公开(公告)号：US08492676B2

公开(公告)日：2013-07-23

申请号：US10555451

申请日：2004-05-17

申请人： Masayuki Azuma ,  Yasuyuki Sakaya

发明人： Masayuki Azuma ,  Yasuyuki Sakaya

IPC分类号： B23K26/14

CPC分类号： B23K26/04 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/67092 ,  H01L21/67253

摘要： There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device. Thereby, when the laser light is made incident through the surface of the wafer and scanned, the position control of the condensing point of the laser light can be performed even at the periphery of the wafer, and a modified region by multi-photon absorption can be formed at a predetermined position inside the wafer.

摘要翻译： 提供了一种激光切割装置，包括：第一位置检测装置，其在激光入射点处检测晶片表面的位置; 第二位置检测装置预先检测晶片的表面的位置; 以及控制部，其控制晶片内的聚光点的厚度方向的位置，其中，所述控制部在从所述晶片的周围的外部到所述晶片的周围的内侧扫描所述激光时，进行控制 基于通过第二位置检测装置检测到晶片周围的聚光点的位置而获得的数据，并且在扫描预定距离之后，切换到基于由第一位置检测装置获得的数据进行控制。 因此，当激光通过晶片的表面入射并进行扫描时，即使在晶片的周围也可以执行激光的聚光点的位置控制，并且通过多光子吸收的改质区域 形成在晶片内部的预定位置。

公开(公告)号：US07410831B2

公开(公告)日：2008-08-12

申请号：US10555448

申请日：2004-04-30

申请人： Yasuyuki Sakaya ,  Masayuki Azuma

发明人： Yasuyuki Sakaya ,  Masayuki Azuma

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L21/78 ,  H01L21/46 ,  H01L21/301

CPC分类号： H01L21/67132 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052

摘要： In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.

摘要翻译： 在本发明的板状部件分割方法和装置中，通过在由硬脆材料形成的板状部件的表面上形成线状改质区域，或者在 该板状构件沿该改质区域分割板状构件。 分割板状构件的方法包括：带状粘贴步骤，其包括在板状构件的表面上粘贴带，改性区域形成步骤，其包括在板状构件的表面上形成改质区域， 板状构件的内部，以及扩展步骤，其包括在改性区域形成步骤之后通过向其施加张力来拉长带材。 在扩展步骤中，用紫外线照射胶带。 其结果是，可以积极制造具有良好的端面形状的超薄芯片，其中不会发生未切割部分，碎裂和断裂。

公开(公告)号：US20060124615A1

公开(公告)日：2006-06-15

申请号：US10555451

申请日：2004-05-17

申请人： Masayuki Azuma ,  Yasuyuki Sakaya

发明人： Masayuki Azuma ,  Yasuyuki Sakaya

IPC分类号： B23K26/38

CPC分类号： B23K26/04 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/67092 ,  H01L21/67253

摘要： There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device. Thereby, when the laser light is made incident through the surface of the wafer and scanned, the position control of the condensing point of the laser light can be performed even at the periphery of the wafer, and a modified region by multi-photon absorption can be formed at a predetermined position inside the wafer.

公开(公告)号：US07887665B2

公开(公告)日：2011-02-15

申请号：US10532815

申请日：2003-10-27

申请人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

发明人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

IPC分类号： B32B15/00

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L2221/68327 ,  H01L2221/68336

摘要： An adhesive sheet (S) is expanded by expanding means (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by expansion maintaining means (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W) after the dicing to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance to cause chipping or microcracks in the edges.

摘要翻译： 粘合片（S）通过扩张装置（20）膨胀，板状制品（W）在切割板状制品（W）之后安装到框架（F）上以增加单个芯片之间的间隔（T ），通过膨胀保持机构（10）保持粘合片（S）的膨胀状态，使得板状制品（W）能够与框架（F）一起以芯片之间的间隔 （T），从而防止相邻的切屑（T）在输送过程中相互干扰。 这样，切片后的板状物（W）与框架（F）一起被输送，相邻的切屑（T）的边缘在输送过程中通过振动而相互接触，从而引起切屑或微裂纹 边缘。

公开(公告)号：US07886798B2

公开(公告)日：2011-02-15

申请号：US11962319

申请日：2007-12-21

申请人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

发明人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

IPC分类号： B32B15/00

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T156/1702

摘要： An adhesive sheet (S) is expanded by an expanding mechanism (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by an expansion maintaining device (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W), after the dicing, to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance, thereby avoiding the causing of chipping or microcracks in the edges.

摘要翻译： 粘合片（S）通过扩张机构（20）膨胀，板状制品（W）在切割板状制品（W）之后安装到框架（F）上以增加单个芯片之间的间隔 T），通过膨胀维持装置（10）保持粘合片（S）的膨胀状态，使得板状制品（W）能够与框架（F）一起以 保持芯片（T），从而防止相邻的芯片（T）在传送期间相互干扰。 这样，在切割之后，板状物（W）能够与框架（F）一起被输送，相邻的切屑（T）的边缘在输送过程中通过振动而相互接触，从而避免了引起 在边缘处有碎裂或微裂纹。

公开(公告)号：US20060243710A1

公开(公告)日：2006-11-02

申请号：US10555452

申请日：2004-05-17

申请人： Masayuki Azuma ,  Yasuyuki Sakaya

发明人： Masayuki Azuma ,  Yasuyuki Sakaya

IPC分类号： B23K26/38 ,  B23K26/03

CPC分类号： H01L21/67253 ,  H01L21/67092 ,  H01L21/67132

摘要： There is provided a dicing apparatus comprising: a dicing section; an expanding section expanding spaces between individual chips which are diced by expanding a dicing sheet; and an inspection device confirming a diced and expanded state of a wafer. Thereby, the processing from the start of the dicing process to the end of the expanding process can be performed in a short period of time, and the dicing processing of subsequent wafer can be performed while the state of the diced wafer is confirmed.

摘要翻译： 提供了一种切割装置，包括：切割部分; 扩大部分，通过扩大切割片来扩大单个切片之间的空间; 以及确认晶片的切割和膨胀状态的检查装置。 由此，可以在短时间内进行从切割处理开始到扩展处理结束的处理，并且可以在确认切割晶片的状态的同时进行后续晶片的切割处理。

公开(公告)号：US20060211220A1

公开(公告)日：2006-09-21

申请号：US10555448

申请日：2004-04-30

申请人： Yasuyuki Sakaya ,  Masayuki Azuma

发明人： Yasuyuki Sakaya ,  Masayuki Azuma

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052

摘要： In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.

摘要翻译： 在本发明的板状部件的分割方法和装置中，通过在由硬脆材料形成的板状部件的表面上形成直线改性区域，或者在 该板状构件沿该改质区域分割板状构件。 分割板状构件的方法包括：带状粘贴步骤，其包括在板状构件的表面上粘贴带，改性区域形成步骤，其包括在板状构件的表面上形成改质区域， 板状构件的内部，以及扩展步骤，其包括在改性区域形成步骤之后通过向其施加张力来拉长带材。 在扩展步骤中，用紫外线照射胶带。 其结果是，可以积极制造具有良好的端面形状的超薄芯片，其中不会发生未切割部分，碎裂和断裂。

公开(公告)号：US06729215B2

公开(公告)日：2004-05-04

申请号：US09985568

申请日：2001-11-05

申请人： Osamu Nishina ,  Masami Takatori ,  Yasuyuki Sakaya

发明人： Osamu Nishina ,  Masami Takatori ,  Yasuyuki Sakaya

IPC分类号： G06K904

CPC分类号： H01L21/67092 ,  B27B31/06 ,  B28D5/0058 ,  B28D5/024 ,  H01L21/681 ,  Y10T83/148 ,  Y10T83/6563 ,  Y10T225/371

摘要： In the dicing machine, a parallel adjustment process between a cut-line of a blade and cut-line images displayed on a monitor can be easily performed. In the dicing machine, at least one of the first and second cut-line images displayed on the monitor is electronically moved by an image moving device so as to arrange the first and second cut-line images in the same straight line on the monitor. Thus, in the dicing machine of the present invention, the parallel adjustment can be easily performed as compared with the conventional dicing machine in which the parallel adjustment is mechanically performed by moving an imaging device.

摘要翻译： 在切割机中，可以容易地进行刀片切割线和显示在显示器上的切割线图像之间的平行调整处理。 在切割机中，通过图像移动装置电子地移动显示器上显示的第一和第二切割图像中的至少一个，以将第一和第二切割线图像布置在监视器上的同一条直线上。 因此，在本发明的切割机中，与通过移动成像装置机械地执行并行调整的常规切割机相比，可以容易地进行平行调整。

公开(公告)号：US20090035879A1

公开(公告)日：2009-02-05

申请号：US12088036

申请日：2006-09-26

申请人： Yasuyuki Sakaya

发明人： Yasuyuki Sakaya

IPC分类号： B23K26/02 ,  H01L21/302 ,  H01L21/66

CPC分类号： B23K26/03 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/78

摘要： An object is to provide a laser dicing apparatus and a laser dicing method capable of speedily performing high-quality dicing without causing any working defect even in a case where wafers varying in thickness are supplied. The laser dicing apparatus is provided with a measuring device which measures thickness of a wafer W, a recording device which stores a database in which modified region forming conditions associated with different thicknesses of the wafer W are described, and a control device which controls the laser dicing apparatus by automatically selecting, from the database, on the basis of the thickness of the wafer measured by the measuring device, the modified region forming conditions corresponding to the measured thickness of the wafer W. The optimum modified region forming conditions are thereby automatically set, so that even in a case where wafers W differing in thickness are supplied, high-quality dicing can be speedily performed without causing a working defect.

摘要翻译： 本发明的目的是提供一种激光切割装置和激光切割方法，即使在提供厚度变化的晶片的情况下，也能够快速地执行高质量切割而不引起任何工作缺陷。 激光切割装置设置有测量晶片W的厚度的测量装置，存储与描述晶片W的不同厚度相关联的改质区域形成条件的数据库的记录装置和控制激光器的控制装置 切割装置通过从数据库中基于由测量装置测量的晶片的厚度，自动选择与晶片W的测量厚度相对应的修改区域形成条件。由此自动设置最佳修改区域形成条件 ，因此即使在供给不同厚度的晶片W的情况下，也可以不造成工作缺陷而快速地进行高质量的切割。