventh ground plate (17), the sixth ground plate (16), the feed substrate (50), the fifth ground plate (15), the fourth ground plate (14), the third ground plate (13) including the third dielectric (33) and the fourth dielectric (34), the antenna substrate (40), the second ground plate (12) including the first dielectric (31) and the second dielectric (32), and the first ground plate (11) are stacked in this order.

摘要翻译： 本发明廉价地提供能够实现损耗减小，由组装误差引起的特性变化的降低以及频率特性的改善的稳定性的平面天线模块。 根据本发明的一个优选实施例的平面天线模块包括天线部分（101），馈线部分（102）和连接板（18）。 天线部分（101）包括具有第一槽（21）的第一接地板（11），具有电介质的第二接地板（12），具有辐射元件（41）的天线基板，第三接地板（13） 具有电介质，第四接地板（14）。 馈电部分（102）包括第四接地板（14），第五接地板（15），馈电基板（50），第六接地板（16），第七接地板（17）。 连接板（18）具有第二波导开口部（64）。 与高频电路连接的连接板（18），第七接地板（17），第六接地板（16），馈电基板（50），第五接地板（15），第四接地板 （14），包括第三电介质（33）和第四电介质（34）的第三接地板（13），天线基板（40），第二接地板（12）包括第一电介质（31）和第二电介质 电介质（32）和第一接地板（11）按顺序堆叠。

公开(公告)号：US20100085133A1

公开(公告)日：2010-04-08

申请号：US12532551

申请日：2008-02-26

申请人： Taketo Nomura ,  Masahiko Oota ,  Hisayoshi Mizugaki ,  Yuichi Shimayama ,  Takashi Saitou ,  Masaya Kirihara ,  Keisuke Iijima

发明人： Taketo Nomura ,  Masahiko Oota ,  Hisayoshi Mizugaki ,  Yuichi Shimayama ,  Takashi Saitou ,  Masaya Kirihara ,  Keisuke Iijima

IPC分类号： H01P1/00

CPC分类号： H01P5/107

摘要： A ground conductor (1) has a through hole provided through an area thereof for connection with a waveguide (6), with dimensions substantially equal to cavity dimensions of the waveguide (6), and a metallic spacer (7a) is provided as a holding element for a film substrate (4), with an even thickness to a dielectric substrate (2a), the metallic spacer (7a) having dimensions E1 and E2 of cavity walls thereof changed in accordance with a desirable frequency, and cooperating with another metallic spacer (7b) having substantially equal dimensions to the metallic spacer (7a), to sandwich the film substrate (4) in between, and in addition, an upper ground conductor (5) is arranged on the other metallic spacer (7b), and a quadrate resonant patch pattern (8) is formed at an end of the strip line conductor (3) formed to the film subs ate (4), on an area corresponding to a transducer end of the waveguide (6), while a combination of the quadrate resonant patch pattern (8) and the waveguide (6) is arranged such that the quadrate resonant patch pattern (8) has a center position thereof coincident with a center position of the cavity dimensions of the waveguide (6).

摘要翻译： 接地导体（1）具有通过其面积设置的通孔，用于与波导（6）连接，其尺寸基本上等于波导（6）的腔体尺寸，并且金属间隔件（7a）被设置为保持 用于薄膜基板（4）的元件，其厚度均匀到电介质基板（2a），其空腔壁尺寸为E1和E2的金属间隔件（7a）根据期望的频率而变化，并与另一金属间隔件 （7b）具有与金属间隔件（7a）基本上相等的尺寸，以将薄膜基板（4）夹在中间，此外，在另一个金属间隔件（7b）上设置上接地导体（5），并且 在与波导管（6）的换能器端相对应的区域上，在形成于薄膜电极（4）的带状导体（3）的端部形成有方形谐振贴片图案（8） 方形谐振贴片图案（8）和波导（6）是a 使得方形谐振贴片图案（8）的中心位置与波导（6）的腔体尺寸的中心位置重合。

公开(公告)号：US20070229380A1

公开(公告)日：2007-10-04

申请号：US11575099

申请日：2005-10-25

申请人： Masahiko Oota ,  Hisayoshi Mizugaki ,  Keisuke Iijima ,  Takashi Saitou ,  Masaya Kirihara

发明人： Masahiko Oota ,  Hisayoshi Mizugaki ,  Keisuke Iijima ,  Takashi Saitou ,  Masaya Kirihara

IPC分类号： H01Q21/08 ,  H01Q3/00

CPC分类号： H01Q21/0025 ,  H01P5/107 ,  H01Q21/061 ,  H01Q21/065

摘要： The present invention provides inexpensively a planar antenna module that is able to realize a loss reduction, a reduction in characteristic variation caused by an assembling error, and an improved stability in frequency characteristics. A planar antenna module according to one preferred embodiment of the present invention comprises an antenna portion (101), a feeder portion (102), and a connection plate (18). The antenna portion (101) includes a first ground plate (11) having a first slot (21), a second ground plate (12) having dielectrics, an antenna substrate having a radiation element (41), a third ground plate (13) having dielectrics, a fourth ground plate (14). The feeder portion (102) includes the fourth ground plate (14), a fifth ground plate (15), a feed substrate (50), a sixth ground plate (16), a seventh ground plate (17). The connection plate (18) has a second waveguide opening portion (64). The connection plate (18) to be connected with a high frequency circuit, the seventh ground plate (17), the sixth ground plate (16), the feed substrate (50), the fifth ground plate (15), the fourth ground plate (14), the third ground plate (13) including the third dielectric (33) and the fourth dielectric (34), the antenna substrate (40), the second ground plate (12) including the first dielectric (31) and the second dielectric (32), and the first ground plate (11) are stacked in this order.

摘要翻译： 本发明廉价地提供能够实现损耗减小，由组装误差引起的特性变化的降低以及频率特性的改善的稳定性的平面天线模块。 根据本发明的一个优选实施例的平面天线模块包括天线部分（101），馈线部分（102）和连接板（18）。 天线部分（101）包括具有第一槽（21）的第一接地板（11），具有电介质的第二接地板（12），具有辐射元件（41）的天线基板，第三接地板（13） 具有电介质，第四接地板（14）。 馈电部分（102）包括第四接地板（14），第五接地板（15），馈电基板（50），第六接地板（16），第七接地板（17）。 连接板（18）具有第二波导开口部（64）。 与高频电路连接的连接板（18），第七接地板（17），第六接地板（16），馈电基板（50），第五接地板（15），第四接地板 （14），包括第三电介质（33）和第四电介质（34）的第三接地板（13），天线基板（40），第二接地板（12）包括第一电介质（31）和第二电介质 电介质（32）和第一接地板（11）按顺序堆叠。

公开(公告)号：US08253511B2

公开(公告)日：2012-08-28

申请号：US12169953

申请日：2008-07-09

申请人： Masahiko Oota ,  Hisayoshi Mizugaki ,  Keisuke Iijima ,  Takashi Saitou ,  Masaya Kirihara

发明人： Masahiko Oota ,  Hisayoshi Mizugaki ,  Keisuke Iijima ,  Takashi Saitou ,  Masaya Kirihara

IPC分类号： H01P5/107

CPC分类号： H01Q21/0025 ,  H01P5/107 ,  H01Q21/061 ,  H01Q21/065

摘要： A planar antenna module according to one preferred embodiment of the present invention comprises an antenna portion (101), a feeder portion (102), and a connection plate (18). The antenna portion (101) includes a first ground plate (11) having a first slot (21), a second ground plate (12) having dielectrics, an antenna substrate having a radiation element (41), a third ground plate (13) having dielectrics, a fourth ground plate (14). The feeder portion (102) includes the fourth ground plate (14), a fifth ground plate (15), a feed substrate (50), a sixth ground plate (16), a seventh ground plate (17). The connection plate (18) has a second waveguide opening portion (64). The connection plate (18) to be connected with a high frequency circuit, the seventh ground plate (17), the sixth ground plate (16), the feed substrate (50), the fifth ground plate (15), the fourth ground plate (14), the third ground plate (13) including the third dielectric (33) and the fourth dielectric (34), the antenna substrate (40), the second ground plate (12) including the first dielectric (31) and the second dielectric (32), and the first ground plate (11) are stacked in this order.

摘要翻译： 根据本发明的一个优选实施例的平面天线模块包括天线部分（101），馈线部分（102）和连接板（18）。 天线部分（101）包括具有第一槽（21）的第一接地板（11），具有电介质的第二接地板（12），具有辐射元件（41）的天线基板，第三接地板（13） 具有电介质，第四接地板（14）。 馈电部分（102）包括第四接地板（14），第五接地板（15），馈电基板（50），第六接地板（16），第七接地板（17）。 连接板（18）具有第二波导开口部（64）。 与高频电路连接的连接板（18），第七接地板（17），第六接地板（16），馈电基板（50），第五接地板（15），第四接地板 （14），包括第三电介质（33）和第四电介质（34）的第三接地板（13），天线基板（40），第二接地板（12）包括第一电介质（31）和第二电介质 电介质（32）和第一接地板（11）按顺序堆叠。

公开(公告)号：US20070171127A1

公开(公告)日：2007-07-26

申请号：US10587906

申请日：2005-02-28

申请人： Hisayoshi Mizugaki ,  Masahiko Oota

发明人： Hisayoshi Mizugaki ,  Masahiko Oota

IPC分类号： H01Q1/38

CPC分类号： H01Q21/065 ,  H01Q21/064

摘要： A triplate-type planar array antenna is provided with an antenna circuit board (3) on which an antenna circuit including a plurality of radiating elements (5), which are vertically and horizontally arrayed in a two-dimensional manner, and feedlines (6) is formed; two pieces of dielectric substances (2a, 2b) between which the antenna circuit board (3) is sandwiched at the both sides; a ground conductor (1) laminated on one dielectric substance (2b); and a slot board (4) laminated on the other dielectric substance (2a). One or more slot openings (7) corresponding to the plurality of radiating elements (5) with a linear arrangement are formed on the slot board (4).

摘要翻译： 三板式平面阵列天线设置有天线电路板（3），其中包括以二维方式垂直和水平排列的多个辐射元件（5）的天线电路和馈线（6） 形成了; 天线电路板（3）夹在两侧之间的两片电介质物质（2a，2b）; 层叠在一个电介质物质（2b）上的接地导体（1）; 和层叠在另一个电介质物质（2a）上的槽板（4）。 在槽板（4）上形成有与线形排列的多个辐射元件（5）对应的一个或多个槽口（7）。

公开(公告)号：US20110050534A1

公开(公告)日：2011-03-03

申请号：US12869158

申请日：2010-08-26

申请人： Yuuichi Shimayama ,  Masahiko Oota ,  Takashi Saitou

发明人： Yuuichi Shimayama ,  Masahiko Oota ,  Takashi Saitou

IPC分类号： H01Q1/50

CPC分类号： H01P5/028 ,  H01Q1/3233 ,  H01Q21/0006

摘要： Provided is a triplate line inter-layer connector having excellent loss suppression capability and allowing for inter-layer connection at any position, and a planar array antenna having uniform frequency characteristics in a beam direction. The triplate line inter-layer connector has an electrical connection structure between a first triplate line and a second triplate line. A first patch pattern is formed at a connection-side terminal end of a first feeder line. A first feed substrate has a first shield spacer disposed therebeneath, and a second shield spacer disposed just thereabove. Each of the first and second shield spacers has a hollow portion hollowed out to a size encompassing the first feeder line and the first patch pattern so as to define a corresponding one of first and second dielectrics in a respective one of the positions beneath and just above the first feed substrate. A second feeder line is provided on a second feed substrate together with a second patch pattern to extend in two directions from the second patch pattern to respective two output ends of the second feeder line, and a second ground conductor has a first slit formed in a portion thereof located approximately intermediate between the first and second patch patterns. The planar array antenna has a multi-layer structure comprising an antenna section and a transmission line section. The antenna section includes an antenna substrate and a first ground conductor having a slit. The antenna substrate has an antenna region which comprises a feeder line connected to respective radiation elements of the radiation element array. The feeder line, the slit and the patch pattern are provided at respective positions approximately corresponding to each other. Respective shapes and positions of the slit and the feeder line in a thicknesswise direction of the planar array antenna are adjusted to satisfy the following relation: d1

公开(公告)号：US08643564B2

公开(公告)日：2014-02-04

申请号：US12869158

申请日：2010-08-26

申请人： Yuuichi Shimayama ,  Masahiko Oota ,  Takashi Saitou

发明人： Yuuichi Shimayama ,  Masahiko Oota ,  Takashi Saitou

IPC分类号： H01Q1/50

CPC分类号： H01P5/028 ,  H01Q1/3233 ,  H01Q21/0006

摘要： A triplate line inter-layer connector and a planar array antenna are provided. The triplate line inter-layer connector has an electrical connection structure between a first triplate line and a second triplate line, a first patch pattern formed at a connection-side terminal end of a first feeder line, a first feed substrate having a first shield spacer disposed therebeneath, and a second shield spacer disposed thereabove. Each of the first and second shield spacers has a hollow portion hollowed out to a size encompassing the first feeder line and the first patch pattern so as to define a corresponding one of first and second dielectrics. A second feeder line is provided on a second feed substrate together with a second patch pattern, and a second ground conductor has a first slit formed in a portion thereof located approximately intermediate between the first and second patch patterns.

摘要翻译： 提供三板式线路层间连接器和平面阵列天线。 三板线层间连接器具有在第一板板线和第二板板线之间的电连接结构，形成在第一馈电线的连接侧终端处的第一贴片图案，具有第一屏蔽间隔件 设置在其下方，以及设置在其上方的第二屏蔽间隔件。 第一和第二屏蔽间隔物中的每一个具有中空部分，该中空部分被挖空至围绕第一馈电线和第一贴片图案的尺寸，以便限定第一和第二电介质中相应的一个。 第二馈电线与第二贴片图案一起设置在第二馈电衬底上，并且第二接地导体具有形成在其位于第一和第二贴片图案之间大致中间的部分中的第一狭缝。

公开(公告)号：USD656500S1

公开(公告)日：2012-03-27

申请号：US29388028

申请日：2011-03-23

申请人： Kazuhiro Maruyama ,  Masahiko Oota

设计人： Kazuhiro Maruyama ,  Masahiko Oota

公开(公告)号：US20080102268A1

公开(公告)日：2008-05-01

申请号：US11883132

申请日：2006-01-26

申请人： Koichiro Higasa ,  Yoshinori Ito ,  Masahiko Oota ,  Yoshinori Igarashi

发明人： Koichiro Higasa ,  Yoshinori Ito ,  Masahiko Oota ,  Yoshinori Igarashi

IPC分类号： B32B27/40 ,  C08G18/00 ,  B32B5/00 ,  B32B38/04

CPC分类号： C09J175/04 ,  B05C5/0254 ,  B05C5/027 ,  B32B37/1284 ,  B32B37/153 ,  B32B2309/02 ,  B32B2425/00 ,  B42D25/47 ,  C08G18/12 ,  C08G18/4812 ,  G06K19/077 ,  G06K19/07718 ,  Y10T156/1052 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/269 ,  Y10T428/31551 ,  C08G18/3206

摘要： A process for producing an IC card comprising: an application/bonding step of applying an adhesive having a curing rate ratio (80° C./40° C.) of 30 or more on the surface of an inlet film, on which a number of IC modules are mounted, and/or a skin film for covering at least one surface of the inlet film, and bonding the inlet film and the skin film together to form a laminate film; a curing step of curing the adhesive to form a cured resin layer between the inlet film and the skin film of the laminate film; and a card forming step of forming a number of IC cards by dividing the laminate film for each IC module.

摘要翻译： 一种用于制造IC卡的方法，包括：施加/粘合步骤，其在入口膜的表面上施加具有30或更高固化速率比（80℃/ 40℃）的粘合剂， 的IC模块，和/或用于覆盖入口膜的至少一个表面的皮肤膜，并将入口膜和皮肤膜结合在一起以形成层压膜; 固化步骤，使所述粘合剂固化以在所述层压膜的所述入口膜和所述皮膜之间形成固化树脂层; 以及卡形成步骤，通过分割每个IC模块的层叠膜形成多个IC卡。