公开(公告)号：US08750961B1

公开(公告)日：2014-06-10

申请号：US13788310

申请日：2013-03-07

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Mark E. Henschel ,  Lawrence C. McClure ,  Mark S. Ricotta ,  Lejun Wang

IPC: A61B5/055 ,  A61B5/05 ,  A61N1/08

CPC classification number: A61N1/3718 ,  A61B5/055 ,  A61N1/086

Abstract: The present invention provides a packaging technique and apparatus that incorporates a flexible substrate package with a three-axis magnetic sensor for three-axis sensing in an implantable medical device. The apparatus includes three single-axis magnetic sensor integrated circuits (ICs) that are mounted to a substrate and encapsulated with a polymer mold compound. The substrate is excised around each of the sensor ICs to form panels that are folded to align the three single-axis sensors in the x, y and z axis.

Abstract translation: 本发明提供一种封装技术和装置，其包括柔性衬底封装与用于可植入医疗装置中的三轴感测的三轴磁传感器。 该装置包括三个单轴磁传感器集成电路（IC），其安装到基板上并用聚合物模具化合物封装。 在每个传感器IC周围切除衬底，以形成折叠以将x，y和z轴上的三个单轴传感器对准的面板。