-
公开(公告)号:US20220059371A1
公开(公告)日:2022-02-24
申请号:US17405150
申请日:2021-08-18
发明人: Manuel Sohn , Rolf Bremensdorfer , Silke Hamm , Dieter Hezler
IPC分类号: H01L21/67
摘要: Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.
-
公开(公告)号:US20220187021A1
公开(公告)日:2022-06-16
申请号:US17546497
申请日:2021-12-09
发明人: Manuel Sohn , Alex Wansidler , Dieter Hezler , Joseph Cibere , Rolf Bremensdorfer , Martin Zucker , Pete Lembesis , Michael Yang
摘要: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.
-
公开(公告)号:US20220059363A1
公开(公告)日:2022-02-24
申请号:US17405142
申请日:2021-08-18
发明人: Manuel Sohn , Rolf Bremensdorfer , Dieter Hezler
IPC分类号: H01L21/324 , H01L21/66 , H01L21/67
摘要: Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.
-
公开(公告)号:US20220205478A1
公开(公告)日:2022-06-30
申请号:US17550148
申请日:2021-12-14
发明人: Manuel Sohn , Rolf Bremensdorfer , Dieter Hezler
IPC分类号: F16C17/03
摘要: A workpiece support for a thermal processing system is provided. The workpiece support includes a rotor configured to support a workpiece. The workpiece support further includes a gas supply. The gas supply can include a plurality of bearing pads. Each of the bearing pads can be positioned closer to a periphery of the rotor than a center of the rotor. Each of the bearing define one or more passages configured to direct gas onto the rotor to control a position of the rotor along a first axis and a second axis that is substantially perpendicular to the first axis. Furthermore, one or more of the bearing pads define at least one additional passage configured to direct gas onto the rotor to control rotation of the rotor about the first axis.
-
公开(公告)号:US20220189747A1
公开(公告)日:2022-06-16
申请号:US17242383
申请日:2021-04-28
发明人: Dixit Desai , Alex Wansidler , Dieter Hezler , Joseph Cibere , Rolf Bremensdorfer , Pete Lembesis , Michael Yang
IPC分类号: H01J37/32
摘要: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.
-
公开(公告)号:US20220189737A1
公开(公告)日:2022-06-16
申请号:US17238597
申请日:2021-04-23
发明人: Dieter Hezler , Keli Huang , Jianmin Ji , Deqiang Zeng , Manuel Sohn
摘要: A processing apparatus for processing a workpiece is presented. The processing apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. One or more radiative heat sources configured to heat the workpiece disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. The processing apparatus includes a rotation system configured to rotate the workpiece, the rotation system comprising a magnetic actuator.
-
公开(公告)号:US20220165561A1
公开(公告)日:2022-05-26
申请号:US17533593
申请日:2021-11-23
发明人: Michael X. Yang , Rolf Bremensdorfer , Dave Camm , Joseph Cibere , Dieter Hezler , Shawming Ma , Yun Yang
IPC分类号: H01J61/86 , H01J61/28 , H05H1/48 , H01J61/073 , H01J61/52
摘要: Apparatus, systems, and methods for processing workpieces are provided. An arc lamp can include a tube. The arc lamp can include one or more inlets configured to receive water to be circulated through the arc lamp during operation as a water wall, the water wall configured to cool the arc lamp. The arc lamp can include a plurality of electrodes configured to generate a plasma in a forming gas introduced into the arc lamp via the one or more inlets. The forming gas can be or can include a mixture of a hydrogen gas and an inert gas, the hydrogen gas in the mixture having a concentration less than 4% by volume. The hydrogen gas can be introduced into the arc lamp prior to generating the plasma. The arc lamp may be used for processing workpieces.
-
公开(公告)号:US20170191897A1
公开(公告)日:2017-07-06
申请号:US15377217
申请日:2016-12-13
发明人: Manuel Mueller , Dieter Hezler
CPC分类号: G01M3/20 , G01N33/0036 , H01L21/6719 , H01L21/67288
摘要: Systems and methods for detecting a fluid leak associated with fluid cooled components in a millisecond anneal system are provided. In one example implementation, a millisecond anneal system can include a processing chamber having one or more fluid cooled components. The system can include a gas flow system configured to provide for the flow of process gas in the processing chamber. The system can include a vapor sensor configured to measure vapor in process gas flowing through the gas flow system for detecting a fluid leak associated with the one or more fluid cooled components.
-
公开(公告)号:US10359334B2
公开(公告)日:2019-07-23
申请号:US15377217
申请日:2016-12-13
发明人: Manuel Mueller , Dieter Hezler
摘要: Systems and methods for detecting a fluid leak associated with fluid cooled components in a millisecond anneal system are provided. In one example implementation, a millisecond anneal system can include a processing chamber having one or more fluid cooled components. The system can include a gas flow system configured to provide for the flow of process gas in the processing chamber. The system can include a vapor sensor configured to measure vapor in process gas flowing through the gas flow system for detecting a fluid leak associated with the one or more fluid cooled components.
-
-
-
-
-
-
-
-