COOLING DEVICE FOR ELECTRONIC COMPONENTS
    3.
    发明申请
    COOLING DEVICE FOR ELECTRONIC COMPONENTS 审中-公开
    电子元件冷却装置

    公开(公告)号:US20070125526A1

    公开(公告)日:2007-06-07

    申请号:US11564531

    申请日:2006-11-29

    IPC分类号: H01L23/467 F24H3/02

    摘要: An inflow nozzle is disposed perpendicularly to plate-shaped fins of a heat-receiving section which is caused to face a heat-generating body to be cooled to draw heat therefrom, and portions of the plate-shaped fins are formed in a substantially V-shape or a substantially U-shape. Moreover, by selecting a proper dimension ratio of the thickness of a heat-receiving plate facing the heat-generating body and the length of the heat generating body, the heat absorption performance of the cooling device can be improved, and the cooling of the electronic component which generates high-temperature heat can be performed efficiently.

    摘要翻译: 流入喷嘴垂直于受热部分的板状散热片设置,该受热部分被面对要被冷却以产生热量的发热体,并且板状翅片的部分形成为大致V字形, 形状或大致U形。 此外,通过选择面向发热体的受热板的厚度与发热体的长度的合适的尺寸比,可以提高冷却装置的吸热性能,并且电子 可以有效地进行产生高温热的部件。