公开(公告)号：US11342267B2

公开(公告)日：2022-05-24

申请号：US16661219

申请日：2019-10-23

Applicant: MEDIATEK INC.

Inventor： Po-Hao Chang ,  Yi-Jou Lin ,  Hung-Chuan Chen

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.

公开(公告)号：US20160218092A1

公开(公告)日：2016-07-28

申请号：US14920883

申请日：2015-10-23

Applicant: Mediatek Inc.

Inventor： Po-Hao Chang ,  Chun-Wei Chang ,  Ching-Chih Li

IPC: H01L25/16 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31 ,  H01L23/528

CPC classification number: H01L25/16 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/50 ,  H01L23/528 ,  H01L23/5383 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/19104 ,  H01L2924/19105

Abstract: A chip package includes a first die encapsulated by a molding compound; a board comprising a chip mounting surface; a redistributed layer (RDL) structure on an active surface of the first die and between the die and the chip mounting surface; and a discrete passive device embedded in the molding compound and situated in close proximity to a side edge of the first die.

Abstract translation: 芯片封装包括由模塑料封装的第一模具; 包括芯片安装表面的板; 在所述第一管芯的有效表面上以及所述管芯和所述芯片安装表面之间的再分布层（RDL）结构; 以及嵌入在模制化合物中且位于第一模具的侧边缘附近的分立无源器件。