Frame structure for vehicle
    1.
    发明授权
    Frame structure for vehicle 有权
    车架结构

    公开(公告)号:US08641131B2

    公开(公告)日:2014-02-04

    申请号:US13281088

    申请日:2011-10-25

    IPC分类号: B60R19/18

    摘要: In a frame structure for a vehicle having a reinforcement body provided inside a frame body, the frame body comprises a first face portion and a second face portion extending in a direction substantially perpendicular to a rotational-axis direction of a bending moment occurring when a torsional load acts on a vehicle body, and third face portions positioned between the first and second face portions, and the reinforcement body comprises third-face connection portions connected to the third face portions, a first-face connection portion connected to the first face portion at a corner portion, a first-face non-contact portion provided away from the first face portion, a second-face connection portion connected to the second face portion at a corner portion, and a second-face non-contact portion provided away from the second face portion.

    摘要翻译: 在具有设置在框体内的加强体的车辆的框架结构中,框架体包括第一面部和第二面部,该第一面部和第二面部在与扭转时产生的弯矩的旋转轴线方向大致正交的方向延伸 负载作用在车身上,第三面部分位于第一和第二面部之间,加强体包括连接到第三面部的第三面连接部,与第一面部连接的第一面连接部, 拐角部分,远离第一面部分设置的第一面非接触部分,在拐角处连接到第二面部分的第二面连接部分和远离第二面部分设置的第二面非接触部分 第二面部。

    Thermoplastic resin composition, molded product therefrom and outside plate part for vehicle using the molded product
    2.
    发明授权
    Thermoplastic resin composition, molded product therefrom and outside plate part for vehicle using the molded product 有权
    热塑性树脂组合物,来自其的模制产品和使用模制产品的车辆外板部件

    公开(公告)号:US07511086B2

    公开(公告)日:2009-03-31

    申请号:US11294960

    申请日:2005-12-06

    IPC分类号: C08L77/00 C08K9/10 C03C25/30

    摘要: Provided are a thermoplastic resin composition, a thermoplastic resin molded product and an outside plate part of a vehicle capable of improving both characteristics of heat resistance and impact resistance while being compatible with each other. The thermoplastic resin composition contains: 65 to 86.5 mass % of a polyamide resin component (A), 13 to 25 mass % of an acid modified elastomer component (B), and 10 mass % or less of an olefin-based resin component (C) and/or 8 mass % or less of a filler component (D), wherein a dispersion phase of a core-shell type particle structure that is formed from the acid modified elastomer component (B) serving as a shell phase and the olefin-based resin component (C) and/or the filler component (D) serving as a core phase is dispersed in a matrix phase formed from the polyamide resin component (A).

    摘要翻译: 本发明提供一种热塑性树脂组合物,热塑性树脂模塑制品和能够改善耐热性和耐冲击性两者同时兼容的车辆外板部分。 热塑性树脂组合物含有聚酰胺树脂成分(A)65〜86.5质量%,酸改性弹性体成分(B)13〜25质量%,烯烃系树脂成分(C)的10质量% )和/或8质量%以下的填充剂组分(D),其中由作为壳相的酸改性弹性体组分(B)形成的核 - 壳型颗粒结构的分散相和烯烃 - (C)和/或作为芯相的填充剂成分(D)分散在由聚酰胺树脂成分(A)形成的基体相中。

    Thermoplastic elastomer composition and molded member obtained by molding the same
    4.
    发明申请
    Thermoplastic elastomer composition and molded member obtained by molding the same 审中-公开
    热塑性弹性体组合物和通过模压成型体得到的成型体

    公开(公告)号:US20070292704A1

    公开(公告)日:2007-12-20

    申请号:US11808154

    申请日:2007-06-07

    IPC分类号: B32B27/00 C09B67/00

    摘要: There is provided a thermoplastic elastomer composition, comprising per 100 parts by weight of ethylene-propylene-diene monomer (EPDM), 20 to 30 parts by weight of polypropylene (PP), 7 to 30 parts by weight of ethylene octene rubber (EOR), 7 to 23 parts by weight of propylene butene rubber (PBR), and 55 to 65 parts by weight of mineral oil, wherein a content of said poly(1-butene) (PB) is small parts by weight. Thereby, there can be provided a thermoplastic elastomer composition and a molded member obtained by molding the same, which can be superior in the shape recovery property at the deformation, without deteriorating the tactile quality, gloss-change resistance, or formability of particles.

    摘要翻译: 提供了一种热塑性弹性体组合物,其包含每100重量份的乙烯 - 丙烯 - 二烯单体(EPDM),20-30重量份的聚丙烯(PP),7-30重量份的乙烯辛烯橡胶(EOR) ,丙烯丁烯橡胶(PBR)为7〜23重量份,矿物油为55〜65重量份,其中所述聚(1-丁烯)(PB)的含量小。 因此,可以提供一种热塑性弹性体组合物和通过模塑而成的成型体,其在变形时的形状恢复性能优异,而不会降低触感质量,耐光泽变化性或颗粒的成形性。

    Method and apparatus for molding resin foam product
    5.
    发明授权
    Method and apparatus for molding resin foam product 有权
    树脂发泡产品成型方法和设备

    公开(公告)号:US08337186B2

    公开(公告)日:2012-12-25

    申请号:US12647947

    申请日:2009-12-28

    IPC分类号: B29C44/42 B29C45/77

    摘要: An example molding method includes: feeding a molten foamable resin by injection in a cavity formed in a molding die; allowing the molten foamable resin to flow in the cavity; and foaming and solidifying the molten foamable resin to mold a resin foam product. The example molding method performs flow rate control by controlling a flow rate of the molten foamable resin at a welding portion to be equal to or higher than a flow rate of the molten foamable resin at an upstream portion adjacent to the welding portion.

    摘要翻译: 一种成型方法包括:通过注射将熔融的可发泡树脂在形成于模具中的空腔中进料; 使熔融的可发泡树脂在空腔中流动; 并发泡和固化熔融的可发泡树脂以模制树脂泡沫产品。 实施例成型方法通过将熔融发泡性树脂在焊接部的流量控制为与熔融发泡性树脂在与焊接部相邻的上游部分的流量以上的流量来进行流量控制。

    Inspection method and inspection apparatus for semiconductor integrated circuit
    6.
    发明授权
    Inspection method and inspection apparatus for semiconductor integrated circuit 有权
    半导体集成电路检测方法及检验装置

    公开(公告)号:US07404158B2

    公开(公告)日:2008-07-22

    申请号:US11250377

    申请日:2005-10-17

    申请人: Yukinori Nakajima

    发明人: Yukinori Nakajima

    IPC分类号: G06F17/50

    CPC分类号: G01R31/318357 G06F11/261

    摘要: In a semiconductor integrated circuit inspection method of inspecting a semiconductor integrated circuit including plural transistors according to which a test pattern generated for the semiconductor integrated circuit is input to an input terminal of the semiconductor integrated circuit, the time during which a voltage applied upon each of the transistors remains equal to or higher than a predetermined voltage is measured in response to inputting of the test pattern at the input terminal, and the ratio of thus measured time to the inspection time for the semiconductor integrated circuit is calculated. In certain example embodiments of this invention, this is advantageous in that it may be possible to verify whether a generated test pattern is preferable by grasping a state of voltage applied upon each transistor during a reliability test, so as to help maintain accuracy of reliability testing.

    摘要翻译: 在半导体集成电路检查方法中,检查包括多个晶体管的半导体集成电路,根据该半导体集成电路,为半导体集成电路产生的测试图案被输入到半导体集成电路的输入端, 响应于在输入端子处输入测试图案来测量晶体管保持等于或高于预定电压,并且计算这样测量的时间与半导体集成电路的检查时间的比率。 在本发明的某些示例实施例中,这是有利的,因为通过在可靠性测试期间通过掌握施加在每个晶体管上的电压的状态来验证产生的测试图案是否是优选的,以便有助于保持可靠性测试的准确性 。

    Inspection method and inspection apparatus for semiconductor integrated circuit
    7.
    发明申请
    Inspection method and inspection apparatus for semiconductor integrated circuit 有权
    半导体集成电路检测方法及检验装置

    公开(公告)号:US20060090147A1

    公开(公告)日:2006-04-27

    申请号:US11250377

    申请日:2005-10-17

    申请人: Yukinori Nakajima

    发明人: Yukinori Nakajima

    IPC分类号: G06F17/50

    CPC分类号: G01R31/318357 G06F11/261

    摘要: In a semiconductor integrated circuit inspection method of inspecting a semiconductor integrated circuit comprising plural transistors according to which a test pattern generated for the semiconductor integrated circuit is input to an input terminal of the semiconductor integrated circuit, the time during which a voltage applied upon each of the transistors remains equal to or higher than a predetermined voltage is measured in response to inputting of the test pattern at the input terminal, and the ratio of thus measured time to the inspection time for the semiconductor integrated circuit is calculated.

    摘要翻译: 在半导体集成电路检查方法中,检查包括多个晶体管的半导体集成电路,根据该半导体集成电路,为半导体集成电路产生的测试图案被输入到半导体集成电路的输入端, 响应于在输入端子处输入测试图案来测量晶体管保持等于或高于预定电压,并且计算这样测量的时间与半导体集成电路的检查时间的比率。

    Detection rate calculation method of test pattern, recording medium, and detection rate calculation apparatus of test pattern
    8.
    发明申请
    Detection rate calculation method of test pattern, recording medium, and detection rate calculation apparatus of test pattern 审中-公开
    测试图案,记录介质和检测率计算装置的检测率计算方法

    公开(公告)号:US20070113136A1

    公开(公告)日:2007-05-17

    申请号:US11585910

    申请日:2006-10-25

    申请人: Yukinori Nakajima

    发明人: Yukinori Nakajima

    IPC分类号: G01R31/28 G06F11/00

    CPC分类号: G06F17/5036 G01R31/31835

    摘要: To provide a detection rate calculation method of a test pattern for calculating how much a test pattern can detect short-out generated between the adjacent lines in an integrated circuit. A layout creating program 12 creates layout data 25 from circuit data 21, and creates the information of the adjacent lines from layout data 25 as the adjacent line information 24. A transistor level simulation program 11 executes simulation by using a test pattern 22 and creates a potential of each line in the circuit as the potential information 23. A fault detection rate calculation program 13 checks if a potential difference between the adjacent lines is not less than a predetermined potential difference or not from the adjacent line information 24 and the potential information 23 and calculates a detection rate of short-out.

    摘要翻译: 提供一种测试图案的检测率计算方法,用于计算测试图案可以检测集成电路中相邻行之间产生的短路的程度。 布局创建程序12从电路数据21生成布局数据25,并且从布局数据25创建相邻行的信息作为相邻行信息24。 晶体管电平仿真程序11通过使用测试图案22执行模拟,并且产生电路中的每一行的电位作为电位信息23。 故障检测率计算程序13检查相邻行之间的电位差是否不小于来自相邻行信息24和潜在信息23的预定电位差,并计算短路检测率。