公开(公告)号：US08492676B2

公开(公告)日：2013-07-23

申请号：US10555451

申请日：2004-05-17

申请人： Masayuki Azuma ,  Yasuyuki Sakaya

发明人： Masayuki Azuma ,  Yasuyuki Sakaya

IPC分类号： B23K26/14

CPC分类号： B23K26/04 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/67092 ,  H01L21/67253

摘要： There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device. Thereby, when the laser light is made incident through the surface of the wafer and scanned, the position control of the condensing point of the laser light can be performed even at the periphery of the wafer, and a modified region by multi-photon absorption can be formed at a predetermined position inside the wafer.

摘要翻译： 提供了一种激光切割装置，包括：第一位置检测装置，其在激光入射点处检测晶片表面的位置; 第二位置检测装置预先检测晶片的表面的位置; 以及控制部，其控制晶片内的聚光点的厚度方向的位置，其中，所述控制部在从所述晶片的周围的外部到所述晶片的周围的内侧扫描所述激光时，进行控制 基于通过第二位置检测装置检测到晶片周围的聚光点的位置而获得的数据，并且在扫描预定距离之后，切换到基于由第一位置检测装置获得的数据进行控制。 因此，当激光通过晶片的表面入射并进行扫描时，即使在晶片的周围也可以执行激光的聚光点的位置控制，并且通过多光子吸收的改质区域 形成在晶片内部的预定位置。

公开(公告)号：US20060124615A1

公开(公告)日：2006-06-15

申请号：US10555451

申请日：2004-05-17

申请人： Masayuki Azuma ,  Yasuyuki Sakaya

发明人： Masayuki Azuma ,  Yasuyuki Sakaya

IPC分类号： B23K26/38

CPC分类号： B23K26/04 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/67092 ,  H01L21/67253

摘要： There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device. Thereby, when the laser light is made incident through the surface of the wafer and scanned, the position control of the condensing point of the laser light can be performed even at the periphery of the wafer, and a modified region by multi-photon absorption can be formed at a predetermined position inside the wafer.

公开(公告)号：US07887665B2

公开(公告)日：2011-02-15

申请号：US10532815

申请日：2003-10-27

申请人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

发明人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

IPC分类号： B32B15/00

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L2221/68327 ,  H01L2221/68336

摘要： An adhesive sheet (S) is expanded by expanding means (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by expansion maintaining means (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W) after the dicing to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance to cause chipping or microcracks in the edges.

摘要翻译： 粘合片（S）通过扩张装置（20）膨胀，板状制品（W）在切割板状制品（W）之后安装到框架（F）上以增加单个芯片之间的间隔（T ），通过膨胀保持机构（10）保持粘合片（S）的膨胀状态，使得板状制品（W）能够与框架（F）一起以芯片之间的间隔 （T），从而防止相邻的切屑（T）在输送过程中相互干扰。 这样，切片后的板状物（W）与框架（F）一起被输送，相邻的切屑（T）的边缘在输送过程中通过振动而相互接触，从而引起切屑或微裂纹 边缘。

公开(公告)号：US07886798B2

公开(公告)日：2011-02-15

申请号：US11962319

申请日：2007-12-21

申请人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

发明人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

IPC分类号： B32B15/00

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T156/1702

摘要： An adhesive sheet (S) is expanded by an expanding mechanism (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by an expansion maintaining device (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W), after the dicing, to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance, thereby avoiding the causing of chipping or microcracks in the edges.

摘要翻译： 粘合片（S）通过扩张机构（20）膨胀，板状制品（W）在切割板状制品（W）之后安装到框架（F）上以增加单个芯片之间的间隔 T），通过膨胀维持装置（10）保持粘合片（S）的膨胀状态，使得板状制品（W）能够与框架（F）一起以 保持芯片（T），从而防止相邻的芯片（T）在传送期间相互干扰。 这样，在切割之后，板状物（W）能够与框架（F）一起被输送，相邻的切屑（T）的边缘在输送过程中通过振动而相互接触，从而避免了引起 在边缘处有碎裂或微裂纹。

公开(公告)号：US20060243710A1

公开(公告)日：2006-11-02

申请号：US10555452

申请日：2004-05-17

申请人： Masayuki Azuma ,  Yasuyuki Sakaya

发明人： Masayuki Azuma ,  Yasuyuki Sakaya

IPC分类号： B23K26/38 ,  B23K26/03

CPC分类号： H01L21/67253 ,  H01L21/67092 ,  H01L21/67132

摘要： There is provided a dicing apparatus comprising: a dicing section; an expanding section expanding spaces between individual chips which are diced by expanding a dicing sheet; and an inspection device confirming a diced and expanded state of a wafer. Thereby, the processing from the start of the dicing process to the end of the expanding process can be performed in a short period of time, and the dicing processing of subsequent wafer can be performed while the state of the diced wafer is confirmed.

摘要翻译： 提供了一种切割装置，包括：切割部分; 扩大部分，通过扩大切割片来扩大单个切片之间的空间; 以及确认晶片的切割和膨胀状态的检查装置。 由此，可以在短时间内进行从切割处理开始到扩展处理结束的处理，并且可以在确认切割晶片的状态的同时进行后续晶片的切割处理。

公开(公告)号：US20060211220A1

公开(公告)日：2006-09-21

申请号：US10555448

申请日：2004-04-30

申请人： Yasuyuki Sakaya ,  Masayuki Azuma

发明人： Yasuyuki Sakaya ,  Masayuki Azuma

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052

摘要： In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.

摘要翻译： 在本发明的板状部件的分割方法和装置中，通过在由硬脆材料形成的板状部件的表面上形成直线改性区域，或者在 该板状构件沿该改质区域分割板状构件。 分割板状构件的方法包括：带状粘贴步骤，其包括在板状构件的表面上粘贴带，改性区域形成步骤，其包括在板状构件的表面上形成改质区域， 板状构件的内部，以及扩展步骤，其包括在改性区域形成步骤之后通过向其施加张力来拉长带材。 在扩展步骤中，用紫外线照射胶带。 其结果是，可以积极制造具有良好的端面形状的超薄芯片，其中不会发生未切割部分，碎裂和断裂。

公开(公告)号：US07410831B2

公开(公告)日：2008-08-12

申请号：US10555448

申请日：2004-04-30

申请人： Yasuyuki Sakaya ,  Masayuki Azuma

发明人： Yasuyuki Sakaya ,  Masayuki Azuma

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L21/78 ,  H01L21/46 ,  H01L21/301

CPC分类号： H01L21/67132 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052

摘要： In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.

摘要翻译： 在本发明的板状部件分割方法和装置中，通过在由硬脆材料形成的板状部件的表面上形成线状改质区域，或者在 该板状构件沿该改质区域分割板状构件。 分割板状构件的方法包括：带状粘贴步骤，其包括在板状构件的表面上粘贴带，改性区域形成步骤，其包括在板状构件的表面上形成改质区域， 板状构件的内部，以及扩展步骤，其包括在改性区域形成步骤之后通过向其施加张力来拉长带材。 在扩展步骤中，用紫外线照射胶带。 其结果是，可以积极制造具有良好的端面形状的超薄芯片，其中不会发生未切割部分，碎裂和断裂。

公开(公告)号：US06743076B2

公开(公告)日：2004-06-01

申请号：US10143827

申请日：2002-05-14

申请人： Tadashi Adachi ,  Masayuki Azuma ,  Takayuki Kaneko

发明人： Tadashi Adachi ,  Masayuki Azuma ,  Takayuki Kaneko

IPC分类号： B24B4900

CPC分类号： B23D59/001 ,  B23D45/027 ,  B28D5/0076 ,  B28D5/024

摘要： The flange cover covering the blade is divided into two. The second cover is turnably connected to the first cover through a shaft parallel with the spindle of the blade, and the second cover is opened and closed in connection with vertical movement of the spindle. When the spindle is moved upward for replacing the blade, the second cover is automatically turned to the opening position, and L-shaped coolant jetting nozzles are moved away from positions below the blade to positions beside the blade. Thus, the blade can be easily replaced, and an automatic blade replacing system can be applied.

摘要翻译： 覆盖刀片的法兰盖分为两部分。 第二盖通过与叶片的主轴平行的轴可转动地连接到第一盖，并且第二盖与主轴的垂直运动相关地打开和关闭。 当主轴向上移动以更换刀片时，第二盖自动转到打开位置，并且L形冷却剂喷射喷嘴移动离开刀片下方的位置以位于刀片旁边。 因此，可以容易地更换刀片，并且可以应用自动刀片更换系统。

公开(公告)号：US06732612B2

公开(公告)日：2004-05-11

申请号：US09748242

申请日：2000-12-27

申请人： Tadashi Adachi ,  Masayuki Azuma

发明人： Tadashi Adachi ,  Masayuki Azuma

IPC分类号： B26D114

CPC分类号： B27B5/32 ,  B25B13/48 ,  B28D5/0058 ,  Y10T83/04 ,  Y10T83/7747 ,  Y10T83/9379 ,  Y10T83/9464

摘要： With a blade exchanging device, a cylindrical body is engaged with a nut that is fastened to a spindle, and at the same time the nut is held by fitting nails of a chuck member with grooves that are formed on the nut. Next, a torque wrench is inserted through the cylindrical body, and a polygonal head of the torque wrench is engaged with a polygonal hole formed in the head of the spindle. In this state, the spindle is rotated with the torque wrench in a direction to unfasten the nut from the spindle. The nut is thereby detached from the spindle. When the cylindrical body is disengaged from the spindle, the nut is prevented from falling off the cylindrical body, since the nails of the chuck hold the nut.

摘要翻译： 利用叶片更换装置，圆筒体与固定在心轴上的螺母啮合，同时通过将螺母固定在具有形成在螺母上的凹槽的卡盘构件的钉子上。 接下来，通过圆筒体插入扭矩扳手，并且扭矩扳手的多边形头部与形成在心轴的头部中的多边形孔接合。 在这种状态下，主轴与扭矩扳手一起旋转，使螺母从主轴松开。 因此螺母从主轴分离。 当圆柱体与心轴分离时，由于卡盘的指甲夹住螺母，所以可以防止螺母脱离圆柱体。

公开(公告)号：US6142138A

公开(公告)日：2000-11-07

申请号：US199198

申请日：1998-11-25

申请人： Masayuki Azuma ,  Hirofumi Shimoda

发明人： Masayuki Azuma ,  Hirofumi Shimoda

IPC分类号： H01L21/68 ,  B23D59/00 ,  B27B31/06 ,  B28D5/02 ,  H01L21/301 ,  B28D1/04

CPC分类号： B27B31/06 ,  B23D59/002 ,  B28D5/029 ,  Y10T83/6587 ,  Y10T83/7697

摘要： Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns at the first positions can match with a reference pattern at the first positions. Then, the two imaging equipment are moved to positions for imaging patterns at second positions at the outer circumference of the wafer to image the patterns at the second positions. The controller drives the drive mechanisms to align the wafer in such a way that current image patterns at the second positions can match with a reference pattern at the second positions.

摘要翻译： 两个成像设备设置在一对切割刀片单元处，并且两个成像设备图像图案同时在第一位置处于晶片中心附近。 控制器驱动驱动机构以使得第一位置处的当前图像图案与第一位置处的参考图案匹配的方式对齐晶片。 然后，将两个成像设备移动到用于在晶片的外周的第二位置处成像图案的位置，以在第二位置成像图案。 控制器驱动驱动机构以使得第二位置处的当前图像图案与第二位置处的参考图案匹配的方式对齐晶片。