Magnetoresistive element and method of manufacturing the same
    1.
    发明授权
    Magnetoresistive element and method of manufacturing the same 有权
    磁阻元件及其制造方法

    公开(公告)号:US07727778B2

    公开(公告)日:2010-06-01

    申请号:US12200181

    申请日:2008-08-28

    IPC分类号: H01L21/00

    摘要: A magnetoresistive element includes a stack formed by sequentially stacking a first fixed layer in which a magnetization direction is fixed, a first nonmagnetic layer, a free layer in which a magnetization direction is changeable, a second nonmagnetic layer, and a second fixed layer in which a magnetization direction is fixed, a first circumferential wall provided on the second nonmagnetic layer in contact with a circumferential surface of the second fixed layer to surround the second fixed layer, and made of an insulator, and a second circumferential wall provided on the first nonmagnetic layer in contact with a circumferential surface of the free layer to surround the free layer, and made of an insulator.

    摘要翻译: 磁阻元件包括通过顺序层叠其中固定有磁化方向的第一固定层,第一非磁性层,磁化方向可变的自由层,第二非磁性层和第二固定层而形成的叠层,其中 磁化方向是固定的,设置在第二非磁性层上的与第二固定层的圆周表面接触以围绕第二固定层并由绝缘体制成的第一周向壁和设置在第一非磁性层上的第二周向壁 层与自由层的周向表面接触以包围自由层,并由绝缘体制成。

    MAGNETORESISTIVE ELEMENT AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    MAGNETORESISTIVE ELEMENT AND METHOD OF MANUFACTURING THE SAME 有权
    磁性元件及其制造方法

    公开(公告)号:US20100053823A1

    公开(公告)日:2010-03-04

    申请号:US12200181

    申请日:2008-08-28

    IPC分类号: G11B5/33

    摘要: A magnetoresistive element includes a stack formed by sequentially stacking a first fixed layer in which a magnetization direction is fixed, a first nonmagnetic layer, a free layer in which a magnetization direction is changeable, a second nonmagnetic layer, and a second fixed layer in which a magnetization direction is fixed, a first circumferential wall provided on the second nonmagnetic layer in contact with a circumferential surface of the second fixed layer to surround the second fixed layer, and made of an insulator, and a second circumferential wall provided on the first nonmagnetic layer in contact with a circumferential surface of the free layer to surround the free layer, and made of an insulator.

    摘要翻译: 磁阻元件包括通过顺序层叠其中固定有磁化方向的第一固定层,第一非磁性层,磁化方向可变的自由层,第二非磁性层和第二固定层而形成的叠层,其中 磁化方向是固定的,设置在第二非磁性层上的与第二固定层的圆周表面接触以围绕第二固定层并由绝缘体制成的第一周向壁和设置在第一非磁性层上的第二周向壁 层与自由层的周向表面接触以包围自由层,并由绝缘体制成。

    Method of manufacturing a magnetic random access memory, method of manufacturing an embedded memory, and template
    3.
    发明授权
    Method of manufacturing a magnetic random access memory, method of manufacturing an embedded memory, and template 有权
    磁性随机存取存储器的制造方法,嵌入式存储器的制造方法和模板

    公开(公告)号:US08058080B2

    公开(公告)日:2011-11-15

    申请号:US12699721

    申请日:2010-02-03

    IPC分类号: H01L21/00 H01L21/20 H01L21/36

    摘要: A magnetic material of a magnetoresistive element is formed on a lower electrode. An upper electrode is formed on the magnetic material. A resist for nano-imprint lithography is formed on the upper electrode. A first pattern or a second pattern is formed in the resist by setting a first template or a second template into contact with the resist and curing the resist. The first template has the first pattern that corresponds to the magnetoresistive element and the lower electrode. The second template has the second pattern that corresponds to the magnetoresistive element and the upper electrode. The magnetic material and the lower electrode are patterned at the same time by using the resist having the first pattern, or the magnetic material and the upper electrode are patterned at the same time by using the resist having the second pattern.

    摘要翻译: 磁阻元件的磁性材料形成在下电极上。 在磁性材料上形成上部电极。 在上电极上形成用于纳米压印光刻的抗蚀剂。 通过将第一模板或第二模板与抗蚀剂接触并固化抗蚀剂,在抗蚀剂中形成第一图案或第二图案。 第一模板具有对应于磁阻元件和下电极的第一图案。 第二模板具有对应于磁阻元件和上电极的第二图案。 通过使用具有第一图案的抗蚀剂,同时对磁性材料和下部电极进行图案化,或者通过使用具有第二图案的抗蚀剂同时对磁性材料和上部电极进行图案化。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 失效
    半导体器件及其制造方法

    公开(公告)号:US20110062421A1

    公开(公告)日:2011-03-17

    申请号:US12700502

    申请日:2010-02-04

    IPC分类号: H01L29/78 H01L21/336

    摘要: First semiconductor layers are in source/drain regions on the semiconductor substrate. A second semiconductor layer comprises first portions on the first semiconductor layers and a second portion in a linear form in a channel region between the source/drain regions. A gate electrode is around the second portion of the second semiconductor layer via an insulating film. A film thickness of the second portion of the second semiconductor layer is smaller than a film thickness of the first portion of the second semiconductor layer.

    摘要翻译: 第一半导体层位于半导体衬底上的源/漏区中。 第二半导体层包括在第一半导体层上的第一部分和在源极/漏极区之间的沟道区中线性形式的第二部分。 栅电极经由绝缘膜在第二半导体层的第二部分周围。 第二半导体层的第二部分的膜厚度小于第二半导体层的第一部分的膜厚度。

    Semiconductor device and manufacturing method thereof
    5.
    发明授权
    Semiconductor device and manufacturing method thereof 失效
    半导体装置及其制造方法

    公开(公告)号:US08309950B2

    公开(公告)日:2012-11-13

    申请号:US12700536

    申请日:2010-02-04

    IPC分类号: H01L29/78 H01L21/336

    摘要: First semiconductor layers are in source/drain regions on the semiconductor substrate. A second semiconductor layer comprises first portions on the first semiconductor layers and a second portion on a channel region between the source/drain regions. Third semiconductor layers are on the first portions of the second semiconductor layer. A gate electrode is around the second portion of the second semiconductor layer via an insulating film. Contact plugs are in the first semiconductor layers, the first portions of the second semiconductor layers and the third semiconductor layers in the source/drain regions. A diameter of the contact plug in the second semiconductor layer is smaller than a diameter of the contact plug in the first and third semiconductor layers.

    摘要翻译: 第一半导体层位于半导体衬底上的源/漏区中。 第二半导体层包括第一半导体层上的第一部分和源/漏区之间的沟道区上的第二部分。 第三半导体层位于第二半导体层的第一部分上。 栅电极经由绝缘膜在第二半导体层的第二部分周围。 接触插塞位于第一半导体层中,第二半导体层的第一部分和源/漏区中的第三半导体层。 第二半导体层中的接触插塞的直径小于第一和第三半导体层中的接触插塞的直径。

    Magnetoresistive element and manufacturing method thereof
    6.
    发明授权
    Magnetoresistive element and manufacturing method thereof 有权
    磁阻元件及其制造方法

    公开(公告)号:US07919826B2

    公开(公告)日:2011-04-05

    申请号:US12108093

    申请日:2008-04-23

    IPC分类号: H01L21/00

    摘要: A magnetoresistive element includes a first stacked structure formed by sequentially stacking a first fixed layer in which a magnetization direction is fixed and a first nonmagnetic layer, a second stacked structure formed on the first stacked structure by sequentially stacking a free layer in which a magnetization direction is changeable, a second nonmagnetic layer, and a second fixed layer in which a magnetization direction is fixed, and a circumferential wall formed in contact with a circumferential surface of the second stacked structure to surround the second stacked structure, and made of an insulator. A circumferential surface of the first stacked structure is substantially perpendicular. The second stacked structure has a tapered shape which narrows upward.

    摘要翻译: 磁阻元件包括通过顺序层叠形成磁化方向的第一固定层和第一非磁性层的第一堆叠结构而形成的第一堆叠结构,通过顺序堆叠在第一层叠结构上形成的第二堆叠结构,其中磁化方向 可变化的第二非磁性层和固定有磁化方向的第二固定层,以及与第二堆叠结构的周向表面接触以围绕第二堆叠结构并由绝缘体制成的周壁。 第一堆叠结构的圆周表面基本垂直。 第二堆叠结构具有向上变窄的锥形形状。

    MAGNETORESISTIVE ELEMENT AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    MAGNETORESISTIVE ELEMENT AND MANUFACTURING METHOD THEREOF 有权
    磁性元件及其制造方法

    公开(公告)号:US20080265347A1

    公开(公告)日:2008-10-30

    申请号:US12108093

    申请日:2008-04-23

    IPC分类号: H01L29/82 H01L21/00

    摘要: A magnetoresistive element includes a first stacked structure formed by sequentially stacking a first fixed layer in which a magnetization direction is fixed and a first nonmagnetic layer, a second stacked structure formed on the first stacked structure by sequentially stacking a free layer in which a magnetization direction is changeable, a second nonmagnetic layer, and a second fixed layer in which a magnetization direction is fixed, and a circumferential wall formed in contact with a circumferential surface of the second stacked structure to surround the second stacked structure, and made of an insulator. A circumferential surface of the first stacked structure is substantially perpendicular. The second stacked structure has a tapered shape which narrows upward.

    摘要翻译: 磁阻元件包括通过顺序层叠形成磁化方向的第一固定层和第一非磁性层的第一堆叠结构而形成的第一堆叠结构,通过顺序堆叠在第一层叠结构上形成的第二堆叠结构,其中磁化方向 可变化的第二非磁性层和固定有磁化方向的第二固定层,以及与第二堆叠结构的周向表面接触以围绕第二堆叠结构并由绝缘体制成的周壁。 第一堆叠结构的圆周表面基本垂直。 第二堆叠结构具有向上变窄的锥形形状。

    Semiconductor device and manufacturing method thereof
    8.
    发明授权
    Semiconductor device and manufacturing method thereof 失效
    半导体装置及其制造方法

    公开(公告)号:US08314464B2

    公开(公告)日:2012-11-20

    申请号:US12700502

    申请日:2010-02-04

    IPC分类号: H01L29/78

    摘要: First semiconductor layers are in source/drain regions on the semiconductor substrate. A second semiconductor layer comprises first portions on the first semiconductor layers and a second portion in a linear form in a channel region between the source/drain regions. A gate electrode is around the second portion of the second semiconductor layer via an insulating film. A film thickness of the second portion of the second semiconductor layer is smaller than a film thickness of the first portion of the second semiconductor layer.

    摘要翻译: 第一半导体层位于半导体衬底上的源/漏区中。 第二半导体层包括在第一半导体层上的第一部分和在源极/漏极区之间的沟道区中线性形式的第二部分。 栅电极经由绝缘膜在第二半导体层的第二部分周围。 第二半导体层的第二部分的膜厚度小于第二半导体层的第一部分的膜厚度。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 失效
    半导体器件及其制造方法

    公开(公告)号:US20110062417A1

    公开(公告)日:2011-03-17

    申请号:US12700536

    申请日:2010-02-04

    IPC分类号: H01L29/78 H01L21/336

    摘要: First semiconductor layers are in source/drain regions on the semiconductor substrate. A second semiconductor layer comprises first portions on the first semiconductor layers and a second portion on a channel region between the source/drain regions. Third semiconductor layers are on the first portions of the second semiconductor layer. A gate electrode is around the second portion of the second semiconductor layer via an insulating film. Contact plugs are in the first semiconductor layers, the first portions of the second semiconductor layers and the third semiconductor layers in the source/drain regions. A diameter of the contact plug in the second semiconductor layer is smaller than a diameter of the contact plug in the first and third semiconductor layers.

    摘要翻译: 第一半导体层位于半导体衬底上的源/漏区中。 第二半导体层包括第一半导体层上的第一部分和源/漏区之间的沟道区上的第二部分。 第三半导体层位于第二半导体层的第一部分上。 栅电极经由绝缘膜在第二半导体层的第二部分周围。 接触插塞位于第一半导体层中,第二半导体层的第一部分和源/漏区中的第三半导体层。 第二半导体层中的接触插塞的直径小于第一和第三半导体层中的接触插塞的直径。

    MAGNETIC RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    MAGNETIC RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME 审中-公开
    磁性随机存取存储器及其制造方法

    公开(公告)号:US20120273844A1

    公开(公告)日:2012-11-01

    申请号:US13236565

    申请日:2011-09-19

    IPC分类号: H01L29/82 H01L21/20

    摘要: According to one embodiment, a magnetic random access memory includes a first gate electrode and a second gate electrode arranged at a predetermined pitch in a first direction, and extending in a second direction perpendicular to the first direction, a first magnetoresistive element formed above a portion between the first gate electrode and the second gate electrode, an electrode layer formed in a position higher than the first magnetoresistive element, and formed to have a distance which is a half of the pitch from the first magnetoresistive element in the first direction, an interconnection formed in a position higher than the electrode layer, and extending in the first direction, and a first via which connects the first magnetoresistive element and the interconnection, and the electrode layer and the interconnection, by using one conductive layer.

    摘要翻译: 根据一个实施例,一种磁性随机存取存储器包括:第一栅电极和第二栅电极,其以第一方向以预定间距排列并且沿与第一方向垂直的第二方向延伸;第一磁阻元件,形成在一部分上方 在第一栅极电极和第二栅极电极之间形成电极层,该电极层形成在比第一磁阻元件高的位置,并且形成为距离第一磁阻元件在第一方向上的间距的一半,互连 形成在比电极层高的位置并且沿第一方向延伸的第一通孔和通过使用一个导电层连接第一磁阻元件和互连的第一通孔以及电极层和互连。