Abstract:
A method of forming a multi-level component includes the step of forming at least one arrangement of micro trenches in a predetermined arrangement in a mask material by a lithography process. Another step involves applying one or more etching processes to a surface of a component upon which the mask is applied. The micro trenches have either first or second different aspect ratios. In the applying step, the component is etched by an aspect ratio dependent etch (ARDE) process so as to form an arrangement of micro trenches and micro pillars between adjacent micro trenches. Another step involves removing the arrangement of micro pillars from the component by a removal process. There is also a multi-level component made according to the above method with a first portion at a first level and a further portion of a further level different from the first level.
Abstract:
A method of forming a non-optically detectable identifiable marking invisible to the naked eye is formed from plural recesses of multiple levels at an outer surface of an article formed from a solid-state material. The method includes forming plural recesses of multiple levels within a predetermined region of a photoresist applied to an outer surface of an article formed from a solid-state material. The plural recesses are formed by grayscale lithography and the recesses extend at least partially through the photoresist and towards the outer surface of the article formed from a solid-state material. The method also includes applying an etching process such that at least a portion of the outer surface of said article is exposed and etched to form plural etched portions extending into the article from its outer surface and corresponding to plural recesses; wherein said predetermined region of said photoresist defines an identifiable marking to be applied to the outer surface of said article; wherein said plurality of etched portions forms the non-optically identifiable marking on the outer surface of said article.