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    Systems for encapsulating a hybrid assembly of electronic components and associated methods
    2.
    发明授权
    Systems for encapsulating a hybrid assembly of electronic components and associated methods 有权

    公开(公告)号：US10201094B2

    公开(公告)日：2019-02-05

    申请号：US14561248

    申请日：2014-12-05

    Applicant: Medtronic, Inc.

    Inventor： Chunho Kim ,  Songhua Shi ,  Mark S. Ricotta ,  Scott B. Sleeper ,  Yongqian Wang

    IPC: H05K3/28 ,  B29C45/14

    Abstract: During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.

    IMPLANTABLE MEDICAL DEVICE INCLUDING A MOLDED PLANAR TRANSFORMER
    3.
    发明申请
    IMPLANTABLE MEDICAL DEVICE INCLUDING A MOLDED PLANAR TRANSFORMER 有权
    可塑性医疗设备，包括模制的平面变压器

    公开(公告)号：US20140277223A1

    公开(公告)日：2014-09-18

    申请号：US13798698

    申请日：2013-03-13

    Applicant: MEDTRONIC, INC.

    Inventor： Mark R. Boone ,  Mohsen Askarinya ,  Mark S. Ricotta ,  Lejun Wang

    IPC: A61N1/39 ,  H01F41/00

    CPC classification number: H01F41/005 ,  A61N1/3981 ,  B23P17/04 ,  H01F7/06 ,  H01F27/022 ,  H01F27/24 ,  H01F27/266 ,  H01F2027/2819 ,  Y10T29/49073 ,  Y10T29/49075

    Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components, an upper core bonded on a first exterior surface of the substrate, and a lower core bonded on a second exterior surface opposed to the first side of the substrate. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the transformer includes encapsulant material that is dispensed over and between the components of the transformer to seal air gaps.

    Abstract translation: 本公开提供了与用于装置的平面变压器相关联的方法和技术。 平面变压器包括承载电子部件的基板，接合在基板的第一外部表面上的上部芯部和与基板的第一面相对的第二外部表面上的下部芯部。 电子部件包括与变压器相关联的初级绕组和次级绕组。 在一些实施例中，变压器包括在变压器的部件之间和之间分配以密封空气间隙的密封剂材料。

    Implantable medical device having a multi-axis magnetic sensor
    7.
    发明授权
    Implantable medical device having a multi-axis magnetic sensor 有权
    具有多轴磁性传感器的植入式医疗装置

    公开(公告)号：US08750961B1

    公开(公告)日：2014-06-10

    申请号：US13788310

    申请日：2013-03-07

    Applicant: Medtronic, Inc.

    Inventor： Andrew J. Ries ,  Mark E. Henschel ,  Lawrence C. McClure ,  Mark S. Ricotta ,  Lejun Wang

    IPC: A61B5/055 ,  A61B5/05 ,  A61N1/08

    CPC classification number: A61N1/3718 ,  A61B5/055 ,  A61N1/086

    Abstract: The present invention provides a packaging technique and apparatus that incorporates a flexible substrate package with a three-axis magnetic sensor for three-axis sensing in an implantable medical device. The apparatus includes three single-axis magnetic sensor integrated circuits (ICs) that are mounted to a substrate and encapsulated with a polymer mold compound. The substrate is excised around each of the sensor ICs to form panels that are folded to align the three single-axis sensors in the x, y and z axis.

    Abstract translation: 本发明提供一种封装技术和装置，其包括柔性衬底封装与用于可植入医疗装置中的三轴感测的三轴磁传感器。 该装置包括三个单轴磁传感器集成电路（IC），其安装到基板上并用聚合物模具化合物封装。 在每个传感器IC周围切除衬底，以形成折叠以将x，y和z轴上的三个单轴传感器对准的面板。

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