公开(公告)号：US20190204381A1

公开(公告)日：2019-07-04

申请号：US16296052

申请日：2019-03-07

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto PAGANI

IPC: G01R31/28 ,  C12Q1/00 ,  H01L21/66 ,  G01R1/067

CPC classification number: G01R31/2891 ,  B06B2201/00 ,  C12Q1/00 ,  C12Q2304/00 ,  C12Q2326/00 ,  G01N1/00 ,  G01R1/06794 ,  G01R11/00 ,  G01R31/2884 ,  H01L21/00 ,  H01L22/34 ,  H01L2221/00 ,  H01L2924/00

Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.

公开(公告)号：US10082535B2

公开(公告)日：2018-09-25

申请号：US15008868

申请日：2016-01-28

Applicant: Ridgetop Group, Inc.

Inventor： Esko O. Mikkola ,  Hans A. R. Manhaeve

IPC: G01R31/00 ,  G01R31/28 ,  H01L21/66 ,  H01L21/00 ,  G01R1/00

CPC classification number: G01R31/2818 ,  G01R1/00 ,  G01R31/2884 ,  H01L21/00 ,  H01L22/34 ,  H01L2221/00

Abstract: A test structure includes a dedicated addressing circuit that allows large numbers of test devices to be tested simultaneously and the measurement signals read out serially for different test devices. The test structure may be configured for wafer, die or package-level testing. The test structure may be integrated on a common die with the test devices in a single package, provided on separate die in a common package, separately packaged chips or in the form of a collection of standard die configured as the test structure. If on separate die, the test and addressing circuitry is fabricated from a more mature fabrication process than that being characterized for the devices under test. The processes being characterized may be unqualified whereas the test circuitry may be fabricated with different and more mature or qualified processes.

公开(公告)号：US09970960B2

公开(公告)日：2018-05-15

申请号：US15439967

申请日：2017-02-23

Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.

Inventor： Chih-Peng Hsieh

IPC: G01R31/00 ,  G01R1/067 ,  G01R31/28 ,  G01N1/00

CPC classification number: G01R1/06794 ,  G01N1/00 ,  G01N2201/00 ,  G01R1/06722 ,  G01R1/44 ,  G01R31/2831 ,  H01L2221/00

Abstract: A probe having a sliding rail is provided and includes a probe head, a probe tail, an elastic element made of an elastic material and connected between the probe head and the probe tail, and a sliding rail assembly. The sliding rail assembly includes a slide rail and a position limit protrusion. The slide rail has a fixed end and a free end. The fixed end is fixedly connected to the probe tail, and the free end extends to the probe head. The position limit protrusion is fixedly connected to the probe head, and has a sliding slot formed thereon through which the slide rail can pass. The sliding rail assembly is made of a conductive material, and a cross-section area of the slide rail is greater than a cross-section area of the elastic material of the elastic element.

公开(公告)号：US20180113168A1

公开(公告)日：2018-04-26

申请号：US15848996

申请日：2017-12-20

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01R31/28

CPC classification number: G01R31/2891 ,  B06B2201/00 ,  C12Q1/00 ,  C12Q2304/00 ,  C12Q2326/00 ,  G01N1/00 ,  G01R1/06794 ,  G01R11/00 ,  G01R31/2884 ,  H01L21/00 ,  H01L22/34 ,  H01L2221/00 ,  H01L2924/00

Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.

公开(公告)号：US09891265B2

公开(公告)日：2018-02-13

申请号：US14035016

申请日：2013-09-24

Applicant: FUJITSU LIMITED

Inventor： Tatsuya Hirose

IPC: G01R15/00 ,  G01R31/26 ,  G01R1/067 ,  H01L21/00

CPC classification number: G01R31/2621 ,  G01R1/06766 ,  H01L21/00 ,  H01L2221/00 ,  H01L2223/00

Abstract: A voltage detection circuit includes: a transistor; a switch coupled to a drain terminal of the transistor; the drain terminal is coupled to an one end of the switch; a first driver that controls the switch in synchronization with a second driver that drives a gate terminal of the transistor; and a plurality of resistors coupled in series and coupled to an another end of the switch.

公开(公告)号：US20170285085A1

公开(公告)日：2017-10-05

申请号：US15595769

申请日：2017-05-15

Applicant: Maury Microwave, Inc.

Inventor： Ali Boudiaf ,  Roman Meierer ,  Gary R. Simpson

IPC: G01R31/02 ,  H03H11/28

CPC classification number: G01R31/02 ,  G01R1/00 ,  G01R27/28 ,  G01R35/00 ,  H01L2221/00 ,  H03H1/00 ,  H03H7/38 ,  H03H7/40 ,  H03H11/28 ,  H04B2201/00

Abstract: A solid state impedance tuner or impedance tuner system including a housing structure and at least two solid state tuner modules electrically combined and disposed in one package within the housing structure. Each tuner module includes at least one solid state control element.Another embodiment is directed to an impedance tuner module card configured in a standardized system architecture. The card includes a chassis board, and at least one solid state tuner module integrated on the card and supported on or by the chassis board, each module including at least one solid state control element.Methods for calibrating a solid state impedance tuner that includes at least two solid state tuner modules combined in one package are disclosed.

公开(公告)号：US09763335B2

公开(公告)日：2017-09-12

申请号：US14389480

申请日：2012-04-10

Applicant: Hiromitsu Oka ,  Tetsuo Hayashi

Inventor： Hiromitsu Oka ,  Tetsuo Hayashi

IPC: B23K1/00 ,  B23K1/20 ,  B23K3/00 ,  H05K3/34 ,  B23K3/06 ,  H01L21/50

CPC classification number: H05K3/3484 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0623 ,  B23K3/0638 ,  H01L21/50 ,  H01L2221/00 ,  H01L2224/7901 ,  H01L2224/81011 ,  H01L2924/0002 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/0425

Abstract: A working machine for a board including a working device that selectively performs work for mounting conductive balls on a circuit board by a ball holder and work for transferring viscous fluid onto the circuit board by transfer pins, and a tray in which the viscous fluid is stored, when the conductive balls are to be mounted on the circuit board, the viscous fluid being transferred onto the circuit board by the transfer pins and the conductive balls having been immersed in the viscous fluid are mounted on the transferred viscous fluid. Accordingly, the conductive balls can be fixed onto the circuit board by the viscous fluid, which is transferred onto the circuit board by the transfer pins, and the viscous fluid that adheres to the conductive balls due to the immersion of the conductive balls in the viscous fluid.

公开(公告)号：US09746531B2

公开(公告)日：2017-08-29

申请号：US15058807

申请日：2016-03-02

Applicant: SII Semiconductor Corporation

Inventor： Masao Iriguchi

IPC: G01R33/06 ,  G01R33/00 ,  G01R33/07 ,  H01L21/00

CPC classification number: G01R33/0029 ,  G01R33/0088 ,  G01R33/0094 ,  G01R33/07 ,  G01R33/075 ,  G06F2101/00 ,  H01L21/00 ,  H01L2221/00

Abstract: To provide a magnetic sensor circuit which does not output spike-like voltage errors to a signal processing circuit. A magnetic sensor circuit is provided which is configured so as to output an output signal to a signal processing circuit through a plurality of hall elements driven by a first switch circuit and a second switch circuit controlled by a second control circuit and in which the first switch circuit controls timings at which spikes occur in the output signal of each of the hall elements in such a manner that the timings are not the same, and the second switch circuit selects and outputs an output signal having a period of a timing free of the occurrence of a spike.

公开(公告)号：US20170219632A1

公开(公告)日：2017-08-03

申请号：US15329648

申请日：2015-07-20

Applicant: LEM INTELLECTUAL PROPERTY SA

Inventor： Wolfram TEPPAN ,  Davide AZZONI

IPC: G01R15/18 ,  G01R33/04

CPC classification number: G01R15/185 ,  G01R1/00 ,  G01R19/0092 ,  G01R33/0023 ,  G01R33/04 ,  H01F38/30 ,  H01F38/32 ,  H01F2038/305 ,  H01L2221/00 ,  H02P1/00

Abstract: Electrical current transducer (2) of a closed-loop type for measuring a primary current (Ip) flowing in a primary conductor (1), comprising a fluxgate measuring head (7) and an electronic circuit (16) including a microprocessor (18) for digital signal processing. The measuring head includes a secondary coil (6) and a fluxgate detector (4) comprising an excitation coil and a magnetic material core. The electronic circuit comprises an excitation coil drive circuit (14) configured to generate an alternating excitation voltage to supply the excitation coil with an alternating excitation current (Ifx), the secondary coil (6) connected in a feedback loop (12) of the electronic circuit to the excitation coil drive circuit (14), the electronic circuit further comprising a ripple compensation circuit (26, 28) configured to compensate for a ripple signal generated by the alternating excitation voltage.

公开(公告)号：US20170212164A1

公开(公告)日：2017-07-27

申请号：US15006977

申请日：2016-01-26

Applicant: Teradyne, Inc.

Inventor： Michael A. Caradonna ,  Daniel A. Derringer ,  Stephen R. Wilkinson

IPC: G01R31/28 ,  G01R1/04 ,  G01R1/44 ,  G01R1/073

CPC classification number: G01R31/31905 ,  G01R31/2874 ,  G01R31/2889 ,  G01R31/31926 ,  G06F1/00 ,  H01L21/00 ,  H01L2221/00

Abstract: A tester interface unit comprising a test hardware module. The test hardware module may have a simple construction, relying on control and/or signal processing in one or more tester instruments to generate or analyze test signals for a device under test. The test hardware module may be disposed within the tester interface unit, providing a short and high integrity signal path length to the device under test. The tester interface unit may include a purge gas chamber and a cooling chamber, with the hardware module penetrate a separator between those chambers, sealing an opening between the purge gas chamber and the cooling chamber. A heat spreader may move heat generated on the portion of the test hardware module in the purge gas chamber to the cooling chamber.