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公开(公告)号：US20170285085A1
公开(公告)日：2017-10-05
申请号：US15595769
申请日：2017-05-15
Applicant: Maury Microwave, Inc.
Inventor： Ali Boudiaf , Roman Meierer , Gary R. Simpson
CPC classification number: G01R31/02 , G01R1/00 , G01R27/28 , G01R35/00 , H01L2221/00 , H03H1/00 , H03H7/38 , H03H7/40 , H03H11/28 , H04B2201/00
Abstract: A solid state impedance tuner or impedance tuner system including a housing structure and at least two solid state tuner modules electrically combined and disposed in one package within the housing structure. Each tuner module includes at least one solid state control element.Another embodiment is directed to an impedance tuner module card configured in a standardized system architecture. The card includes a chassis board, and at least one solid state tuner module integrated on the card and supported on or by the chassis board, each module including at least one solid state control element.Methods for calibrating a solid state impedance tuner that includes at least two solid state tuner modules combined in one package are disclosed.
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公开(公告)号：US20140354294A1
公开(公告)日：2014-12-04
申请号：US14284862
申请日：2014-05-22
Applicant: Maury Microwave, Inc.
Inventor： Ali Boudiaf , Roman Meierer , Gary R. Simpson
CPC classification number: G01R31/02 , G01R1/00 , G01R27/28 , G01R35/00 , H01L2221/00 , H03H1/00 , H03H7/38 , H03H7/40 , H03H11/28 , H04B2201/00
Abstract: A solid state impedance tuner or impedance tuner system including a housing structure and at least two solid state tuner modules electrically combined and disposed in one package within the housing structure. Each tuner module includes at least one solid state control element.Another embodiment is directed to an impedance tuner module card configured in a standardized system architecture. The card includes a chassis board, and at least one solid state tuner module integrated on the card and supported on or by the chassis board, each module including at least one solid state control element.Methods for calibrating a solid state impedance tuner that includes at least two solid state tuner modules combined in one package are disclosed.
Abstract translation: 一种固态阻抗调谐器或阻抗调谐器系统，其包括壳体结构和至少两个固态调谐器模块，电气组合并设置在壳体结构内的一个封装中。 每个调谐器模块包括至少一个固态控制元件。 另一实施例涉及以标准化系统架构配置的阻抗调谐器模块卡。 该卡包括一个底板，以及至少一个固态调谐器模块，集成在卡上并由底板支撑或由底板支撑，每个模块包括至少一个固态控制元件。 公开了一种用于校准包括组合在一个封装中的至少两个固态调谐器模块的固态阻抗调谐器的方法。
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公开(公告)号：US09660607B2
公开(公告)日：2017-05-23
申请号：US14284862
申请日：2014-05-22
Applicant: Maury Microwave, Inc.
Inventor： Ali Boudiaf , Roman Meierer , Gary R. Simpson
CPC classification number: G01R31/02 , G01R1/00 , G01R27/28 , G01R35/00 , H01L2221/00 , H03H1/00 , H03H7/38 , H03H7/40 , H03H11/28 , H04B2201/00
Abstract: A solid state impedance tuner or impedance tuner system includes a control element array with a plurality of solid state control elements configured to be turned on simultaneously to achieve a desired impedance state. The control element array comprises N solid state control elements arranged along an RF transmission line. A controller selectively turns on or off each control element by application of a control signal to vary an impedance presented by the control element array, Another aspect is an impedance tuner module card configured in a standardized system architecture, with a chassis board, and at least one solid state tuner module integrated on the card A chassis electrical connector connected to the tuner module is configured for connection to a corresponding backplane connector. Methods for calibrating a solid state impedance tuner that includes at least two solid state tuner modules combined in one package are disclosed.
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公开(公告)号：US09964580B2
公开(公告)日：2018-05-08
申请号：US15595769
申请日：2017-05-15
Applicant: Maury Microwave, Inc.
Inventor： Ali Boudiaf , Roman Meierer , Gary R. Simpson
CPC classification number: G01R31/02 , G01R1/00 , G01R27/28 , G01R35/00 , H01L2221/00 , H03H1/00 , H03H7/38 , H03H7/40 , H03H11/28 , H04B2201/00
Abstract: A solid state impedance tuner or impedance tuner system including a housing structure and at least two solid state tuner modules electrically combined and disposed in one package within the housing structure. Each tuner module includes at least one solid state control element.Another embodiment is directed to an impedance tuner module card configured in a standardized system architecture. The card includes a chassis board, and at least one solid state tuner module integrated on the card and supported on or by the chassis board, each module including at least one solid state control element.Methods for calibrating a solid state impedance tuner that includes at least two solid state tuner modules combined in one package are disclosed.
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