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公开(公告)号:US11163116B2
公开(公告)日:2021-11-02
申请号:US16804612
申请日:2020-02-28
发明人: Josue Lopez , Samuel Kim , Jamison Sloan , Boris Kharas , Jeffrey Scott Herd , Marin Soljacic , Cheryl Marie Sorace-Agaskar , Suraj Deepak Bramhavar , Steven Glenn Johnson , George Barbastathis
摘要: An integrated optical beam steering device includes a planar Luneburg lens that collimates beams from different inputs in different directions within the lens plane. It also includes a curved (e.g., semi-circular or arced) grating coupler that diffracts the collimated beams out of the lens plane. The beams can be steered in the plane by controlling the direction along which the lens is illuminated and out of the plane by varying the beam wavelength. Unlike other beam steering devices, this device can operate over an extremely wide field of view—up to 180°—without any aberrations off boresight. In other words, the beam quality is uniform in all directions, unlike with aplanatic lenses, thanks to the circular symmetry of the planar Luneburg lens, which may be composed of subwavelength features. The lens is also robust to misalignment and fabrication imperfections and can be made using standard CMOS processes.
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公开(公告)号:US11340400B2
公开(公告)日:2022-05-24
申请号:US16809640
申请日:2020-03-05
发明人: Boris Kharas , Reuel B. Swint , Cheryl Marie Sorace-Agaskar , Paul William Juodawlkis , Suraj Deepak Bramhavar , Jason Plant
摘要: Photonic integrated circuits (PICs) enable manipulation of light on a chip for telecommunications and information processing. They can be made with silicon and silicon-compatible materials using complementary metal-oxide-semiconductor (CMOS) fabrication techniques developed for making electronics. Unfortunately, most light sources are made with III-V and II-VI materials, which are not compatible with silicon CMOS fabrication techniques. As a result, the light source for a PIC is either off-chip or integrated onto the PIC after CMOS fabrication is over. Hybrid integration can be improved by forming a recess in the PIC to receive a III-V or II-VI photonic chip. Mechanical stops formed in or next to the recess during fabrication align the photonic chip vertically to the PIC. Fiducials on the PIC and the photonic chip enable sub-micron lateral alignment. As a result, the photonic chip can be flip-chip bonded to the PIC with sub-micron vertical and lateral alignment precision.
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公开(公告)号:US11579363B2
公开(公告)日:2023-02-14
申请号:US17496817
申请日:2021-10-08
发明人: Josue Lopez , Samuel Kim , Jamison Sloan , Boris Kharas , Jeffrey Scott Herd , Marin Soljacic , Cheryl Marie Sorace-Agaskar , Suraj Deepak Bramhavar , Steven Glenn Johnson , George Barbastathis
摘要: An integrated optical beam steering device includes a planar Luneburg lens that collimates beams from different inputs in different directions within the lens plane. It also includes a curved (e.g., semi-circular or arced) grating coupler that diffracts the collimated beams out of the lens plane. The beams can be steered in the plane by controlling the direction along which the lens is illuminated and out of the plane by varying the beam wavelength. Unlike other beam steering devices, this device can operate over an extremely wide field of view—up to 180°—without any aberrations off boresight. In other words, the beam quality is uniform in all directions, unlike with aplanatic lenses, thanks to the circular symmetry of the planar Luneburg lens, which may be composed of subwavelength features. The lens is also robust to misalignment and fabrication imperfections and can be made using standard CMOS processes.
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