Insulated gate field effect transistor with buried layer
    1.
    发明授权
    Insulated gate field effect transistor with buried layer 失效
    绝缘栅场效应晶体管与埋层

    公开(公告)号:US4908681A

    公开(公告)日:1990-03-13

    申请号:US265338

    申请日:1988-10-27

    IPC分类号: H01L29/78 H01L29/08 H01L29/10

    摘要: An insulated gate field effect transistor fabricated in one conductivity type semiconductor substrate wherein a source region and a drain region are formed apart each other to define a channel region therebetween, having a deep ion implantation region which is so formed in the lower portion of the channel region that at least one end portion of the depletion region of the channel extends towards the source region beyond the border between the source region and the channel region at the surface of the substrate whereby an imaginary straight line drawn from said border at the surface of the substrate and an intersecting point between the depletion region of the source and the depletion region of the channel region without a back gate bias voltage defines an angle larger than 90.degree. against the surface of the substrate.

    摘要翻译: 制造在一个导电型半导体衬底中的绝缘栅场效应晶体管,其中源极区和漏极区形成为彼此分离以在其间限定沟道区,其中具有在沟道的下部形成的深离子注入区 区域,其中通道的耗尽区的至少一个端部朝向源极区域延伸超过衬底的表面处的源极区域和沟道区域之间的边界,由此从在该衬底的表面处的所述边界绘制的假想直线 衬底和源极的耗尽区与沟道区的耗尽区之间的相交点,而不具有背栅极偏置电压,相对于衬底的表面确定大于90°的角度。

    Semiconductor device and method of manufacturing the same
    2.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US06683349B1

    公开(公告)日:2004-01-27

    申请号:US09652892

    申请日:2000-08-31

    IPC分类号: H01L2976

    摘要: A semiconductor device includes a gate electrode 16 on a P type well through a gate oxide film 9, a heavily-doped N+ type source layer 12 formed to be adjacent to the one end of the gate electrode 16, an N+ type drain layer 12 formed apart from the other end of the gate electrode 16, a P type body layer 14 below the gate electrode 16, and a lightly-doped drain layer 10 formed in an area extending from below the gate electrode 16 to the heavily-doped N+ type drain layer 12 so that it is shallow at least below the gate electrode 16 and deep in the vicinity of the heavily-doped N-type drain layer 12.

    摘要翻译: 半导体器件包括通过栅极氧化膜9的P型阱上的栅极16,形成为与栅电极16的一端形成的重掺杂N +型源极层12,形成N +型漏极层12 除了栅电极16的另一端之外,在栅电极16下面的P型体层14和形成在从栅电极16的下方延伸到重掺杂N +型漏极的区域中的轻掺杂漏层10 层12,使得其至少在栅极电极16的下方是浅的,并且深度在重掺杂的N型漏极层12附近。

    Semiconductor device and method of manufacturing thereof
    3.
    发明申请
    Semiconductor device and method of manufacturing thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US20050118765A1

    公开(公告)日:2005-06-02

    申请号:US10806610

    申请日:2004-03-23

    摘要: This invention is characterized in that, a gate electrode 27F formed on a P-type well 3 via a gate oxide film 9, a high-concentration N-type source layer and a high-concentration N-type drain layer 15 respectively formed apart from the gate electrode and a low-concentration N-type source layer and a low-concentration N-type drain layer respectively formed so that they respectively surround the N-type source layer and the N-type drain layer 10 and respectively parted by a P-type body layer formed under the gate electrode 27F are provided.

    摘要翻译: 本发明的特征在于,分别形成在P型阱3上的栅电极27F经由栅极氧化膜9,高浓度N型源极层和分别形成的高浓度N型漏极层15 分别形成为分别围绕N型源极层和N型漏极层10的低浓度N型源极层和低浓度N型源极层以及分别由 提供了形成在栅电极27F下面的P型体层。

    Semiconductor device and method of manufacturing thereof
    4.
    发明授权
    Semiconductor device and method of manufacturing thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US06784059B1

    公开(公告)日:2004-08-31

    申请号:US09652044

    申请日:2000-08-31

    IPC分类号: H01L218234

    摘要: This invention is characterized in that, a gate electrode 27F formed on a P-type well 3 via a gate oxide film 9, a high-concentration N-type source layer and a high-concentration N-type drain layer 15 respectively formed apart from the gate electrode and a low-concentration N-type source layer and a low-concentration H-type drain layer respectively formed so that they respectively surround the N-type source layer and the N-type drain layer 10 and respectively parted by a P-type body layer formed under the gate electrode 27F are provided.

    摘要翻译: 本发明的特征在于,经由栅极氧化膜9形成在P型阱3上的栅极27F,高浓度N型源极层和高浓度N型漏极层15 分别形成为分别围绕N型源极层和N型漏极层10的栅极电极和低浓度N型源极层以及低浓度H型漏极层,分别由P 设置形成在栅电极27F下方的主体层。

    Semiconductor device and method of manufacturing the same
    5.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US06635925B1

    公开(公告)日:2003-10-21

    申请号:US09652891

    申请日:2000-08-31

    IPC分类号: H01L2976

    CPC分类号: H01L29/66659 H01L29/7835

    摘要: A P-channel type DMOS transistor includes heavily doped source/drain layers 12 formed in an N-type well 2, a gate electrode 18 formed on a channel layer located between the source/drain layers 12, an N-type body layer 14 formed in the vicinity of the source layer, and a lightly-doped drain layer 6 formed between the channel layer and the drain layer 12. In such a P-channel type DMOS transistor, a P-type layer 16 is formed in the channel layer at the upper part of the N-type body layer 14. In this configuration, the driving capability of the P-channel type DMOS transistor can be improved.

    摘要翻译: P沟道型DMOS晶体管包括形成在N型阱2中的重掺杂源极/漏极层12,形成在位于源/漏层12之间的沟道层上的栅电极18,形成的N型体层14 在源极层附近,以及形成在沟道层和漏极层12之间的轻掺杂漏极层6.在这种P沟道型DMOS晶体管中,在沟道层中形成P型层16 N型体层14的上部。在该结构中,可以提高P沟道型DMOS晶体管的驱动能力。

    Semiconductor device and method of manufacturing thereof
    6.
    发明授权
    Semiconductor device and method of manufacturing thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US07224023B2

    公开(公告)日:2007-05-29

    申请号:US10806610

    申请日:2004-03-23

    摘要: This invention is characterized in that, a gate electrode 27F formed on a P-type well 3 via a gate oxide film 9, a high-concentration N-type source layer and a high-concentration N-type drain layer 15 respectively formed apart from the gate electrode and a low-concentration N-type source layer and a low-concentration N-type drain layer respectively formed so that they respectively surround the N-type source layer and the N-type drain layer 10 and respectively parted by a P-type body layer formed under the gate electrode 27F are provided.

    摘要翻译: 本发明的特征在于,分别形成在P型阱3上的栅电极27F经由栅极氧化膜9,高浓度N型源极层和分别形成的高浓度N型漏极层15 分别形成为分别围绕N型源极层和N型漏极层10的低浓度N型源极层和低浓度N型源极层以及分别由 提供了形成在栅电极27F下面的P型体层。