LESION CHARACTERIZATION PROCESSES

    公开(公告)号:US20220175268A1

    公开(公告)日:2022-06-09

    申请号:US17540548

    申请日:2021-12-02

    Abstract: A lesion characterization process is disclosed. According to one aspect, a method includes obtaining measurements of at least one of an impedance magnitude, impedance phase, a temperature, and electrical properties of tissue of the lesion. The method further includes determining at least one lesion property including at least one of a depth of the lesion, percent transmurality of the lesion, lesion surface area and lesion volume based on at least one of the obtained measurements.

Patent Agency Ranking