公开(公告)号：US20240130045A1

公开(公告)日：2024-04-18

申请号：US18479920

申请日：2023-10-03

申请人： Medimaging Integrated Solution, Inc.

发明人： SHANGYI WU ,  YI-HAN HUANG ,  JIA-DE ZHOU

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28

CPC分类号： H05K1/18 ,  H05K1/0274 ,  H05K3/0044 ,  H05K3/28 ,  G02B23/2484 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10734 ,  H05K2203/0228

摘要： The invention provides a light-emitting image sensing module and a method for fabricating the same. The light-emitting image sensing module includes a circuit board, an image sensor, conductive carriers, light sources, an opaque lens barrel, and a lens module. The image sensor and the conductive carriers are arranged on the circuit board. The light sources are arranged on the conductive carrier. The opaque lens barrel is penetrated by a first hole and a second hole and arranged on the circuit board. The first hole sleeves the image sensor, and the second hole sleeves the conductive carriers and the light sources. The lens module is fixed in the first hole and arranged above the image sensor. The invention uses the circuit board to carry out the packaging process of the image sensor and the light source, so as to achieve the economic benefit.