摘要:
A process for producing an IC card comprising: an application/bonding step of applying an adhesive having a curing rate ratio (80° C./40° C.) of 30 or more on the surface of an inlet film, on which a number of IC modules are mounted, and/or a skin film for covering at least one surface of the inlet film, and bonding the inlet film and the skin film together to form a laminate film; a curing step of curing the adhesive to form a cured resin layer between the inlet film and the skin film of the laminate film; and a card forming step of forming a number of IC cards by dividing the laminate film for each IC module.
摘要:
A urethane adhesive composition includes a first liquid and a second liquid, the first liquid containing a prepolymer obtained by reacting a polyisocyanate and a high-molecular-weight polyol (I), and at least one filler selected from talc and calcium carbonate, and containing 20 parts by mass or more of talc, 0 to 40 parts by mass of calcium carbonate, and 10 parts by mass or more of zeolite based on 100 parts by mass of the polyisocyanate, the high-molecular-weight polyol (I), and the prepolymer in total, the second liquid containing a high-molecular-weight polyol (II) and a low-molecular-weight polyol, the ratio of the number of moles of hydroxyl groups derived from the low-molecular-weight polyol to the total number of moles of hydroxyl groups derived from the high-molecular-weight polyol (I) and the high-molecular-weight polyol (II) being four or more.
摘要:
A urethane adhesive composition includes a first liquid and a second liquid, the first liquid containing a prepolymer obtained by reacting a polyisocyanate and a high-molecular-weight polyol (I), and at least one filler selected from talc and calcium carbonate, and containing 20 parts by mass or more of talc, 0 to 40 parts by mass of calcium carbonate, and 10 parts by mass or more of zeolite based on 100 parts by mass of the polyisocyanate, the high-molecular-weight polyol (I), and the prepolymer in total, the second liquid containing a high-molecular-weight polyol (II) and a low-molecular-weight polyol, the ratio of the number of moles of hydroxyl groups derived from the low-molecular-weight polyol to the total number of moles of hydroxyl groups derived from the high-molecular-weight polyol (I) and the high-molecular-weight polyol (II) being four or more.
摘要:
Provided is the one-pack type backing resin composition which exhibits excellent fall-off resistance, excellent storage stability, and high flame retardancy. A one-pack type backing resin composition includes 100 parts by mass of (A) a (meth)acrylic polymer, and 50 to 500 parts by mass of (B) a flame retardant, the (meth)acrylic polymer (A) being produced by emulsion polymerization of a monomer component, and having a solvent-insoluble content of 0 to 85 mass %, the monomer component including 0.5 to 25 mass % of (a) glycidyl methacrylate, 0.2 to 10 mass % of (b) an unsaturated carboxylic acid monomer, and 70 to 99.3 mass % of (c) an additional copolymerizable monomer (provided that (a)+(b)+(c)=100 mass %).
摘要:
A process for producing an IC card comprising: an application/bonding step of applying an adhesive having a curing rate ratio (80° C./40° C.) of 30 or more on the surface of an inlet film, on which a number of IC modules are mounted, and/or a skin film for covering at least one surface of the inlet film, and bonding the inlet film and the skin film together to form a laminate film; a curing step of curing the adhesive to form a cured resin layer between the inlet film and the skin film of the laminate film; and a card forming step of forming a number of IC cards by dividing the laminate film for each IC module.