Rapid Thermal Processing System With Cooling System

    公开(公告)号:US20220059371A1

    公开(公告)日:2022-02-24

    申请号:US17405150

    申请日:2021-08-18

    IPC分类号: H01L21/67

    摘要: Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.

    Rapid Thermal Processing System With Cooling System

    公开(公告)号:US20220059363A1

    公开(公告)日:2022-02-24

    申请号:US17405142

    申请日:2021-08-18

    摘要: Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.

    Workpiece Support For A Thermal Processing System

    公开(公告)号:US20220205478A1

    公开(公告)日:2022-06-30

    申请号:US17550148

    申请日:2021-12-14

    IPC分类号: F16C17/03

    摘要: A workpiece support for a thermal processing system is provided. The workpiece support includes a rotor configured to support a workpiece. The workpiece support further includes a gas supply. The gas supply can include a plurality of bearing pads. Each of the bearing pads can be positioned closer to a periphery of the rotor than a center of the rotor. Each of the bearing define one or more passages configured to direct gas onto the rotor to control a position of the rotor along a first axis and a second axis that is substantially perpendicular to the first axis. Furthermore, one or more of the bearing pads define at least one additional passage configured to direct gas onto the rotor to control rotation of the rotor about the first axis.

    Fluid Leakage Detection for a Millisecond Anneal System

    公开(公告)号:US20170191897A1

    公开(公告)日:2017-07-06

    申请号:US15377217

    申请日:2016-12-13

    IPC分类号: G01M3/20 G01N33/00

    摘要: Systems and methods for detecting a fluid leak associated with fluid cooled components in a millisecond anneal system are provided. In one example implementation, a millisecond anneal system can include a processing chamber having one or more fluid cooled components. The system can include a gas flow system configured to provide for the flow of process gas in the processing chamber. The system can include a vapor sensor configured to measure vapor in process gas flowing through the gas flow system for detecting a fluid leak associated with the one or more fluid cooled components.

    Fluid leakage detection for a millisecond anneal system

    公开(公告)号:US10359334B2

    公开(公告)日:2019-07-23

    申请号:US15377217

    申请日:2016-12-13

    IPC分类号: G01M3/20 G01N33/00 H01L21/67

    摘要: Systems and methods for detecting a fluid leak associated with fluid cooled components in a millisecond anneal system are provided. In one example implementation, a millisecond anneal system can include a processing chamber having one or more fluid cooled components. The system can include a gas flow system configured to provide for the flow of process gas in the processing chamber. The system can include a vapor sensor configured to measure vapor in process gas flowing through the gas flow system for detecting a fluid leak associated with the one or more fluid cooled components.