摘要:
In an electric power steering apparatus including capacitor for smoothing out the voltage of battery and relay including a relay contact disposed at a place upstream of the capacitor, a path is provided for directly conducting a terminal voltage of the capacitor from a downstream side of the relay contact to a system power supply supply that generates a source voltage for a control system including controller and the like, so that the system power supply and the control system that is supplied therefrom with electric power for control purpose are utilized as a discharge circuit. Thus is obtained a simplified configuration of circuit responsible for discharging the capacitor.
摘要:
In an electric power steering apparatus including a capacitor for smoothing out the voltage of a battery and a relay including a relay contact disposed at a place upstream of the capacitor, a path is provided for directly conducting a terminal voltage of the capacitor from a downstream side of the relay contact to a system power supply that generates a source voltage for a control system including a controller and the like, so that the system power supply and the control system that is supplied therefrom with electric power for control purpose are utilized as a discharge circuit. Thus is obtained a simplified configuration of circuit responsible for discharging the capacitor.
摘要:
A semiconductor device includes an interelectrode insulating film formed between a charge storage layer and a control electrode layer. The interelectrode insulating film is formed in a first region above an upper surface of an element isolation insulating film, a second region along a sidewall of the charge storage layer, and a third region above an upper surface of the charge storage layer. The interelectrode insulating film includes a first stack including a first silicon nitride film or a high dielectric constant film interposed between a first and a second silicon oxide film or a second stack including a second high dielectric constant film and a third silicon oxide film, and a second silicon nitride film formed between the control electrode layer and the first or the second stack. The second silicon nitride film is relatively thinner in the third region than in the first region.
摘要:
According to one embodiment, a nonvolatile semiconductor memory device includes a semiconductor region, a tunnel insulator provided above the semiconductor region, a charge storage insulator provided above the tunnel insulator, a block insulator provided above the charge storage insulator, a control gate electrode provided above the block insulator, and an interface region including a metal element, the interface region being provided at one interface selected from between the semiconductor region and the tunnel insulator, the tunnel insulator and the charge storage insulator, the charge storage insulator and the block insulator, and the block insulator and the control gate electrode.
摘要:
According to one embodiment, a method for manufacturing a semiconductor device includes: forming an underlayer film that contains atoms selected from the group consisting of aluminum, boron and alkaline earth metal; and forming a silicon oxide film on the underlayer film by a CVD method or an ALD method by use of a silicon source containing at least one of an ethoxy group, a halogen group, an alkyl group and an amino group, or a silicon source of a siloxane system.
摘要:
[Problem]An object of the present invention is to provide an image processing apparatus used for acquisition assistance of optimal low-resolution image set for super-resolution processing.[Means for solving the problem]The image processing apparatus of the present invention comprises a processing unit for computing displacement amounts between a basis image and each reference image, a processing unit for generating a plurality of deformed images based on the displacement amounts, the basis image and a plurality of reference images, a processing unit for setting a threshold of a parameter used at the time of image information selection, a processing unit for selecting image information used in the super-resolution processing from the reference image by using the threshold of the parameter, a processing unit for generating composed images and weighted images based on the basis image, the displacement amounts and the image information, a processing unit for generating high-resolution grid images by dividing the composed image by the weighted image, a processing unit for generating simplified interpolation images based on high-resolution grid images, a processing unit for generating assistance images, a display unit for displaying the assistance images, and a control unit that respectively controls a processing concerning the image input, a processing concerning the basis image selection, a processing concerning the reference image selection and a processing concerning the threshold setting of the parameter as necessary.
摘要:
A semiconductor device includes a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film, the second insulating film including a lower silicon nitride film, a lower silicon oxide film formed on the lower silicon nitride film, an intermediate insulating film formed on the lower silicon oxide film and containing a metal element, the intermediate insulating film having a relative dielectric constant of greater than 7, an upper silicon oxide film formed on the intermediate insulating film, and an upper silicon nitride film formed on the upper silicon oxide film.
摘要:
A protocol converting unit stores identification information for identifying a transfer path for data in a second network and a transmission source address specified in a packet in a corresponding manner. A failure detecting unit detects a transfer path in which a failure has occurred in the second network. A dummy-packet transmitting unit obtains a transmission source address corresponding to identification information of the transfer path in which the failure is detected, and transmits a dummy packet in which the obtained transmission source address is specified as the transmission source address to a first network.
摘要:
An object of the present invention is to provide a curable composition excellent in on-site formability, excellent in heat resistance, chemical resistance and oil resistance, and low in compression set. The invention relates to a curable composition comprising (a) a vinyl-based polymer containing at least one (meth)acryloyl group in a molecule thereof and having a number average molecular weight of 500 to 1,000,000, (b) an ethylenic unsaturated group-containing compound, (c) a thixotropic property-imparting agent, (d) fumed silica surface-treated with a (meth)acryloyl group-containing silane and (e) a photopolymerization initiator.
摘要:
A nonvolatile semiconductor memory device includes a first insulating layer, charge storage layers, element isolation insulating films, and a second insulating layer formed on the charge storage layers and the element isolation insulating films and including a stacked structure of a first silicon nitride film, first silicon oxide film, intermediate insulating film and second silicon oxide film. The first silicon nitride film has a nitrogen concentration of not less than 21×1015 atoms/cm2. Each element isolation insulating film includes a high-temperature oxide film formed along lower side surfaces of the charge storage layers between the charge storage layers and a coating type insulating film. The first silicon nitride film is formed on an upper surface of the high-temperature oxide film in upper surfaces of the element isolation insulating films and not on the upper surface of the coating type insulating film.
摘要翻译:非易失性半导体存储器件包括第一绝缘层,电荷存储层,元件隔离绝缘膜和形成在电荷存储层和元件隔离绝缘膜上的第二绝缘层,并且包括第一氮化硅膜的堆叠结构,第一 氧化硅膜,中间绝缘膜和第二氧化硅膜。 第一氮化硅膜的氮浓度不小于21×10 15原子/ cm 2。 每个元件隔离绝缘膜包括沿电荷存储层和涂层型绝缘膜之间的电荷存储层的下侧表面形成的高温氧化膜。 第一氮化硅膜形成在元件隔离绝缘膜的上表面的高温氧化膜的上表面上,而不是在涂层型绝缘膜的上表面上。