公开(公告)号：US20160204053A1

公开(公告)日：2016-07-14

申请号：US14861423

申请日：2015-09-22

Applicant: MediaTek Inc.

Inventor： Tung-Hsien HSIEH ,  Yi-Hui LEE

IPC: H01L23/495 ,  H05K1/02

CPC classification number: H01L23/49503 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49558 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/1421 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0215 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention provides a semiconductor package. The semiconductor package includes a lead frame including a die peddle. A supporting bar connects to the die peddle, extending in an outward direction from the die peddle. At least two power leads are separated from the die peddle and the supporting bar, having first terminals close to the die peddle and second terminals extending outward from the die peddle. A power bar connects to the at least two power leads, having a supporting portion. A molding material encapsulates the lead frame leaving the supporting portion exposed.

Abstract translation: 本发明提供一种半导体封装。 半导体封装包括包括模具的引线框架。 支撑杆连接到模具，从模具向外延伸。 至少两个电源引线与模具和支撑杆分离，支撑杆具有靠近模具的第一端子，并且从模具踏板向外延伸的第二端子。 电源杆连接到具有支撑部分的至少两个电源引线。 成型材料封装引线框架，使支撑部分露出。