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1.
公开(公告)号:US20240359211A1
公开(公告)日:2024-10-31
申请号:US18768186
申请日:2024-07-10
Applicant: McMaster University
Inventor: Leyla Soleymani , Roderick Maclachlan , Sara Moetakef Imani , Yuting Chan , Tohid Didar
CPC classification number: B05D5/083 , B05D3/0254 , B05D3/066 , B05D2506/10 , B05D2518/10
Abstract: This application relates to omniphobic materials which are physically and chemically modified at their surface to create hierarchically structured materials with both nanoscale and microscale structures that provide the omniphobic properties. Methods of making such omniphobic surfaces with hierarchical structures and uses thereof, including as flexible films that repel contaminants are also disclosed in the application.
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公开(公告)号:US20220323993A1
公开(公告)日:2022-10-13
申请号:US17616374
申请日:2020-06-03
Applicant: McMaster University
Inventor: Leyla Soleymani , Roderick Maclachlan , Sara Moetakef Imani , Yuting Chan , Tohid Didar
Abstract: This application relates to omniphobic materials which are physically and chemically modified at their surface to create hierarchically structured materials with both nanoscale and microscale structures that provide the omniphobic properties. Methods of making such omniphobic surfaces with hierarchical structures and uses thereof, including as flexible films that repel contaminants are also disclosed in the application.
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公开(公告)号:US12109586B2
公开(公告)日:2024-10-08
申请号:US17616374
申请日:2020-06-03
Applicant: McMaster University
Inventor: Leyla Soleymani , Roderick Maclachlan , Sara Moetakef Imani , Yuting Chan , Tohid Didar
CPC classification number: B05D5/083 , B05D3/0254 , B05D3/066 , B05D2506/10 , B05D2518/10
Abstract: This application relates to omniphobic materials which are physically and chemically modified at their surface to create hierarchically structured materials with both nanoscale and microscale structures that provide the omniphobic properties. Methods of making such omniphobic surfaces with hierarchical structures and uses thereof, including as flexible films that repel contaminants are also disclosed in the application.
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