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公开(公告)号：US11340400B2
公开(公告)日：2022-05-24
申请号：US16809640
申请日：2020-03-05
Applicant: Massachusetts Institute of Technology
Inventor： Boris Kharas , Reuel B. Swint , Cheryl Marie Sorace-Agaskar , Paul William Juodawlkis , Suraj Deepak Bramhavar , Jason Plant
Abstract: Photonic integrated circuits (PICs) enable manipulation of light on a chip for telecommunications and information processing. They can be made with silicon and silicon-compatible materials using complementary metal-oxide-semiconductor (CMOS) fabrication techniques developed for making electronics. Unfortunately, most light sources are made with III-V and II-VI materials, which are not compatible with silicon CMOS fabrication techniques. As a result, the light source for a PIC is either off-chip or integrated onto the PIC after CMOS fabrication is over. Hybrid integration can be improved by forming a recess in the PIC to receive a III-V or II-VI photonic chip. Mechanical stops formed in or next to the recess during fabrication align the photonic chip vertically to the PIC. Fiducials on the PIC and the photonic chip enable sub-micron lateral alignment. As a result, the photonic chip can be flip-chip bonded to the PIC with sub-micron vertical and lateral alignment precision.
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公开(公告)号：US10365670B2
公开(公告)日：2019-07-30
申请号：US15416498
申请日：2017-01-26
Applicant: Massachusetts Institute of Technology
Inventor： Reuel B. Swint , Gregory D. Allen , Todd A. Thorsen , Boris G. Kharas , Donna-Ruth Webb Yost
Abstract: Electrical and electromechanical devices often require maintaining a specific temperature, or a narrow range or temperatures, during operation. An assembly regulates the temperature of a device by providing a variable thermal resistance between the device and a heatsink. The device can be mounted to a base having a high thermal resistance, the base thermally isolating the device from the heatsink. At low environmental temperatures, the base enables the device to rise to its operating temperature as a result of the device's waste heat, and with no or minimal use of a heater. As the environmental temperature increases, a working fluid, having a low thermal resistance, undergoes thermal expansion to fill a portion of a volume in the base between the device and the heat sink, lowering the thermal resistance between the device and the heatsink to maintain the device at the required operating temperature.
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公开(公告)号：US20180095481A1
公开(公告)日：2018-04-05
申请号：US15416498
申请日：2017-01-26
Applicant: Massachusetts Institute of Technology
Inventor： Reuel B. Swint , Gregory D. Allen , Todd A. Thorsen , Boris G. Kharas , Donna-Ruth Webb Yost
CPC classification number: G05D23/01 , F28D15/00 , F28D21/00 , F28D2021/0029 , F28F13/00 , F28F2013/008 , G05D23/121 , H05K7/20254 , H05K7/205
Abstract: Electrical and electromechanical devices often require maintaining a specific temperature, or a narrow range or temperatures, during operation. An assembly regulates the temperature of a device by providing a variable thermal resistance between the device and a heatsink. The device can be mounted to a base having a high thermal resistance, the base thermally isolating the device from the heatsink. At low environmental temperatures, the base enables the device to rise to its operating temperature as a result of the device's waste heat, and with no or minimal use of a heater. As the environmental temperature increases, a working fluid, having a low thermal resistance, undergoes thermal expansion to fill a portion of a volume in the base between the device and the heat sink, lowering the thermal resistance between the device and the heatsink to maintain the device at the required operating temperature.
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