公开(公告)号：US20120244787A1

公开(公告)日：2012-09-27

申请号：US13308857

申请日：2011-12-01

申请人： Masaya SEKI ,  Tetsuji TOGAWA ,  Masayuki NAKANISHI ,  Naoki MATSUDA ,  Atsushi YOSHIDA

发明人： Masaya SEKI ,  Tetsuji TOGAWA ,  Masayuki NAKANISHI ,  Naoki MATSUDA ,  Atsushi YOSHIDA

IPC分类号： B24B21/06

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/006 ,  B24B21/008 ,  B24B21/20

摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

摘要翻译： 抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。 抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。 基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板周边部分的下表面。 支撑台与保持台一致地旋转。

公开(公告)号：US20110237164A1

公开(公告)日：2011-09-29

申请号：US12986481

申请日：2011-01-07

申请人： Masaya SEKI ,  Kenya Ito ,  Masayuki Nakanishi

发明人： Masaya SEKI ,  Kenya Ito ,  Masayuki Nakanishi

IPC分类号： B24B1/00 ,  B24B27/00

CPC分类号： B24B9/065 ,  B24B21/004 ,  B24B37/27

摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to rotate the substrate W; and at least one polishing head 30 disposed near the peripheral portion of the substrate. The polishing head 30 has at least one protrusion 51a, 51b extending along a circumferential direction of the substrate W, and the polishing head 30 is configured to press a polishing surface of a polishing tape 23 by the protrusion 51a, 51b against the peripheral portion of the substrate W from above or below.

摘要翻译： 抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构3，其构造成水平地保持基板W并使基板W旋转; 以及设置在基板的周边部分附近的至少一个抛光头30。 抛光头30具有沿着基板W的圆周方向延伸的至少一个突起51a，51b，并且抛光头30被构造成通过突起51a，51b将抛光带23的抛光表面压靠在基板 基底W从上方或下方。