摘要:
In a frame structure for a vehicle having a reinforcement body provided inside a frame body, the frame body comprises a first face portion and a second face portion extending in a direction substantially perpendicular to a rotational-axis direction of a bending moment occurring when a torsional load acts on a vehicle body, and third face portions positioned between the first and second face portions, and the reinforcement body comprises third-face connection portions connected to the third face portions, a first-face connection portion connected to the first face portion at a corner portion, a first-face non-contact portion provided away from the first face portion, a second-face connection portion connected to the second face portion at a corner portion, and a second-face non-contact portion provided away from the second face portion.
摘要:
Provided are a thermoplastic resin composition, a thermoplastic resin molded product and an outside plate part of a vehicle capable of improving both characteristics of heat resistance and impact resistance while being compatible with each other. The thermoplastic resin composition contains: 65 to 86.5 mass % of a polyamide resin component (A), 13 to 25 mass % of an acid modified elastomer component (B), and 10 mass % or less of an olefin-based resin component (C) and/or 8 mass % or less of a filler component (D), wherein a dispersion phase of a core-shell type particle structure that is formed from the acid modified elastomer component (B) serving as a shell phase and the olefin-based resin component (C) and/or the filler component (D) serving as a core phase is dispersed in a matrix phase formed from the polyamide resin component (A).
摘要:
Provided are a thermoplastic resin composition, a thermoplastic resin molded product and an outside plate part of a vehicle capable of improving both characteristics of heat resistance and impact resistance while being compatible with each other. The thermoplastic resin composition contains: 65 to 86.5 mass % of a polyamide resin component (A), 13 to 25 mass % of an acid modified elastomer component (B), and 10 mass % or less of an olefin-based resin component (C) and/or 8 mass % or less of a filler component (D), wherein a dispersion phase of a core-shell type particle structure that is formed from the acid modified elastomer component (B) serving as a shell phase and the olefin-based resin component (C) and/or the filler component (D) serving as a core phase is dispersed in a matrix phase formed from the polyamide resin component (A).
摘要:
There is provided a thermoplastic elastomer composition, comprising per 100 parts by weight of ethylene-propylene-diene monomer (EPDM), 20 to 30 parts by weight of polypropylene (PP), 7 to 30 parts by weight of ethylene octene rubber (EOR), 7 to 23 parts by weight of propylene butene rubber (PBR), and 55 to 65 parts by weight of mineral oil, wherein a content of said poly(1-butene) (PB) is small parts by weight. Thereby, there can be provided a thermoplastic elastomer composition and a molded member obtained by molding the same, which can be superior in the shape recovery property at the deformation, without deteriorating the tactile quality, gloss-change resistance, or formability of particles.
摘要:
An example molding method includes: feeding a molten foamable resin by injection in a cavity formed in a molding die; allowing the molten foamable resin to flow in the cavity; and foaming and solidifying the molten foamable resin to mold a resin foam product. The example molding method performs flow rate control by controlling a flow rate of the molten foamable resin at a welding portion to be equal to or higher than a flow rate of the molten foamable resin at an upstream portion adjacent to the welding portion.
摘要:
In a semiconductor integrated circuit inspection method of inspecting a semiconductor integrated circuit including plural transistors according to which a test pattern generated for the semiconductor integrated circuit is input to an input terminal of the semiconductor integrated circuit, the time during which a voltage applied upon each of the transistors remains equal to or higher than a predetermined voltage is measured in response to inputting of the test pattern at the input terminal, and the ratio of thus measured time to the inspection time for the semiconductor integrated circuit is calculated. In certain example embodiments of this invention, this is advantageous in that it may be possible to verify whether a generated test pattern is preferable by grasping a state of voltage applied upon each transistor during a reliability test, so as to help maintain accuracy of reliability testing.
摘要:
In a semiconductor integrated circuit inspection method of inspecting a semiconductor integrated circuit comprising plural transistors according to which a test pattern generated for the semiconductor integrated circuit is input to an input terminal of the semiconductor integrated circuit, the time during which a voltage applied upon each of the transistors remains equal to or higher than a predetermined voltage is measured in response to inputting of the test pattern at the input terminal, and the ratio of thus measured time to the inspection time for the semiconductor integrated circuit is calculated.
摘要:
To provide a detection rate calculation method of a test pattern for calculating how much a test pattern can detect short-out generated between the adjacent lines in an integrated circuit. A layout creating program 12 creates layout data 25 from circuit data 21, and creates the information of the adjacent lines from layout data 25 as the adjacent line information 24. A transistor level simulation program 11 executes simulation by using a test pattern 22 and creates a potential of each line in the circuit as the potential information 23. A fault detection rate calculation program 13 checks if a potential difference between the adjacent lines is not less than a predetermined potential difference or not from the adjacent line information 24 and the potential information 23 and calculates a detection rate of short-out.