摘要:
In one embodiment, a pattern formation method is disclosed. The method can place a liquid resin material on a workpiece substrate. The method can press a template against the resin material and measuring distance between a lower surface of a projection of the template and an upper surface of the workpiece substrate. The template includes a pattern formation region and a circumferential region around the pattern formation region. A pattern for circuit pattern formation is formed in the pattern formation region and the projection is formed in the circumferential region. The method can form a resin pattern by curing the resin material in a state of pressing the template. In addition, the method can separate the template from the resin pattern.
摘要:
In one embodiment, a pattern formation method is disclosed. The method can place a liquid resin material on a workpiece substrate. The method can press a template against the resin material and measuring distance between a lower surface of a projection of the template and an upper surface of the workpiece substrate. The template includes a pattern formation region and a circumferential region around the pattern formation region. A pattern for circuit pattern formation is formed in the pattern formation region and the projection is formed in the circumferential region. The method can form a resin pattern by curing the resin material in a state of pressing the template. In addition, the method can separate the template from the resin pattern.
摘要:
According to one embodiment, a method for manufacturing a photo mask, includes acquiring first data on respective shapes of a plurality of mask substrates, acquiring second data on respective shapes of a plurality of pellicles, and determining a combination of the mask substrate and the pellicle based on the first data and the second data.
摘要:
According to one embodiment, a method for manufacturing a photo mask, includes acquiring first data on respective shapes of a plurality of mask substrates, acquiring second data on respective shapes of a plurality of pellicles, and determining a combination of the mask substrate and the pellicle based on the first data and the second data.
摘要:
A defect probability calculating method includes assuming a plurality of process conditions containing process variations caused in a process of forming a pattern on a substrate based on a design pattern, acquiring appearance probabilities of the respective process conditions, performing process simulation to predict a pattern to be formed on a substrate based on the design pattern for each of the process conditions, determining whether the pattern predicted by performing the process simulation satisfies preset criteria for each of the process conditions, and acquiring first probability by adding together appearance probabilities of the process conditions used for process simulation of patterns which are determined not to satisfy the preset criteria.
摘要:
According to an aspect of the invention, there is provided a design data creating method of creating design data of a semiconductor device including extracting an AND region of an upper layer wiring pattern and a lower layer wiring pattern that sandwich a contact hole layer pattern included in a pattern layer, extracting the contact hole layer pattern included in the AND region, and moving the contact hole layer pattern in such a manner that the center of the AND region coincides with the center of the contact hole layer pattern.
摘要:
A semiconductor device production control method includes monitoring, after a production process of a semiconductor device, a process result at a predetermined position of a pattern to which the process is applied, to obtain a deviation with respect to a predetermined target result, quantitatively obtaining a degree of influence on an operation of a semiconductor device from the deviation of the process result, and comparing the degree of influence that is quantitatively obtained with a predetermined allowable margin for operation specifications of the semiconductor device.
摘要:
Disclosed is a method of producing a pattern for a semiconductor device, comprising extracting part of a pattern layout, perturbing a pattern included in the part of the pattern layout to generate a perturbation pattern, correcting the perturbation pattern, predicting a first pattern, to be formed on a wafer, from the corrected perturbation pattern, acquiring a first difference between the perturbation pattern and the first pattern, and storing information concerning the perturbation pattern including information concerning the first difference.
摘要:
A pattern data generation method of an aspect of the present invention, the method includes creating at least one modification guide to modify a modification target point contained in pattern data, evaluating the modification guides on the basis of an evaluation item, the evaluation item being a change in the shape of the pattern data for the modification target point caused by the modification based on the modification guides or a change in electric characteristics of a pattern formed in accordance with the pattern data, selecting a predetermined modification guide from among the modification guides on the basis of the evaluation result of the modification guides, and modifying the modification target point in accordance with the selected modification guide.
摘要:
A pattern data creating method according to an embodiment of the present invention comprises: extracting marginal error patterns using a first result obtained by applying process simulation to mask pattern data based on an evaluation target cell pattern, applying the process simulation to mask pattern data based on an evaluation target cell pattern with peripheral environment pattern created by arranging a peripheral environment pattern in the marginal error patterns such that a second result obtained by creating mask pattern data and applying the process simulation to the mask pattern data is more deteriorated than the first result, and correcting the evaluation target cell pattern or the mask pattern data based on the evaluation target cell pattern when there is a fatal error.