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公开(公告)号：US10828878B2
公开(公告)日：2020-11-10
申请号：US15908282
申请日：2018-02-28
Applicant: Massachusetts Institute of Technology
Inventor： Sanha Kim , Anastasios John Hart , Piran Ravichandran Kidambi , Dhanushkodi Durai Mariappan
IPC: B32B37/00 , B32B38/00 , B32B41/00 , B32B9/00 , B32B27/06 , H05K3/02 , H05K1/09 , B82Y10/00 , H01L29/16
Abstract: Systems, devices, and related methods are disclosed for electromechanical transfer printing of 2D materials disposed on one substrate to another. The printing device can be configured to transfer a 2D material from a source substrate to the target substrate by applying a combination of mechanical and electrostatic forces to facilitate electromechanical adhesion between the 2D material layer and the target substrate. Some embodiments of the printing device can effect direct transfer printing of a 2D material from a source substrate to a target substrate without the use of etchants and adhesives.
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2.发明申请公开(公告)号：US20180244027A1
公开(公告)日：2018-08-30
申请号：US15908282
申请日：2018-02-28
Applicant: Massachusetts Institute of Technology
Inventor： Sanha Kim , Anastasios John Hart , Piran Ravichandran Kidambi , Dhanushkodi Durai Mariappan
CPC classification number: B32B37/025 , B32B9/005 , B32B27/06 , B32B38/0008 , B32B41/00 , B32B2038/0052 , B32B2307/204 , B82Y10/00 , H01L29/1606 , H05K1/097 , H05K3/025 , H05K2203/0152
Abstract: Systems, devices, and related methods are disclosed for electromechanical transfer printing of 2D materials disposed on one substrate to another. The printing device can be configured to transfer a 2D material from a source substrate to the target substrate by applying a combination of mechanical and electrostatic forces to facilitate electromechanical adhesion between the 2D material layer and the target substrate. Some embodiments of the printing device can effect direct transfer printing of a 2D material from a source substrate to a target substrate without the use of etchants and adhesives.
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