公开(公告)号：US20140158420A1

公开(公告)日：2014-06-12

申请号：US14094272

申请日：2013-12-02

申请人： Eberhard HAISS ,  Martin ROJAHN ,  Matthias TAGLIEBER ,  Thomas SCHRIMPF ,  Matthias LUDWIG ,  Andreas BLUM

发明人： Eberhard HAISS ,  Martin ROJAHN ,  Matthias TAGLIEBER ,  Thomas SCHRIMPF ,  Matthias LUDWIG ,  Andreas BLUM

IPC分类号： H05K7/02 ,  H05K13/00

CPC分类号： H05K7/02 ,  G01C19/5783 ,  G01D11/245 ,  G01P1/023 ,  H05K13/00 ,  Y10T29/49117

摘要： An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.

摘要翻译： 一种电子部件，其具有模制部件壳体和嵌入在所述部件壳体中用于接触微型部件的导电插入部件，所述插入部分具有用于容纳所述微型部件的容纳区域，所述区域与所述微型部件间隔开， 用于将微组件与组件壳体的材料应力分离。 一种用于制造具有模制部件壳体的电子部件的方法，用于接触嵌入在所述部件壳体中的微型部件的导电插入部分，与所述微型部件间隔开的子区域，其将所述微型部件与材料应力 所述部件壳体在所述外壳材料的固化期间在用于将所述微型部件容纳在所述插入部件上的容纳区域中。

公开(公告)号：US20140338460A1

公开(公告)日：2014-11-20

申请号：US14281374

申请日：2014-05-19

申请人： Matthias LUDWIG ,  Martin ROJAHN

发明人： Matthias LUDWIG ,  Martin ROJAHN

IPC分类号： B81B7/00 ,  G01L9/00 ,  G01N33/00 ,  B81C1/00

CPC分类号： B81B7/0029 ,  B81B7/0061 ,  B81B2201/0264 ,  B81C1/00341 ,  B81C2203/0154 ,  G01L9/00 ,  G01L13/00 ,  G01L19/0007 ,  G01N33/00 ,  Y10T29/49826

摘要： A micromechanical component having a sensor chip is described, on and/or in which at least one sensor element is disposed, and a cladding, formed of an injection-molding material, encloses the sensor chip in such a way that at least one partial area of a surface of the sensor chip is covered in airtight fashion by the injection-molding material. At least one channel is formed in the injection-molding material, which takes a course, straight or not straight, from an outer surrounding area of the cladding toward the at least one sensor element of such a length that a change in shape and/or a change in chemical consistency of at least one part of the at least one sensor element is able to be brought about as a function of at least one physical property and/or at least one chemical partial composition of a medium present in the at least one channel.

摘要翻译： 描述了具有传感器芯片的微机械部件，其上设置有至少一个传感器元件和/或其中设置有至少一个传感器元件，并且由注射成型材料形成的包层以这样的方式包围传感器芯片，使得至少一个部分区域 通过注射成型材料以气密方式覆盖传感器芯片的表面。 在注射成型材料中形成至少一个通道，其从包层的外部周围区域朝向至少一个传感器元件采取直线或非直线的过程，其长度与形状和/或 可以使至少一个传感器元件的至少一部分的化学稠度的变化作为至少一种物理性能和/或至少一种传感器元件中存在的介质的至少一种化学部分组成的函数 渠道。