Exposure control in an X-ray exposure apparatus
    9.
    发明授权
    Exposure control in an X-ray exposure apparatus 失效
    X射线曝光装置中的曝光控制

    公开(公告)号:US5365561A

    公开(公告)日:1994-11-15

    申请号:US182535

    申请日:1994-01-18

    IPC分类号: G03F7/20 G21K1/04 G21K5/00

    摘要: Exposure control method and apparatus particularly suitably usable in an X-ray exposure apparatus, for exposing a mask and a wafer to radiation (X-rays) from a synchrotron to transfer a pattern formed on a mask onto the wafer, is disclosed. A shutter device for controlling passage and interception of the synchrotron radiation is provided between the synchrotron and the wafer. The shutter device includes a blade member having a leading edge and a trailing edge which are rectilinearly movable in a direction in which there exists non-uniformness in illuminance of the radiation. The leading edge is used to determine the timing of start of passage of the radiation to the wafer, while the trailing edge is used to determine the timing of interception of the radiation. The moving speeds of the leading edge and the trailing edge are controlled independently of each other to provide different exposure times for different portions of an exposure region on the wafer, in accordance with the non-uniformness in illuminance. By this, the amount of absorption of radiation by a resist material on the wafer can be make uniform throughout the exposure region.

    摘要翻译: 公开了一种特别适用于X射线曝光装置的曝光控制方法和装置,用于将掩模和晶片暴露于来自同步加速器的辐射(X射线),以将形成在掩模上的图案转印到晶片上。 在同步加速器和晶片之间提供用于控制同步加速器辐射的通过和截取的快门装置。 快门装置包括具有前缘和后缘的叶片构件,其沿着存在辐射照度不均匀的方向可直线运动。 前沿用于确定辐射通向晶片的时间,而后缘用于确定辐射截取的时间。 前缘和后缘的移动速度彼此独立地控制,以根据照度的不均匀性为晶片上的曝光区域的不同部分提供不同的曝光时间。 由此,可以使整个曝光区域中的抗蚀剂材料在晶片上的辐射吸收量均匀。

    Liquid cooled X-ray lithographic exposure apparatus
    10.
    发明授权
    Liquid cooled X-ray lithographic exposure apparatus 失效
    液体冷却X射线光刻曝光装置

    公开(公告)号:US5063582A

    公开(公告)日:1991-11-05

    申请号:US658434

    申请日:1991-02-20

    IPC分类号: G03F7/20

    摘要: The present invention relates to a temperature control system for a lithographic exposure apparatus wherein a mask and wafer are closely disposed, and predetermined exposure energy is applied to respective shot areas of the wafer through the mask. The exposure energy is a soft-X-ray source, for example. The pattern of the mask is transferred onto the respective shot areas in a step-and-repeat manner. In the apparatus, a temperature control medium liquid is supplied into the wafer chuck which supports the wafer at the exposure position. The flow rate of the temperature control liquid is different during an exposure operation than during a non-exposure-operation. The flow control is determined in consideration of the wafer chuck vibration attributable to the supply of the liquid medium and also, of the heat generation in the wafer by the exposure energy, so that the vibration of the wafer chuck during the exposure operation is suppressed. Simultaneously the temperature rise of the wafer can also be suppressed. The pattern transfer from the mask to the wafer thus be precisely performed.