公开(公告)号：US20210249393A1

公开(公告)日：2021-08-12

申请号：US17097714

申请日：2020-11-13

申请人： Medimaging Integrated Solution, Inc.

发明人： SHANGYI WU ,  MINGCHE HSIEH

IPC分类号： H01L25/16 ,  H05K1/14 ,  H04N5/225 ,  A61B1/00 ,  A61B1/06

摘要： An image sensor package includes a substrate, an image sensor, a light-emitting element, and a package body. The substrate includes a plurality of first conductive contacts and a plurality of second conductive contacts. The image sensor is disposed on the substrate and electrically connected to the corresponding first conductive contacts. The light-emitting element is close to the image sensor, disposed on the substrate and electrically connected to the corresponding first conductive contacts. The package body is filled between the image sensor and the light emitting element. The above-mentioned image sensor package can achieve miniaturization, provide uniform illumination, and increase light utilization efficiency. An endoscope including the above-mentioned image sensor package is also disclosed.

公开(公告)号：US20240130045A1

公开(公告)日：2024-04-18

申请号：US18479920

申请日：2023-10-03

申请人： Medimaging Integrated Solution, Inc.

发明人： SHANGYI WU ,  YI-HAN HUANG ,  JIA-DE ZHOU

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28

CPC分类号： H05K1/18 ,  H05K1/0274 ,  H05K3/0044 ,  H05K3/28 ,  G02B23/2484 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10734 ,  H05K2203/0228

摘要： The invention provides a light-emitting image sensing module and a method for fabricating the same. The light-emitting image sensing module includes a circuit board, an image sensor, conductive carriers, light sources, an opaque lens barrel, and a lens module. The image sensor and the conductive carriers are arranged on the circuit board. The light sources are arranged on the conductive carrier. The opaque lens barrel is penetrated by a first hole and a second hole and arranged on the circuit board. The first hole sleeves the image sensor, and the second hole sleeves the conductive carriers and the light sources. The lens module is fixed in the first hole and arranged above the image sensor. The invention uses the circuit board to carry out the packaging process of the image sensor and the light source, so as to achieve the economic benefit.

公开(公告)号：US20230327054A1

公开(公告)日：2023-10-12

申请号：US17984542

申请日：2022-11-10

申请人： Medimaging Integrated Solution, Inc.

发明人： SHANGYI WU ,  JIA-DE ZHOU

IPC分类号： H01L33/48

CPC分类号： H01L33/48 ,  H01L33/50

摘要： A method for manufacturing an image sensor package is provided, in which a plurality of trenches is provided in the package substrate and the trenches and a plurality of predetermined dicing lines define the desired contour of the package substrate to maximize the space utilization of the image sensor package in the distal end of the endoscope. In addition, the contour of the package substrate matches the shape of the distal end of the endoscope, thus facilitating the positioning and assembly of the image sensor package. An image sensor package manufactured by the abovementioned manufacturing method and an endoscope including the image sensor package are also disclosed.

公开(公告)号：US20240065532A1

公开(公告)日：2024-02-29

申请号：US18330098

申请日：2023-06-06

申请人： Medimaging Integrated Solution, Inc.

发明人： SHANGYI WU ,  JIA-DE ZHOU

IPC分类号： A61B1/00 ,  A61B1/04 ,  A61B1/06

CPC分类号： A61B1/0011 ,  A61B1/00114 ,  A61B1/04 ,  A61B1/06

摘要： An endoscopic light source image module comprises a substrate, an image sensor, an illumination module and a single-use mold. The image sensor, the illumination module and the single-use mold are disposed on the substrate. The illumination module includes a carrier disposed on the substrate and a light source disposed on the carrier, wherein the carrier is used to determine the height of the light source. The single-use mold has a first through-hole, a second through-hole and a runner, wherein the first through-hole accommodates the image sensor; the second through-hole accommodates the illumination module; the runner interconnects the first through-hole and the second through-hole. The single-use mold is made of an opaque material, which can prevent the light of the illumination module from affecting the image sensor.

公开(公告)号：US20230308738A1

公开(公告)日：2023-09-28

申请号：US18124201

申请日：2023-03-21

申请人： Medimaging Integrated Solution, Inc.

发明人： SHANGYI WU ,  JIA-DE ZHOU ,  CHIH LUNG HSU ,  JIUNWEI CHEN

IPC分类号： H04N23/56 ,  H04N23/52 ,  H04N23/50 ,  A61B1/06 ,  A61B1/00 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/173 ,  H01L23/34 ,  H01L23/60

CPC分类号： H04N23/56 ,  H04N23/52 ,  H04N23/555 ,  A61B1/0684 ,  A61B1/00097 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/173 ,  H01L23/34 ,  H01L23/60

摘要： An image sensor package includes a substrate, an image sensor, and at least one light-emitting element. The substrate has a plurality of electric-conduction contacts. The image sensor is arranged on the substrate and electrically connected with the substrate. The light-emitting element includes a spacer and a light-emitting diode. The spacer has a plurality of electric-conduction contacts. The light emitting diode is arranged on the spacer and electrically connected with the spacer. The spacer is arranged on the substrate and electrically connected with the substrate. The spacer has a predetermined thickness, so that the height of a light input surface of the image sensor is larger than or equal to the height of a light output surface of the light-emitting diode. The above-mentioned image sensor package favors optimization of illumination. An endoscope including the above-mentioned image sensor package is also disclosed.