公开(公告)号：US20070037495A1

公开(公告)日：2007-02-15

申请号：US11504042

申请日：2006-08-15

申请人： Masayuki Matsubara ,  Satoshi Tateiwa ,  Shigekazu Kanai ,  Masaaki Yamamoto

发明人： Masayuki Matsubara ,  Satoshi Tateiwa ,  Shigekazu Kanai ,  Masaaki Yamamoto

IPC分类号： B24C3/00

CPC分类号： B24C9/006 ,  B24C1/045 ,  Y02P70/179

摘要： To provide an abrasive water jet cutting machine in which an abrasive recovery unit can be continuously used without needing maintenance, and an abrasive having a uniform grain size can be easily recovered, the machine has a catch tank for receiving a high-pressure abrasive mixture liquid jetted from a jet nozzle, and an abrasive recovery unit that recovers abrasive having a grain size in a reusable predetermined range from the abrasive mixture liquid transported from the catch tank, and transports abrasive mixture liquid including recovered abrasive into an abrasive-mixture-liquid retention tank; wherein the abrasive recovery unit has an abrasive sorting tank which flows the abrasive mixture liquid transported from the catch tank in an approximately horizontal direction, and sorts abrasive depending on grain size by using difference in sedimentation rate depending on grain size, and recovers the abrasive having the grain size in the reusable predetermined range.

摘要翻译： 为了提供一种磨料水射流切割机，其中可以连续使用磨料回收单元而不需要维护，并且可以容易地回收具有均匀粒度的磨料，该机器具有用于接收高压磨料混合液 从喷嘴喷射的磨料回收单元和从捕集罐输送的磨料混合液中回收粒度可重复使用的预定范围内的磨料的磨料回收单元，将含有回收研磨剂的磨料混合液输送到磨料混合液保持 坦克; 其中所述研磨回收单元具有研磨分选槽，所述研磨分选槽沿着大致水平的方向流动从所述捕集罐输送的所述磨料混合液，并且通过使用根据粒度的沉降速率的差异来根据粒度对磨料进行分选，并且回收具有 晶粒尺寸在可重​​复使用的预定范围内。

公开(公告)号：US20050252352A1

公开(公告)日：2005-11-17

申请号：US11116185

申请日：2005-04-28

申请人： Satoshi Tateiwa

发明人： Satoshi Tateiwa

IPC分类号： B24C5/04 ,  B24C1/04 ,  B24C7/00 ,  B26F3/00

CPC分类号： B26F3/004 ,  B24C1/045 ,  B24C7/0007 ,  Y10T83/364

摘要： A liquid jet machining apparatus comprising holding means for holding a workpiece, and liquid jet application means for applying a liquid jet to the workpiece held by the holding means. The liquid jet application means includes pipe means and nozzle means, and the nozzle means includes a nozzle pipe connected to the downstream end of the pipe means, and an orifice member connected to the downstream end of the nozzle pipe. The nozzles means is firmly fixed to a rigid support frame body. A downstream end portion of the pipe means is also firmly fixed to the rigid support frame body.

摘要翻译： 一种液体喷射加工装置，包括用于保持工件的保持装置和用于将液体射流施加到由保持装置保持的工件的液体喷射施加装置。 液体喷射施加装置包括管道装置和喷嘴装置，并且喷嘴装置包括连接到管道装置的下游端的喷嘴管和连接到喷嘴管的下游端的孔口构件。 喷嘴装置牢固地固定到刚性支撑框架体上。 管道装置的下游端部也牢固地固定到刚性支撑框架体上。

公开(公告)号：US20050196940A1

公开(公告)日：2005-09-08

申请号：US10999963

申请日：2004-12-01

申请人： Koichi Yajima ,  Satoshi Tateiwa ,  Kazuma Sekiya

发明人： Koichi Yajima ,  Satoshi Tateiwa ,  Kazuma Sekiya

IPC分类号： H01L21/00 ,  H01L21/301 ,  H01L21/46 ,  H01L21/78 ,  H05K3/00

CPC分类号： H01L21/67092 ,  H05K3/0044 ,  H05K3/0052

摘要： A water jet processing method for cutting a workpiece having a first group composed of first plural cutting lines extending in a predetermined direction and a second group composed of second plural cutting lines formed perpendicular to the plural cutting lines of the first group along the plural cutting lines of the first group and the plural cutting lines of the second group formed on the workpiece by injecting a water jet, which comprises a first cutting step for injecting a water jet to the cutting lines of the first group continuously and a second cutting step for injecting a water jet to the cutting lines of the second group continuously while the workpiece is supported by a support member.

摘要翻译： 一种用于切割具有第一组的工件的喷水处理方法，所述第一组由沿预定方向延伸的第一多个切割线组成，所述第二组沿着所述多个切割线垂直于所述第一组的多个切割线形成的第二多个切割线 和通过喷射水射流在工件上形成的多个切割线，其包括用于连续地向第一组的切割线喷射水射流的第一切割步骤和用于喷射的第二切割步骤 当工件被支撑构件支撑时，连续地向第二组的切割线进行水射流。

公开(公告)号：US06982211B2

公开(公告)日：2006-01-03

申请号：US10999963

申请日：2004-12-01

申请人： Koichi Yajima ,  Satoshi Tateiwa ,  Kazuma Sekiya

发明人： Koichi Yajima ,  Satoshi Tateiwa ,  Kazuma Sekiya

IPC分类号： H01L21/301

CPC分类号： H01L21/67092 ,  H05K3/0044 ,  H05K3/0052

摘要： A water jet processing method for cutting a workpiece having a first group composed of first plural cutting lines extending in a predetermined direction and a second group composed of second plural cutting lines formed perpendicular to the plural cutting lines of the first group along the plural cutting lines of the first group and the plural cutting lines of the second group formed on the workpiece by injecting a water jet, which comprises a first cutting step for injecting a water jet to the cutting lines of the first group continuously and a second cutting step for injecting a water jet to the cutting lines of the second group continuously while the workpiece is supported by a support member.

摘要翻译： 一种用于切割具有第一组的工件的喷水处理方法，所述第一组由沿预定方向延伸的第一多个切割线组成，所述第二组沿着所述多个切割线垂直于所述第一组的多个切割线形成的第二多个切割线 和通过喷射水射流在工件上形成的多个切割线，其包括用于连续地向第一组的切割线喷射水射流的第一切割步骤和用于喷射的第二切割步骤 当工件被支撑构件支撑时，连续地向第二组的切割线进行水射流。

公开(公告)号：US07052378B2

公开(公告)日：2006-05-30

申请号：US11071109

申请日：2005-03-04

申请人： Satoshi Tateiwa ,  Ken Kimura ,  Takayuki Umahashi

发明人： Satoshi Tateiwa ,  Ken Kimura ,  Takayuki Umahashi

IPC分类号： B24B55/12

CPC分类号： B24C9/00 ,  B24C7/0007 ,  B26F3/008 ,  Y10T83/364

摘要： A liquid jet machining apparatus including holding means for holding a workpiece, liquid jet application means for applying a liquid jet to the workpiece held by the holding means, and catching means for catching the liquid jet which has penetrated the workpiece. The catching means includes a tank for accommodating a liquid. At the bottom of the tank, a cushioning member is replaceably disposed, and an abrasive is accumulated. The liquid jet having penetrated the workpiece acts on the liquid accommodated in the tank, and then acts on the cushioning member and the abrasive. Wave suppressing means for suppressing generation of waves due to the liquid jet acting on the liquid accommodated within the tank is disposed in an upper portion of the tank.

摘要翻译： 一种液体喷射加工装置，包括用于保持工件的保持装置，用于将液体射流施加到由保持装置保持的工件上的液体喷射施加装置，以及用于捕获穿过工件的液体射流的捕获装置。 捕获装置包括用于容纳液体的罐。 在罐的底部，可替代地设置缓冲构件，并且研磨剂被积聚。 穿过工件的液体射流作用在容纳在容器中的液体上，然后作用在缓冲构件和磨料上。 用于抑制由于液体喷射作用在容纳在容器中的液体上的波形产生的波浪抑制装置设置在罐的上部。

公开(公告)号：US20050202764A1

公开(公告)日：2005-09-15

申请号：US11071109

申请日：2005-03-04

申请人： Satoshi Tateiwa ,  Ken Kimura ,  Takayuki Umahashi

发明人： Satoshi Tateiwa ,  Ken Kimura ,  Takayuki Umahashi

IPC分类号： B24C9/00

CPC分类号： B24C9/00 ,  B24C7/0007 ,  B26F3/008 ,  Y10T83/364

摘要： A liquid jet machining apparatus including holding means for holding a workpiece, liquid jet application means for applying a liquid jet to the workpiece held by the holding means, and catching means for catching the liquid jet which has penetrated the workpiece. The catching means includes a tank for accommodating a liquid. At the bottom of the tank, a cushioning member is replaceably disposed, and an abrasive is accumulated. The liquid jet having penetrated the workpiece acts on the liquid accommodated in the tank, and then acts on the cushioning member and the abrasive. Wave suppressing means for suppressing generation of waves due to the liquid jet acting on the liquid accommodated within the tank is disposed in an upper portion of the tank.

摘要翻译： 一种液体喷射加工装置，包括用于保持工件的保持装置，用于将液体射流施加到由保持装置保持的工件上的液体喷射施加装置，以及用于捕获穿过工件的液体射流的捕获装置。 捕获装置包括用于容纳液体的罐。 在罐的底部，可替代地设置缓冲构件，并且研磨剂被积聚。 穿过工件的液体射流作用在容纳在容器中的液体上，然后作用在缓冲构件和磨料上。 用于抑制由于液体喷射作用在容纳在容器中的液体上的波形产生的波浪抑制装置设置在罐的上部。

公开(公告)号：US06593170B2

公开(公告)日：2003-07-15

申请号：US09846294

申请日：2001-05-02

申请人： Satoshi Tateiwa ,  Mirei Toida

发明人： Satoshi Tateiwa ,  Mirei Toida

IPC分类号： H01L2144

CPC分类号： H01L21/6836 ,  B28D5/022 ,  H01L21/78 ,  H01L2221/68327

摘要： A method of dividing a semiconductor wafer of which the surface has a plurality of chips sectioned by streets, into individual chips, characterized in that it comprises a scribing step in which division guide lines are formed by drawing scribed lines along the streets on the surface of the semiconductor wafer, a tape sticking step in which a tape is stuck onto the surface having the division guide lines formed thereon, of the semiconductor wafer, and a back surface cutting step in which cutting grooves are formed in the back surface, to which the tape is stuck, of the semiconductor wafer such that a bit of uncut portions are left along the division guide lines.

摘要翻译： 将表面具有由街道划分的多个芯片的半导体晶片分割为单个芯片的方法，其特征在于，其包括划线步骤，其中通过沿着街道上的街道绘制划线来形成划分引导线 半导体晶片，将带粘贴到其上形成有分割导向线的表面上的胶带粘贴步骤，以及背面切割步骤，其中在后表面中形成有切割槽， 胶带被卡住，使得一部分未切割部分沿着分割引导线留下。